Labline: Electron Beam Evaporator: Difference between revisions

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* Evaporation Source: 1x single emitter, 4-pocket e-beam evaporation source
* Evaporation Source: 1x single emitter, 4-pocket e-beam evaporation source
* 1x Argon ion source (Filament type)
* 1x Argon ion source (Filament type)
== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]
===== Electron Beam Evaporation Systems =====
* [[CHA: Electron Beam Evaporator|CHA: Electron Beam Evaporator]]
===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]

Revision as of 21:16, 20 September 2019

Labline Evaporator
KJLC-Labline-Metal-Evaporator.jpg
Instrument Type Deposition
Techniques E-beam Evaporation,
Ion-Assisted Deposition (IAD),
Ion Milling
Staff Manager Alex Wertheim
Staff Email alexw@caltech.edu
Staff Phone 626-395-3371
Reserve time on FBS
Request training via FBS User Dashboard
Lab Location B235C Steele
Lab Phone 626-395-1539
Manufacturer Kurt J. Lesker Company
Model Labline

Description

The Labline electron beam evaporator system is a load-locked platform with a cryopump for fast sample turnaround and a user-friendly interface for precise control of film parameters during deposition. It is fitted with a Kaufman and Robinson EH 400 End-Hall permanent magnet ion source that can be used for cleaning substrates and ion-assisted deposition during evaporation.

Applications
  • Metal deposition (Ti, Pt, Au, Al)
  • Lift-off
  • Non-selective etch
  • Ion-assisted deposition (simultaneous etching & deposition)

Resources

SOPs & Troubleshooting
Video Tutorials

Specifications

Hardware Specifications
  • Typical base pressure: 1E-7 to 1E-8 Torr
  • All dry pumping system (cryo & scroll pumps)
  • Load-lock-equipped system with manual wafer transfer
  • Evaporation Source: 1x single emitter, 4-pocket e-beam evaporation source
  • 1x Argon ion source (Filament type)

Related Instrumentation in the KNI

Sputtering Systems
Electron Beam Evaporation Systems
Chemical Vapor Deposition