DWL-66: Direct-Write Laser System

DWL-66 Direct-Write Laser System Instrument Type Lithography Techniques Direct patterning, Pattern alignment, Wafer and mask patterning Staff Manager Bert Mendoza Staff Email bertm@caltech.edu Staff Phone 626-395-4075 Reserve time on FBS Request training via FBS User Dashboard Lab Location B217 Steele Lab Phone 626-395-1536 Manufacturer Heidelberg Instruments Model {{{Model}}}

Description

The Heidelberg Instruments DWL-66 is a tool for mask making and for direct patterning of wafers by the use of a HeCd laser. Precise control of the laser head and alignment produces 800-nm resolution lithography. The DWL 66 is an extremely high-resolution imaging system where over half a million dpi is achieved using a 40-nm writeable address grid for exposing chrome plates or wafers.

Type1 Applications

• Direct writing
• Grayscale writing

Resources

SOPs

• General SOP

Manufacturer Manuals

• User Guide, Part 1
• User Guide, Part 2

Specifications

• Exposure: 442 nm wavelength HeCd laser