Wafer Bonder: Difference between revisions
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|InstrumentName = Suss Microtec SB6L Wafer Bonder | |InstrumentName = Suss Microtec SB6L Wafer Bonder | ||
|HeaderColor = #E6E7E8 | |HeaderColor = #E6E7E8 | ||
|ImageOne = Wafer-Bonder_Suss- | |ImageOne = Wafer-Bonder_Suss-SB6L.jpg | ||
|ImageTwo = | |ImageTwo = | ||
|InstrumentType = [[Equipment_List#Support Tools|Support Tools]] | |InstrumentType = [[Equipment_List#Support Tools|Support Tools]] | ||
Revision as of 07:05, 21 May 2019
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Description
The SB6L wafer bonder applies force and heat to the back side of two wafers in a vacuum chamber to bond them face to face. An automatic recipe can be created with control over bonding pressure, temperature, and chamber pressure as well as ramp/duration of any process step. Since heat and temperature can be controlled separately, temperature sensitive materials such as polymers may be bonded.
Applications
- MEMS & Microelectronics fabrication