Wet Chemistry: Difference between revisions
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| Line 63: | Line 63: | ||
* PGMEA | * PGMEA | ||
===== Approved Chemicals ===== | ===== Approved Chemicals ===== | ||
* [[Material Safety Data Sheets (MSDS) | See List] | * [[Material Safety Data Sheets (MSDS) | See List]] | ||
== Resources == | == Resources == | ||
===== Safety Data Sheets ===== | ===== Safety Data Sheets ===== | ||
* [[Safety Data Sheets]] | * [[Safety Data Sheets]] | ||
Revision as of 21:50, 26 May 2019
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Description
Available Benches
- Acids
- Hydrofluoric Acid (HF)
- Bases
- Potassium Hydroxide (KOH)
- Solvents
- Electroplating
Chemicals Provided by the KNI
- Methylene Chloride = Dichloromethane
- HMDS = Hexamethyldisilazane
- IPA= Isopropyl Alchohol
- Acetone
- KOH = Potassium Hydroxide
- MIBK (new product)=Methyl Iso Butyl Ketone
- MIBK (backup product)
- H2O2=Hydrogen Peroxide
- H2SO4=Sulfuric Acid
- HCl=Hydrochloric Acid
- H3PO4=Phosphoric Acid
- Methanol
- NH4OH=Ammonium Hydroxide BDH chemicals
- Ammonium Hydroxide JT Baker
- HF=Hydrofluoric Acid
- Acetic Acid, Glacial
- Al etchant A
- Al etchant D
- Au Etchant
- AZ 400 Photoresist Developer
- AZ 726 Photoresist Developer
- AZ4620
- AZ 5214 E IR
- BOE=BHF=Buffered HF
- CD-26
- Chrome etch
- Citric Acid
- Cu Etchant
- MF 319
- Nanostrip
- Nanostrip 2x
- PG Remover
- Ti etchant
- Ti etchant
- TMAH=TetraMethylAmmoniumHydroxide
- SU-8 Developer
- PGMEA