Optical Lithography Resources: Difference between revisions
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! Resist !! Wafer Prep !! Spin !! Thickness !! Prebake !! Exposure !! Postbake !! Flood !! Development !! Hardbake !! Lamp !! Notes | ! Resist !! Wafer Prep !! Spin !! Thickness !! Prebake !! Exposure !! Postbake !! Flood !! Development !! Hardbake !! Lamp !! Notes | ||
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| 2050 || Dehydrate on hot plate || 3000rpm || 50um || 65C 3min 95C 9min || X || 65C 2min 95C 7min || - || SU-8 Developer X seconds || Optional || Suss1 Ch1 15mW/cm^2 || Measured 10/19 | | 2050 || Dehydrate on hot plate || 3000rpm || 50um || 65C 3min 95C 9min || X || 65C 2min 95C 7min || - || SU-8 Developer X seconds || Optional || Suss1 Ch1 15mW/cm^2 || Measured 10/19 | ||
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Revision as of 04:53, 4 November 2019
KNI Photoresists
Photoresists provided by KNI:
- S1813: standard positive, withstands acid etching
- AZ5214: positive and image reversal negative, good for liftoff
- SU-8: thick polymer structures
Positive Photoresist Recipes
See recipe notes for additional information on wafer cleaning and prep, edge bead removal, and spin curves.
| Resist | Wafer Prep | Spin | Thickness | Prebake | Exposure | Postbake | Flood | Development | Hardbake | Lamp | Notes |
|---|---|---|---|---|---|---|---|---|---|---|---|
| S1813 | Dehydrate on hot plate | 3000rpm | 1.5um | 115C 1min | X | - | - | X | - | Suss1 Ch1 15mW/cm^2 | Measured 10/19 (Link KNI recipe doc here) |
| AZ5214 | Dehydrate on hot plate | 2000rpm | 1um | 100C 1min | 25s | - | - | MF319 60s | - | Suss1 Ch1 15mW/cm^2 | Measured 10/19 |
Negative Photoresist Recipes
See recipe notes for additional information on wafer cleaning and prep, edge bead removal, and spin curves.
| Resist | Wafer Prep | Spin | Thickness | Prebake | Exposure | Postbake | Flood | Development | Hardbake | Lamp | Notes |
|---|---|---|---|---|---|---|---|---|---|---|---|
| AZ5214 | Dehydrate on hot plate | 2000rpm | 1.8um | 100C 1min | 12s | 110C 1min | 40s | MF319 60s | - | Suss1 Ch1 15mW/cm^2 | Measured 10/19 |
| Dehydrate on hot plate | 3500rpm | 1.4um | 100C 1min | 9s | 110C 1min | 30s | MF319 60s | - | Suss1 Ch1 15mW/cm^2 | Measured 10/19 |
SU-8 Recipes
SU-8 is available in thicknesses ranging from 500nm to 500microns. Remember to use Laurel Spinner 1.
Resist thicknesses currently provided by KNI: 2050, 2005, 2001, 2000.5
| Resist | Wafer Prep | Spin | Thickness | Prebake | Exposure | Postbake | Flood | Development | Hardbake | Lamp | Notes |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 2050 | Dehydrate on hot plate | 3000rpm | 50um | 65C 3min 95C 9min | X | 65C 2min 95C 7min | - | SU-8 Developer X seconds | Optional | Suss1 Ch1 15mW/cm^2 | Measured 10/19 |
Other Photoresists
resist list https://cleanroom.byu.edu/resistmanufacturers
UCSB photoresist recipes:
https://www.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#Photolithography_Recipes
https://www.nanotech.ucsb.edu/wiki/index.php/Contact_Alignment_Recipes
BYU Photoresist recipes https://cleanroom.byu.edu/photoresists
| Resist | Wafer Prep | Spin | Thickness | Prebake | Exposure | Postbake | Flood | Developer | Development | Hardbake | Mask Aligner | Wattage | Notes |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| nLoF 2070 | Dehydrate on hot plate | 2000rpm | 7um | 100C 5min | 120s | - | - | MF319 | 120s | - | Suss1 Ch1 | 15mW/cm^2 | Measured 10/19 (Link KNI recipe doc here) |
Photolithography Resources
Link to BYU photolithograph https://cleanroom.byu.edu/processes#Microfab_PhotoLith
link to definitions: https://kayakuam.com/techreferences/lithography-terms/ https://cleanroom.byu.edu/definitions
resolution https://pages.mtu.edu/~microweb/chap1/ch1-4-1.htm