Equipment List: Difference between revisions
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* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]] | * [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]] | ||
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 kV)]] | * [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 kV)]] | ||
===== Ion Beam Lithography ===== | ===== Ion Beam Lithography ===== | ||
* [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)]] | * [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)]] | ||
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* [[CHA Industries Mark 40: Electron Beam Evaporator | Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator]] | * [[CHA Industries Mark 40: Electron Beam Evaporator | Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator]] | ||
* [[Carbon Evaporator | Carbon: Leica EM ACE600 Carbon Evaporator]] | * [[Carbon Evaporator | Carbon: Leica EM ACE600 Carbon Evaporator]] | ||
===== Sputtering ===== | ===== Sputtering ===== | ||
* [[ATC Orion 8: Dielectric Sputterer | Dielectric Sputterer: AJA International ATC Orion 8]] | * [[ATC Orion 8: Dielectric Sputterer | Dielectric Sputterer: AJA International ATC Orion 8]] | ||
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* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]] | * [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]] | ||
* [[XeF2 Etcher for Silicon | XeF<sub>2</sub> Etcher for Silicon]] | * [[XeF2 Etcher for Silicon | XeF<sub>2</sub> Etcher for Silicon]] | ||
===== Wet Etching ===== | ===== Wet Etching ===== | ||
* [[Wet Chemistry | Available Wet | * [[Wet Chemistry | Available Wet Etching Techniques]] | ||
== Microscopy == | == Microscopy == | ||
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* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]] | * [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]] | ||
* [[Veeco Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]] | * [[Veeco Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]] | ||
===== Optical Characterization ===== | ===== Optical Characterization ===== | ||
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]] | * [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]] | ||
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]] | * [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]] | ||
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]] | * [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]] | ||
===== Sample Preparation for Microscopy ===== | ===== Sample Preparation for Microscopy ===== | ||
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]] | * [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]] | ||
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]] | * [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]] | ||
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]] | * [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]] | ||
== Wet Chemistry == | |||
* [[Wet Chemistry | Wet Chemistry Processes & Information]] | |||
* [[Lab Safety Data Sheets | Lab Safety Data Sheets (aka MSDS Sheets) for all approved materials in the KNI Lab]] | |||
== Support Tools == | == Support Tools == | ||
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* [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]] | * [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]] | ||
* [[Rapid Thermal Processor | Rapid Thermal Processing: Modular Process Technology RTP-600S]] | * [[Rapid Thermal Processor | Rapid Thermal Processing: Modular Process Technology RTP-600S]] | ||
===== Substrate Processing ===== | ===== Substrate Processing ===== | ||
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]] | * [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]] | ||
* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]] | * [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]] | ||
* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]] | * [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]] | ||
===== Device Processing ===== | ===== Device Processing ===== | ||
* [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]] | * [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]] | ||
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]] | |||
===== Metrology ===== | |||
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]] | |||
* [[Veeco Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]] | |||
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]] | |||
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]] | * [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]] | ||
===== Sample Preparation ===== | ===== Sample Preparation ===== | ||
Revision as of 23:10, 22 May 2019
Lithography
Electron Beam Lithography
- Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)
- Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)
- Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)
- Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 kV)
Ion Beam Lithography
Optical Lithography
- Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6
- i-Line Wafer Stepper: GCA model 6300
- Direct-Write Laser System: Heidelberg Instruments DWL-66
- Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT
Deposition
Evaporation
- Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator
- Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator
- Carbon: Leica EM ACE600 Carbon Evaporator
Sputtering
- Dielectric Sputterer: AJA International ATC Orion 8
- Chalcogenide Sputterer: AJA International ATC Orion 8
Chemical Vapor Deposition (CVD)
- Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II
- Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100
Dielectric Packaging / Moisture Barrier
Etching
Dry Etching
- Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE
- III/V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE
- Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE
- Silicon, III/V Material & Organics Etcher: Plasmatherm Dual Chamber RIE
- Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE
- XeF2 Etcher for Silicon
Wet Etching
Microscopy
Focused Ion Beam (FIB) Systems
- Helium, Neon & Gallium FIB: Zeiss ORION NanoFab
- SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab
Scanning Electron Microscopes (SEMs)
- SEM, EDS & WDS: Thermo Fisher Nova 200 NanoLab
- SEM & EDS: Thermo Fisher Sirion
- SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F
- SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab
Transmission Electron Microscopes (TEMs)
- TEM, STEM, EDS & HAADF: Thermo Fisher Tecnai TF-30 (80-300 kV)
- TEM, STEM, EDS, EELS, EFTEM & Lithography: Thermo Fisher Tecnai TF-20 (80-200 kV)
Scanning Probe Microscopes
Optical Characterization
- Spectroscopic Ellipsometer: Woolam M-2000
- Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer
- Fluorescence Microscope: Olympus IX81
Sample Preparation for Microscopy
- Carbon Evaporator (Leica EM ACE600) to make samples conductive
- Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface
- TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill
Wet Chemistry
- Wet Chemistry Processes & Information
- Lab Safety Data Sheets (aka MSDS Sheets) for all approved materials in the KNI Lab
Support Tools
Thermal Processing
- Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)
- Rapid Thermal Processing: Modular Process Technology RTP-600S
Substrate Processing
- Scriber-Breaker: Dynatex GST-150
- Wafer Bonder: Suss MicroTec model SB6L
- Critical Point Dryer: Tousimis Automegasamdri 915B
Device Processing
Metrology
- Spectroscopic Ellipsometer: Woolam M-2000
- Profilometer: Veeco Dektak 3ST
- Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer
- Electrical Probing Station: Cascade Microtech M150