Equipment List: Difference between revisions
Jump to navigation
Jump to search
No edit summary |
No edit summary |
||
Line 16: | Line 16: | ||
= Deposition = | = Deposition = | ||
===== Evaporation ===== | ===== Evaporation ===== | ||
* Al, Au, Pt & Ti: Kurt J Lesker Labline | * Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline | ||
* Metals & Oxides: CHA Industries Mark 40 | * Metals & Oxides: CHA Industries Mark 40 | ||
* Carbon: Leica EM ACE600 Carbon Evaporator | * Carbon: Leica EM ACE600 Carbon Evaporator | ||
Line 25: | Line 25: | ||
* Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II | * Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II | ||
* Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100 | * Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100 | ||
===== Packaging ===== | ===== Dielectric Packaging / Moisture Barrier ===== | ||
* Parylene Coater: Para Tech LabTop 3000 | * Parylene Coater: Para Tech LabTop 3000 | ||
Line 67: | Line 67: | ||
* Thin Film Measurement: Filmetrics model F40 | * Thin Film Measurement: Filmetrics model F40 | ||
* Profilometer: Veeco Dektak 3ST | * Profilometer: Veeco Dektak 3ST | ||
===== Thermal Processing ===== | ===== Thermal Processing ===== |
Revision as of 00:47, 26 March 2019
Lithography
Electron Beam Lithography
- Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)
- Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)
- Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)
- Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 kV)
Ion Beam Lithography
- He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)
Optical Lithography
- Contact Mask Aligners: Suss Microtech models MA/BA6 & MA6/BA6
- i-Line Wafer Stepper: GCA model 6300
- Direct-Write Laser System: Heidelberg Instruments DWL-66
- Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT
Deposition
Evaporation
- Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline
- Metals & Oxides: CHA Industries Mark 40
- Carbon: Leica EM ACE600 Carbon Evaporator
Sputtering
- Dielectric Sputterer: AJA International ATC Orion 8
- Chalcogenide Sputterer: AJA International ATC Orion 5
Plasma-Enhanced Deposition
- Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II
- Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100
Dielectric Packaging / Moisture Barrier
- Parylene Coater: Para Tech LabTop 3000
Etching
Dry Etching
- Silicon Etcher: Oxford Instruments DRIE System 100 Cryo ICP–RIE
- Silicon, III/V Material & Metal Etcher: Oxford Instruments DRIE System 100 ICP–RIE
- Dielectric Material Etcher: Oxford Instruments Dielectric System 100, 380 V source, ICP–RIE
- Silicon, III/V Material & Organics Etcher: Plasmatherm RIE
- Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE
- XeF2 Silicon Etcher
Wet Etching
- Available Wet Chemistry Techniques
Microscopy
Focused Ion Beam (FIB) Systems
- He/Ne/Ga-FIB: Zeiss ORION NanoFab
- SEM/Ga-FIB/Omniprobe: Thermo Fisher Nova NanoLab 600
Scanning Electron Microscopes (SEMs)
- SEM/EDS/WDS: Thermo Fisher Nova NanoLab 200
- SEM/Ga-FIB/Omniprobe: Thermo Fisher Nova NanoLab 600
- SEM/EDS: Thermo Fisher Sirion
- SEM/ESEM: Thermo Fisher Quanta 200F
Transmission Electron Microscopes (TEMs)
- TEM/STEM/EDS/EELS/EFTEM/NPGS: Thermo Fisher Tecnai TF-20 (80-300 kV)
- TEM/STEM/EDS/HAADF: Thermo Fisher Tecnai TF-30 (80-200 kV)
Scanning Probe Microscopes
- Atomic Force Microscope (AFM): Bruker Dimension ICON
- Profilometer: Veeco Dektak 3ST
Optical Microscopes
- Fluorescence Microscope: Olympus IX81
- Light Microscope: Olympus BX51M with Filmetrics model F40
Support Tools
Metrology
- Spectroscopic Ellipsometry: Woolam M-2000
- Thin Film Measurement: Filmetrics model F40
- Profilometer: Veeco Dektak 3ST
Thermal Processing
- Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)
- Rapid Thermal Processing: Modular Process Technology RTP-600S
- Rapid Thermal Annealer: Jipelec Jetfirst 150
Substrate Processing
- Scriber-Breaker: Dynatex GST-150
- Wafer Bonder: Suss Microtech model SB6L
- Critical Point Dryer: Tousimis Automegasamdri 915B
Device Processing
- Wedge-Wedge Wire Bonder: Westbond model 7476D-79
- Electrical Probing Station: Cascade Microtech M150