Optical Lithography Resources: Difference between revisions

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Trove of lithography application notes:
'''[https://www.microchemicals.com/downloads/application_notes.html Trove of lithography application notes from MicroChemicals covering troubleshooting, procedures, techniques, theory]'''
 
https://www.microchemicals.com/downloads/application_notes.html
 
troubleshooting, photoresist procedures, liftoff, etching, etc.


=KNI Photoresists=
=KNI Photoresists=
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Photoresists provided by KNI:
Photoresists provided by KNI:


*S1813 standard positive, withstands acid etching
*'''S1813''': standard positive, withstands acid etching
*AZ5214, positive and image reversal negative, good for liftoff
*'''AZ5214''': positive and image reversal negative, good for liftoff
 
*'''SU-8''': thick polymer structures


==Positive==
==Positive Photoresist Recipes==


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==Negative==
==Negative Photoresist Recipes==


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==SU8 Guide==
==SU-8 Guide==


BYU SU-8 Guide
BYU SU-8 Guide

Revision as of 04:36, 4 November 2019

Template:NOINDEX

Trove of lithography application notes from MicroChemicals covering troubleshooting, procedures, techniques, theory

KNI Photoresists

Photoresists provided by KNI:

  • S1813: standard positive, withstands acid etching
  • AZ5214: positive and image reversal negative, good for liftoff
  • SU-8: thick polymer structures

Positive Photoresist Recipes

Resist Wafer Prep Spin Thickness Prebake Exposure Postbake Flood Development Hardbake Lamp Notes
S1813 Dehydrate on hot plate 2000rpm 1um 100C 1min 12s - - MF319 60s - Suss1 Ch1 15mW/cm^2 Measured 10/19 (Link KNI recipe doc here)
AZ5214 Dehydrate on hot plate 2000rpm 1um 100C 1min 25s - - MF319 60s - Suss1 Ch1 15mW/cm^2 Measured 10/19 (Link KNI recipe doc here)

Negative Photoresist Recipes

Resist Wafer Prep Spin Thickness Prebake Exposure Postbake Flood Development Hardbake Lamp Notes
AZ5214 Dehydrate on hot plate 2000rpm 1.8um 100C 1min 12s 110C 1min 40s MF319 60s - Suss1 Ch1 15mW/cm^2 Measured 10/19
Dehydrate on hot plate 3500rpm 1.4um 100C 1min 9s 110C 1min 30s MF319 60s - Suss1 Ch1 15mW/cm^2 Measured 10/19

SU-8 Guide

BYU SU-8 Guide https://cleanroom.byu.edu/su8

Sizes provided by KNI: 2050, 2005, 2001, 2000.5


Resist Wafer Prep Spin Thickness Prebake Exposure Postbake Flood Development Hardbake Lamp Notes
2050 Dehydrate on hot plate 3000rpm 50um 65C 3min 95C 9min X 65C 2min 95C 7min - SU-8 Developer X seconds Optional Suss1 Ch1 15mW/cm^2 Measured 10/19 (Link KNI recipe doc here)

Other Photoresists

resist list https://cleanroom.byu.edu/resistmanufacturers

UCSB photoresist recipes:

https://www.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#Photolithography_Recipes

https://www.nanotech.ucsb.edu/wiki/index.php/Contact_Alignment_Recipes

BYU Photoresist recipes https://cleanroom.byu.edu/photoresists


Resist Wafer Prep Spin Thickness Prebake Exposure Postbake Flood Developer Development Hardbake Mask Aligner Wattage Notes
nLoF 2070 Dehydrate on hot plate 2000rpm 7um 100C 5min 120s - - MF319 120s - Suss1 Ch1 15mW/cm^2 Measured 10/19 (Link KNI recipe doc here)

Photolithography Resources

Link to BYU photolithograph https://cleanroom.byu.edu/processes#Microfab_PhotoLith

link to definitions: https://kayakuam.com/techreferences/lithography-terms/ https://cleanroom.byu.edu/definitions

resolution https://pages.mtu.edu/~microweb/chap1/ch1-4-1.htm

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