Equipment List: Difference between revisions
Jump to navigation
Jump to search
| Line 70: | Line 70: | ||
===== Substrate Processing ===== | ===== Substrate Processing ===== | ||
* [[ | * [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]] | ||
* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]] | * [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]] | ||
* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]] | * [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]] | ||
Revision as of 16:41, 21 May 2019
Lithography
Electron Beam Lithography
- Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)
- Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)
- Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)
- Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 kV)
Ion Beam Lithography
Optical Lithography
- Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6
- i-Line Wafer Stepper: GCA model 6300
- Direct-Write Laser System: Heidelberg Instruments DWL-66
- Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT
Deposition
Evaporation
- Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator
- Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator
- Carbon: Leica EM ACE600 Carbon Evaporator
Sputtering
- Dielectric Sputterer: AJA International ATC Orion 8
- Chalcogenide Sputterer: AJA International ATC Orion 8
Chemical Vapor Deposition (CVD)
- Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II
- Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100
Dielectric Packaging / Moisture Barrier
Etching
Dry Etching
- Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP–RIE
- III/V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP–RIE
- Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP–RIE
- Silicon, III/V Material & Organics Etcher: Plasmatherm Dual Chamber RIE
- Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE
- XeF2 Etcher for Silicon
Wet Etching
Microscopy
Focused Ion Beam (FIB) Systems
- Helium, Neon & Gallium FIB: Zeiss ORION NanoFab
- SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab
Scanning Electron Microscopes (SEMs)
- SEM, EDS & WDS: Thermo Fisher Nova 200 NanoLab
- SEM & EDS: Thermo Fisher Sirion
- SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F
- SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab
Transmission Electron Microscopes (TEMs)
- TEM, STEM, EDS & HAADF: Thermo Fisher Tecnai TF-30 (80-300 kV)
- TEM, STEM, EDS, EELS, EFTEM & Lithography: Thermo Fisher Tecnai TF-20 (80-200 kV)
Scanning Probe Microscopes
Optical Characterization
- Spectroscopic Ellipsometry: Woolam M-2000
- Light Microscope: Olympus BX51M with Filmetrics model F40
- Fluorescence Microscope: Olympus IX81
Sample Preparation for Microscopy
- Carbon Evaporator (Leica EM ACE600) to make samples conductive
- Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface
- TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill
Support Tools
Thermal Processing
- Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)
- Rapid Thermal Processing: Modular Process Technology RTP-600S
Substrate Processing
- Scriber-Breaker: Dynatex GST-150
- Wafer Bonder: Suss MicroTec model SB6L
- Critical Point Dryer: Tousimis Automegasamdri 915B
Device Processing
Sample Preparation
- TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill
- Carbon Evaporator (Leica EM ACE600) to make samples conductive
- Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface
Old Support Tools (Do not edit these)
Thermal Processing
- Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)
- Rapid Thermal Processing: Modular Process Technology RTP-600S
- Rapid Thermal Annealer: Jipelec Jetfirst 150
Substrate Processing
- Scriber-Breaker: Dynatex GST-150
- Wafer Bonder: Suss MicroTec model SB6L
- Critical Point Dryer: Tousimis Automegasamdri 915B