Revision as of 21:48, 25 March 2019

Lithography

Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II
Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100 PECVD
Tube Furnaces: Tystar Tytan (Wet & Dry Oxidation and Annealing)

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-This page will contain a list of all equipment located in the lab.
+=Lithography=
+===== Electron Beam Lithography =====
+* Raith EBPG 5000+ (100 kV)
+* Raith EBPG 5200 (100 kV)
+* Quanta 200F SEM with NPGS (1-30 kV)
+===== Ion Beam Lithography =====
+* Zeiss ORION NanoFab (5-40 kV He & Ne, 1-30 kV Ga)
+===== Photolithography =====
+* Contact Mask Aligners: Suss Microtech models MA/BA6 & MA6/BA6
+* i-Line Wafer Stepper: GCA model 6300
+* Direct-Write Laser System: Heidelberg Instruments DWL-66
+* Two-Photon Lithography (3D printing): Nanoscribe Photonic Professional GT
+= Deposition Equipment =
+===== Evaporation =====
+* Kurt J Lesker Labline (Al, Au, Pt, Ti)
+* CHA Industries Mark 40 (Metals & Oxides)
+* Leica EM ACE600 Carbon Evaporator
+===== Sputtering =====
+* Dielectric Sputterer: AJA International ATC Orion 8
+* Chalcogenide Sputterer: AJA International ATC Orion 5
+===== Plasma- & Thermal-Enhanced Deposition =====
+* Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II
+* Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100 PECVD
+* Tube Furnaces: Tystar Tytan (Wet & Dry Oxidation and Annealing)