Wafer Bonder: Difference between revisions
Jump to navigation
Jump to search
mNo edit summary |
|||
| (4 intermediate revisions by 3 users not shown) | |||
| Line 7: | Line 7: | ||
|RoomLocation = B217 Steele | |RoomLocation = B217 Steele | ||
|LabPhone = 626-395-1539 | |LabPhone = 626-395-1539 | ||
|PrimaryStaff = [[ | |PrimaryStaff = [[Alireza Ghaffari]] | ||
|StaffEmail = | |StaffEmail = alireza@caltech.edu | ||
|StaffPhone = 626-395- | |StaffPhone = 626-395-3984 | ||
|Manufacturer = Suss Microtec | |Manufacturer = Suss Microtec | ||
|Model = SBL6 | |Model = SBL6 | ||
|Techniques = Pressure/Heat Bonding | |Techniques = Pressure/Heat Bonding | ||
|RequestTraining = | |RequestTraining = alireza@caltech.edu | ||
|EmailList = kni-sb6l | |EmailList = kni-sb6l | ||
|EmailListName = Wafer Bonder | |EmailListName = Wafer Bonder | ||
| Line 23: | Line 23: | ||
== Resources == | == Resources == | ||
===== SOPs | ===== SOPs ===== | ||
* [https://caltech.box.com/s/jwm9iw0t64s7sznmzwjs32zjdjownts7 | * [https://caltech.box.com/s/jwm9iw0t64s7sznmzwjs32zjdjownts7 KNI SB6L SOP] - Operating Instructions for the Suss SB6L Wafer Bonder | ||
===== Manufacturer Manuals ===== | ===== Manufacturer Manuals ===== | ||
* [https://caltech.box.com/s/ | * [https://caltech.box.com/s/je95chbsbq3u14f3jchch4l79itshtb5 SB6L User Manual] - The SUSS SB6L Wafer Bonder System User Manual | ||
* [https://caltech.box.com/s/fiy5cjzv01tf7b1vglc1nl0iv4uidgmp NP12 User Manual] - The SUSS NP 12™ Plasma Activation System User Manual | |||
* [https://caltech.box.com/s/7pj89gepa98exkv7gyy3hmzs0gv3jo72 Suss Micro Tec Process Manual] -The Wafer Bonding Process Manual contains information on the different types of substrate bonding applications. | |||
* | |||
Latest revision as of 21:19, 21 August 2023
|
Description
The SB6L wafer bonder applies force and heat to the back side of two wafers in a vacuum chamber in order to bond them face to face. An automatic recipe can be created with control over bonding pressure, temperature, and chamber pressure as well as ramp & duration of any process step. Since heat and temperature can be controlled separately, temperature-sensitive materials such as polymers may be bonded.
Applications
- MEMS & Microelectronics Fabrication
Resources
SOPs
- KNI SB6L SOP - Operating Instructions for the Suss SB6L Wafer Bonder
Manufacturer Manuals
- SB6L User Manual - The SUSS SB6L Wafer Bonder System User Manual
- NP12 User Manual - The SUSS NP 12™ Plasma Activation System User Manual
- Suss Micro Tec Process Manual -The Wafer Bonding Process Manual contains information on the different types of substrate bonding applications.