CHA: Electron Beam Evaporator: Difference between revisions
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* [https://caltech.box.com/s/4i2s0kvp6euf2ngx38cr99etfm0gagh0 KNI SOP] | * [https://caltech.box.com/s/4i2s0kvp6euf2ngx38cr99etfm0gagh0 KNI SOP] | ||
* [https://caltech.box.com/s/alx89163hok9gqg5vocsvhk0y74xd5xh Troubleshooting Guide] | * [https://caltech.box.com/s/alx89163hok9gqg5vocsvhk0y74xd5xh Troubleshooting Guide] | ||
* [https://caltech.box.com/s/e0oelbvt8cj4fg9bemitidnwee068qrn E-beam process maintenance guide] | |||
Use the process maintenance guide above for help with assessing and maintaining evaporation crucibles. | |||
===== Video Tutorials ===== | ===== Video Tutorials ===== |
Revision as of 21:33, 30 August 2019
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Description
The CHA Mark 40 electron beam evaporator is a cryopumped six-pocket electron beam deposition system that is optimized for processing multiple wafers with a planetary substrate holder configuration. This tool offers precise control of electron beam evaporation processes for metal films.
Applications
- Metal & Oxide Deposition
- Lift-off
- Etch Hard-mask Formation
Resources
SOPs & Troubleshooting
Use the process maintenance guide above for help with assessing and maintaining evaporation crucibles.
Video Tutorials
Specifications
Hardware Specifications
- Typical base pressure: 1E-6 to 1E-7 Torr
- All dry pumping system (cryo & dry mechanical pump)
- Evaporation Source: 1x single emitter, 6-pocket e-beam evaporation source