Equipment List: Difference between revisions
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* [[CHA Industries Mark 40: Electron Beam Evaporator | Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator]] | * [[CHA Industries Mark 40: Electron Beam Evaporator | Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator]] | ||
* [[Leica EM ACE600: Carbon Evaporator | Carbon: Leica EM ACE600 Carbon Evaporator]] | * [[Leica EM ACE600: Carbon Evaporator | Carbon: Leica EM ACE600 Carbon Evaporator]] | ||
===== Sputtering ===== | ===== Sputtering ===== | ||
* [[ATC Orion 8: Dielectric Sputterer | Dielectric Sputterer: AJA International ATC Orion 8]] | * [[ATC Orion 8: Dielectric Sputterer | Dielectric Sputterer: AJA International ATC Orion 8]] | ||
* [[ATC Orion 8: Chalcogenide Sputterer | Chalcogenide Sputterer: AJA International ATC Orion 8]] | * [[ATC Orion 8: Chalcogenide Sputterer | Chalcogenide Sputterer: AJA International ATC Orion 8]] | ||
===== Chemical Vapor Deposition (CVD) ===== | ===== Chemical Vapor Deposition (CVD) ===== | ||
* [[Oxford FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]] | * [[Oxford FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]] | ||
* [[Oxford 100: Plasma-Enhanced Chemical Vapor Deposition (PECVD) | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]] | * [[Oxford 100: Plasma-Enhanced Chemical Vapor Deposition (PECVD) | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]] | ||
===== Dielectric Packaging / Moisture Barrier ===== | ===== Dielectric Packaging / Moisture Barrier ===== | ||
* [[Para Tech LabTop 3000: Parylene Coater | Parylene Coater: Para Tech LabTop 3000]] | * [[Para Tech LabTop 3000: Parylene Coater | Parylene Coater: Para Tech LabTop 3000]] | ||
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* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]] | * [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]] | ||
* [[XeF2 Etcher for Silicon | XeF<sub>2</sub> Etcher for Silicon]] | * [[XeF2 Etcher for Silicon | XeF<sub>2</sub> Etcher for Silicon]] | ||
===== Wet Etching ===== | ===== Wet Etching ===== | ||
* [[Wet Chemistry Techniques | Available Wet Chemistry Techniques]] | * [[Wet Chemistry Techniques | Available Wet Chemistry Techniques]] | ||
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* [[ORION NanoFab: Helium, Neon & Gallium FIB | Helium, Neon & Gallium FIB: Zeiss ORION NanoFab]] | * [[ORION NanoFab: Helium, Neon & Gallium FIB | Helium, Neon & Gallium FIB: Zeiss ORION NanoFab]] | ||
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]] | * [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]] | ||
===== Scanning Electron Microscopes (SEMs) ===== | ===== Scanning Electron Microscopes (SEMs) ===== | ||
* [[Nova 200 NanoLab: SEM, EDS & WDS | SEM, EDS & WDS: Thermo Fisher Nova 200 NanoLab]] | * [[Nova 200 NanoLab: SEM, EDS & WDS | SEM, EDS & WDS: Thermo Fisher Nova 200 NanoLab]] | ||
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* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]] | * [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]] | ||
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]] | * [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]] | ||
===== Transmission Electron Microscopes (TEMs) ===== | ===== Transmission Electron Microscopes (TEMs) ===== | ||
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | TEM, STEM, EDS & HAADF: Thermo Fisher Tecnai TF-30 (80-300 kV)]] | * [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | TEM, STEM, EDS & HAADF: Thermo Fisher Tecnai TF-30 (80-300 kV)]] | ||
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | TEM, STEM, EDS, EELS, EFTEM & Lithography: Thermo Fisher Tecnai TF-20 (80-200 kV)]] | * [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | TEM, STEM, EDS, EELS, EFTEM & Lithography: Thermo Fisher Tecnai TF-20 (80-200 kV)]] | ||
===== Scanning Probe Microscopes ===== | ===== Scanning Probe Microscopes ===== | ||
* [[Dimension ICON: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension ICON]] | * [[Dimension ICON: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension ICON]] | ||
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* [[Suss MicroTec SB6L: Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]] | * [[Suss MicroTec SB6L: Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]] | ||
* [[TA 915B: Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]] | * [[TA 915B: Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]] | ||
===== Device Processing ===== | ===== Device Processing ===== | ||
* [[Westbond 7476D-79: Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]] | * [[Westbond 7476D-79: Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]] | ||
* [[Cascade Microtech M150: Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]] | * [[Cascade Microtech M150: Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]] | ||
Revision as of 23:49, 27 April 2019
Lithography
Electron Beam Lithography
- Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)
- Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)
- Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)
- Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 kV)
Ion Beam Lithography
Optical Lithography
- Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6
- i-Line Wafer Stepper: GCA model 6300
- Direct-Write Laser System: Heidelberg Instruments DWL-66
- Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT
Deposition
Evaporation
- Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator
- Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator
- Carbon: Leica EM ACE600 Carbon Evaporator
Sputtering
- Dielectric Sputterer: AJA International ATC Orion 8
- Chalcogenide Sputterer: AJA International ATC Orion 8
Chemical Vapor Deposition (CVD)
- Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II
- Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100
Dielectric Packaging / Moisture Barrier
Etching
Dry Etching
- Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP–RIE
- III/V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP–RIE
- Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP–RIE
- Silicon, III/V Material & Organics Etcher: Plasmatherm Dual Chamber RIE
- Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE
- XeF2 Etcher for Silicon
Wet Etching
Microscopy
Focused Ion Beam (FIB) Systems
- Helium, Neon & Gallium FIB: Zeiss ORION NanoFab
- SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab
Scanning Electron Microscopes (SEMs)
- SEM, EDS & WDS: Thermo Fisher Nova 200 NanoLab
- SEM & EDS: Thermo Fisher Sirion
- SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F
- SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab
Transmission Electron Microscopes (TEMs)
- TEM, STEM, EDS & HAADF: Thermo Fisher Tecnai TF-30 (80-300 kV)
- TEM, STEM, EDS, EELS, EFTEM & Lithography: Thermo Fisher Tecnai TF-20 (80-200 kV)
Scanning Probe Microscopes
Optical Characterization
- Spectroscopic Ellipsometry: Woolam M-2000
- Light Microscope: Olympus BX51M with Filmetrics model F40
- Fluorescence Microscope: Olympus IX81
Support Tools
Thermal Processing
- Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)
- Rapid Thermal Processing: Modular Process Technology RTP-600S
- Rapid Thermal Annealer: Jipelec Jetfirst 150
Substrate Processing
- Scriber-Breaker: Dynatex GST-150
- Wafer Bonder: Suss MicroTec model SB6L
- Critical Point Dryer: Tousimis Automegasamdri 915B