Equipment List: Difference between revisions
Jump to navigation
Jump to search
No edit summary |
|||
| Line 1: | Line 1: | ||
= Lithography = | == Lithography == | ||
===== Electron Beam Lithography ===== | ===== Electron Beam Lithography ===== | ||
* [[EBPG 5200: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)]] | * [[EBPG 5200: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)]] | ||
| Line 14: | Line 14: | ||
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]] | * [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]] | ||
= Deposition = | == Deposition == | ||
===== Evaporation ===== | ===== Evaporation ===== | ||
* [[KJL Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]] | * [[KJL Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]] | ||
| Line 31: | Line 31: | ||
* [[Para Tech LabTop 3000: Parylene Coater | Parylene Coater: Para Tech LabTop 3000]] | * [[Para Tech LabTop 3000: Parylene Coater | Parylene Coater: Para Tech LabTop 3000]] | ||
= Etching = | == Etching == | ||
===== Dry Etching ===== | ===== Dry Etching ===== | ||
* [[Oxford 100 DRIE: Bosch & Cryo ICP–RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP–RIE]] | * [[Oxford 100 DRIE: Bosch & Cryo ICP–RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP–RIE]] | ||
| Line 43: | Line 43: | ||
* [[Wet Chemistry Techniques | Available Wet Chemistry Techniques]] | * [[Wet Chemistry Techniques | Available Wet Chemistry Techniques]] | ||
= Microscopy = | == Microscopy == | ||
===== Focused Ion Beam (FIB) Systems ===== | ===== Focused Ion Beam (FIB) Systems ===== | ||
* [[ORION NanoFab: Helium, Neon & Gallium FIB | Helium, Neon & Gallium FIB: Zeiss ORION NanoFab]] | * [[ORION NanoFab: Helium, Neon & Gallium FIB | Helium, Neon & Gallium FIB: Zeiss ORION NanoFab]] | ||
* [[ | * [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]] | ||
===== Scanning Electron Microscopes (SEMs) ===== | ===== Scanning Electron Microscopes (SEMs) ===== | ||
| Line 52: | Line 52: | ||
* [[Sirion: SEM & EDS | SEM & EDS: Thermo Fisher Sirion]] | * [[Sirion: SEM & EDS | SEM & EDS: Thermo Fisher Sirion]] | ||
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]] | * [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]] | ||
* [[ | * [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]] | ||
===== Transmission Electron Microscopes (TEMs) ===== | ===== Transmission Electron Microscopes (TEMs) ===== | ||
| Line 66: | Line 66: | ||
* [[Olympus IX81: Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]] | * [[Olympus IX81: Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]] | ||
= Support Tools = | == Support Tools == | ||
===== Thermal Processing ===== | ===== Thermal Processing ===== | ||
* [[Tystar Tytan 1 & 2: Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]] | * [[Tystar Tytan 1 & 2: Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]] | ||
Revision as of 22:16, 27 April 2019
Lithography
Electron Beam Lithography
- Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)
- Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)
- Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)
- Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 kV)
Ion Beam Lithography
Optical Lithography
- Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6
- i-Line Wafer Stepper: GCA model 6300
- Direct-Write Laser System: Heidelberg Instruments DWL-66
- Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT
Deposition
Evaporation
- Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator
- Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator
- Carbon: Leica EM ACE600 Carbon Evaporator
Sputtering
- Dielectric Sputterer: AJA International ATC Orion 8
- Chalcogenide Sputterer: AJA International ATC Orion 8
Chemical Vapor Deposition (CVD)
- Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II
- Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100
Dielectric Packaging / Moisture Barrier
Etching
Dry Etching
- Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP–RIE
- III/V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP–RIE
- Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP–RIE
- Silicon, III/V Material & Organics Etcher: Plasmatherm Dual Chamber RIE
- Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE
- XeF2 Etcher for Silicon
Wet Etching
Microscopy
Focused Ion Beam (FIB) Systems
- Helium, Neon & Gallium FIB: Zeiss ORION NanoFab
- SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab
Scanning Electron Microscopes (SEMs)
- SEM, EDS & WDS: Thermo Fisher Nova 200 NanoLab
- SEM & EDS: Thermo Fisher Sirion
- SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F
- SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab
Transmission Electron Microscopes (TEMs)
- TEM, STEM, EDS & HAADF: Thermo Fisher Tecnai TF-30 (80-300 kV)
- TEM, STEM, EDS, EELS, EFTEM & Lithography: Thermo Fisher Tecnai TF-20 (80-200 kV)
Scanning Probe Microscopes
Optical Characterization
- Spectroscopic Ellipsometry: Woolam M-2000
- Light Microscope: Olympus BX51M with Filmetrics model F40
- Fluorescence Microscope: Olympus IX81
Support Tools
Thermal Processing
- Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)
- Rapid Thermal Processing: Modular Process Technology RTP-600S
- Rapid Thermal Annealer: Jipelec Jetfirst 150
Substrate Processing
- Scriber-Breaker: Dynatex GST-150
- Wafer Bonder: Suss MicroTec model SB6L
- Critical Point Dryer: Tousimis Automegasamdri 915B