Scriber-Breaker

Scriber-Breaker Instrument Type Substrate Processing Techniques Wafer & Chip Scribing, Scribe Breaking Staff Manager Bert Mendoza Staff Email bertm@caltech.edu Staff Phone 626-395-4075 Reserve time on FBS Request training via FBS User Dashboard Lab Location B213 Steele Lab Phone 626-395-1537 Manufacturer Dynatex Model GST-150

Description

The scriber-breaker uses a dry scribing and breaking technique to allow cleaner separation of dies on a wafer than can be done with a wet cutting saw. Some advantages are that the elimination of deionized water protects delicate structures on the wafer surface, decreasing street sizes of existing wafers, and dicing difficult-to-manage substrates. Many compound semiconductors can be challenging when dicing, and the dry scribe/break technology is successful for such materials.

Applications

• Scribing and/or breaking wafers

Resources

SOPs & Troubleshooting

• General SOP & Troubleshooting (COMING SOON)

Manufacturer Manuals

• Manual (COMING SOON)

Specifications

Notable Specifications

• Accommodated Sizes: up to 6" wafers
• Materials excluded from scribing: COMING SOON