CHA: Electron Beam Evaporator

CHA Evaporator Instrument Type Deposition Techniques E-beam Evaporation Staff Manager Alex Wertheim Staff Email alexw@caltech.edu Staff Phone 626-395-3371 Reserve time on FBS Request training via FBS User Dashboard Lab Location B235C Steele Lab Phone 626-395-1539 Manufacturer CHA Industries Model Mark 40

Description

The CHA Mark 40 electron beam evaporator is a cryopumped six-pocket electron beam deposition system that is optimized for processing multiple wafers with a planetary substrate holder configuration. This tool offers precise control of electron beam evaporation processes for metal films.

Applications

• Metal & Oxide Deposition
• Lift-off
• Etch Hard-mask Formation

Resources

SOPs & Troubleshooting

• KNI SOP
• Troubleshooting Guide
• QCM Crystal Sensor Replacement Instructions
• E-beam Process Maintenance Guide
• Materials Filling and Crucible Swap Instructions

Use the process maintenance guide above for help with assessing and maintaining evaporation crucibles.

Tool Reservation Rules

_	Advanced Reservation (days)	! Limit per Reservation (hrs)		Limit per week (hrs)
Weekday	7	6		12
Weeknight	7	12		12
Weekend	14	12		12

Video Tutorials

• CHA Training

Specifications

Hardware Specifications

• Typical base pressure: 1E-6 to 1E-7 Torr
• All dry pumping system (cryo & dry mechanical pump)
• Evaporation Source: 1x single emitter, 6-pocket e-beam evaporation source

Related Instrumentation in the KNI

Sputtering Systems

• ATC Orion 8: Chalcogenide Sputter System
• ATC Orion 8: Dielectric Sputter System

Electron Beam Evaporation Systems

• Labline: Electron Beam Evaporator

Chemical Vapor Deposition

• FlexAL II: Atomic Layer Deposition (ALD)
• Plasma-Enhanced Chemical Vapor Deposition (PECVD)