Wafer Bonder: Difference between revisions
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== Description == | == Description == | ||
The SB6L wafer bonder applies force and heat to the back side of two wafers in a vacuum chamber to bond them face to face. An automatic recipe can be created with control over bonding pressure, temperature, and chamber pressure as well as ramp/duration of any process step. Since heat and temperature can be controlled separately, temperature sensitive materials such as polymers may be bonded. | The SB6L wafer bonder applies force and heat to the back side of two wafers in a vacuum chamber to bond them face to face. An automatic recipe can be created with control over bonding pressure, temperature, and chamber pressure as well as ramp/duration of any process step. Since heat and temperature can be controlled separately, temperature sensitive materials such as polymers may be bonded. | ||
===== Applications ===== | ===== Applications ===== | ||
* MEMS & Microelectronics fabrication | * MEMS & Microelectronics fabrication | ||
== Resources == | |||
===== SOPs & Troubleshooting ===== | |||
* [https://caltech.box.com/s/BROKEN General SOP & Troubleshooting (COMING SOON)] | |||
===== Manufacturer Manuals ===== | |||
* [https://caltech.box.com/s/BROKEN Manual (COMING SOON)] | |||
== Specifications == | |||
===== Notable Specifications ===== | |||
* (COMING SOON) | |||
Revision as of 21:15, 22 May 2019
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Description
The SB6L wafer bonder applies force and heat to the back side of two wafers in a vacuum chamber to bond them face to face. An automatic recipe can be created with control over bonding pressure, temperature, and chamber pressure as well as ramp/duration of any process step. Since heat and temperature can be controlled separately, temperature sensitive materials such as polymers may be bonded.
Applications
- MEMS & Microelectronics fabrication
Resources
SOPs & Troubleshooting
Manufacturer Manuals
Specifications
Notable Specifications
- (COMING SOON)