Scriber-Breaker

Scriber-Breaker Instrument Type Substrate Processing Techniques Wafer & Chip Scribing, Scribe Breaking Staff Manager Bert Mendoza Staff Email bertm@caltech.edu Staff Phone 626-395-4075 Reserve time on FBS Request training via FBS User Dashboard Lab Location B213 Steele Lab Phone 626-395-1537 Manufacturer Dynatex Model GST-150

Description

The scriber-breaker uses a dry scribing and breaking technique to allow cleaner separation of dies on a wafer than can be done with a wet cutting saw. Some advantages are that the elimination of deionized water protects delicate structures on the wafer surface, decreasing street sizes of existing wafers, and dicing difficult-to-manage substrates. Many compound semiconductors can be challenging when dicing, and the dry scribe/break technology is successful for such materials.

Type1 Applications

• Application1
• Application2
• Application3

Resources

SOPs & Troubleshooting

• SOP
• Troubleshooting Guide

Manufacturer Manuals

• Manual

Specifications

Manufacturer Specifications

• Manufacturer Data Sheet

Notable Specifications

• Voltage Range: 0.5 to 30.0 kV
• Aperture Sizes: 10 mm, 15 mm, 20 mmm, 30 mm
• etc.