Optical Lithography Resources: Difference between revisions

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Photoresists provided by KNI:
Photoresists provided by KNI:


*'''S1813''': standard positive, withstands acid etching. ([https://kayakuam.com/wp-content/uploads/2019/09/S1800-G2.pdf Manufacturer Spec Sheet])
*'''S1813,1818''': standard positive, withstands acid etching.([https://kayakuam.com/wp-content/uploads/2019/09/S1800-G2.pdf Manufacturer Spec Sheet]) Shipley 1800 series 0.9-1.9μm range available.  0.5-3.2μm available from manufacturer
*'''AZ5214''': positive and image reversal negative, good for liftoff. ([https://www.microchemicals.com/micro/tds_az_nlof2000_series.pdf Manufacturer Spec Sheet])
*'''AZ5214''': positive and image reversal negative, good for liftoff. ([https://www.microchemicals.com/micro/tds_az_nlof2000_series.pdf Manufacturer Spec Sheet])
*'''SU-8''': thick polymer structures. ([https://kayakuam.com/products/su-8-photoresists/ Manufacturer Spec Sheet])
*'''SU-8''': thick polymer structures. ([https://kayakuam.com/products/su-8-photoresists/ Manufacturer Spec Sheet])
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! Resist !! Wafer Prep !! Spin !! Thickness !! Prebake !! Exposure !! Postbake !! Flood !! Development  !! Hardbake !! Lamp !! Notes  
! Resist !! Wafer Prep !! Spin !! Thickness !! Prebake !! Exposure !! Postbake !! Flood !! Development  !! Hardbake !! Lamp !! Notes  
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| S1813 || Dehydrate on hot plate || 3000rpm || 1.5um || 115C 1min || X || - || - || X || - || Suss1 Ch1 15mW/cm^2 || Measured 10/19 (Link KNI recipe doc here)
| S1813 || Dehydrate on hot plate || 3000rpm || 1.5μmm || 115C 1min || X || - || - || X || - || Suss1 Ch1 15mW/cm^2 || Measured 10/19 (Link KNI recipe doc here)
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| AZ5214 || Dehydrate on hot plate || 3500rpm || 1.4um || 100C 1min || 25s || - || - || MF319 60s || - || Suss1 Ch1 15mW/cm^2 || Measured 10/19
| AZ5214 || Dehydrate on hot plate || 3500rpm || 1.4μm || 100C 1min || 25s || - || - || MF319 60s || - || Suss1 Ch1 15mW/cm^2 || Measured 10/19
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! Resist !! Wafer Prep !! Spin !! Thickness !! Prebake !! Exposure !! Postbake !! Flood !! Development  !! Hardbake !! Lamp !! Notes  
! Resist !! Wafer Prep !! Spin !! Thickness !! Prebake !! Exposure !! Postbake !! Flood !! Development  !! Hardbake !! Lamp !! Notes  
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| rowspan="2" | AZ5214 || Dehydrate on hot plate || 2000rpm || 1.8um || 100C 1min || 12s || 110C 1min || 40s || MF319 60s || - || Suss1 Ch1 15mW/cm^2 || Measured 10/19
| rowspan="2" | AZ5214 || Dehydrate on hot plate || 2000rpm || 1.8μm || 100C 1min || 12s || 110C 1min || 40s || MF319 60s || - || Suss1 Ch1 15mW/cm^2 || Measured 10/19
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|-
| Dehydrate on hot plate || 3500rpm || 1.4um || 100C 1min || 9s || 110C 1min || 30s || MF319 60s || - || Suss1 Ch1 15mW/cm^2 || Measured 10/19
| Dehydrate on hot plate || 3500rpm || 1.4μm || 100C 1min || 9s || 110C 1min || 30s || MF319 60s || - || Suss1 Ch1 15mW/cm^2 || Measured 10/19
|}
|}


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! Resist !! Wafer Prep !! Spin !! Thickness !! Prebake !! Exposure !! Postbake !! Development  !! Hardbake !! Lamp !! Notes  
! Resist !! Wafer Prep !! Spin !! Thickness !! Prebake !! Exposure !! Postbake !! Development  !! Hardbake !! Lamp !! Notes  
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|-
| 2050 || Dehydrate on hot plate || 3000rpm || 50um || 65C 3min 95C 9min || X || 65C 2min 95C 7min || SU-8 Developer X seconds || Optional || Suss1 Ch1 15mW/cm^2 || Measured 10/19
| 2050 || Dehydrate on hot plate || 3000rpm || 50μm || 65C 3min 95C 9min || X || 65C 2min 95C 7min || SU-8 Developer X seconds || Optional || Suss1 Ch1 15mW/cm^2 || Measured 10/19
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Revision as of 12:10, 2 December 2019

Trove of lithography application notes from MicroChemicals covering troubleshooting, procedures, techniques, theory

KNI Photoresists

Photoresists provided by KNI:

Positive Photoresist Recipes

See recipe notes for additional information on wafer cleaning and prep, edge bead removal, and spin curves.

Resist Wafer Prep Spin Thickness Prebake Exposure Postbake Flood Development Hardbake Lamp Notes
S1813 Dehydrate on hot plate 3000rpm 1.5μmm 115C 1min X - - X - Suss1 Ch1 15mW/cm^2 Measured 10/19 (Link KNI recipe doc here)
AZ5214 Dehydrate on hot plate 3500rpm 1.4μm 100C 1min 25s - - MF319 60s - Suss1 Ch1 15mW/cm^2 Measured 10/19

Negative Photoresist Recipes

See recipe notes for additional information on wafer cleaning and prep, edge bead removal, and spin curves.

Resist Wafer Prep Spin Thickness Prebake Exposure Postbake Flood Development Hardbake Lamp Notes
AZ5214 Dehydrate on hot plate 2000rpm 1.8μm 100C 1min 12s 110C 1min 40s MF319 60s - Suss1 Ch1 15mW/cm^2 Measured 10/19
Dehydrate on hot plate 3500rpm 1.4μm 100C 1min 9s 110C 1min 30s MF319 60s - Suss1 Ch1 15mW/cm^2 Measured 10/19

SU-8 Recipes

SU-8 is available in thicknesses ranging from 500nm to 500microns. Remember to use Laurel Spinner 1.

Resist thicknesses currently provided by KNI: 2050, 2005, 2001, 2000.5

BYU SU-8 Guide

Resist Wafer Prep Spin Thickness Prebake Exposure Postbake Development Hardbake Lamp Notes
2050 Dehydrate on hot plate 3000rpm 50μm 65C 3min 95C 9min X 65C 2min 95C 7min SU-8 Developer X seconds Optional Suss1 Ch1 15mW/cm^2 Measured 10/19

Other Photoresists

Non-KNI Photoresist Recipes

Resist Wafer Prep Spin Thickness Prebake Exposure Postbake Flood Development Hardbake Lamp Notes
nLoF 2070 Dehydrate on hot plate 2500rpm 7um 110C 90s 12s 110C 90s - AZ 729 2min - Suss1 Ch1 15mW/cm^2 Measured 10/19

Addtional Photolithography Resources

Retrieved from "https://www.lab.kni.caltech.edu/index.php?title=Optical_Lithography_Resources&oldid=2057"