XeF2 Etcher for Silicon: Difference between revisions
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{{ | {{InstrumentInfoboxOneImage| | ||
|InstrumentName = | |InstrumentName = XeF<sub>2</sub> Silicon Etcher | ||
|HeaderColor = #F5A81C | |HeaderColor = #F5A81C | ||
|ImageOne = | |ImageOne = XeF2-Etcher.jpg | ||
|ImageTwo = | |ImageTwo = | ||
|InstrumentType = [[Equipment_List#Etching|Etching]] | |InstrumentType = [[Equipment_List#Etching|Etching]] | ||
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|StaffPhone = 626-395-3371 | |StaffPhone = 626-395-3371 | ||
|Manufacturer = N/A | |Manufacturer = N/A | ||
|Model = N/A | |||
|Techniques = Selective dry Si etching | |Techniques = Selective dry Si etching | ||
|RequestTraining = alexw@caltech.edu | |RequestTraining = alexw@caltech.edu | ||
|EmailList = kni-XeF2@caltech.edu | |EmailList = kni-XeF2@caltech.edu | ||
|EmailListName = | |EmailListName = XeF2 | ||
}} | }} | ||
== Description == | == Description == | ||
Revision as of 00:53, 21 May 2019
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Description
The XeF2 etcher flows pressure and time controlled pulses of XeF2 gas into a chamber to deliver an isotropic etch which is highly selective only to Silicon. It is commonly used to remove Si under layers accessed through Vias to suspend membranes and other structures in MEMS devices.
Applications
- Very high selectivity dry Si etching
- MEMS fabrication