Wafer Bonder: Difference between revisions
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== Resources == | == Resources == | ||
===== SOPs | ===== SOPs ===== | ||
* [https://caltech.box.com/s/jwm9iw0t64s7sznmzwjs32zjdjownts7 | * [https://caltech.box.com/s/jwm9iw0t64s7sznmzwjs32zjdjownts7 KNI SOP] | ||
===== Manufacturer Manuals ===== | ===== Manufacturer Manuals ===== | ||
* [https://caltech.box.com/s/7pj89gepa98exkv7gyy3hmzs0gv3jo72 Process Manual] | * [https://caltech.box.com/s/7pj89gepa98exkv7gyy3hmzs0gv3jo72 Process Manual] | ||
Revision as of 22:06, 28 May 2019
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Description
The SB6L wafer bonder applies force and heat to the back side of two wafers in a vacuum chamber in order to bond them face to face. An automatic recipe can be created with control over bonding pressure, temperature, and chamber pressure as well as ramp & duration of any process step. Since heat and temperature can be controlled separately, temperature-sensitive materials such as polymers may be bonded.
Applications
- MEMS & Microelectronics Fabrication