MLA-150 Maskless Aligner: Difference between revisions

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Created page with "{{InstrumentInfoboxOneImage| |InstrumentName = MLA-150 Maskless Aligner |HeaderColor = #FFFFFF |ImageOne = *needs image* |ImageTwo = *needs image* |InstrumentType = Lithography |RoomLocation = B217 Steele |LabPhone = 626-395-1535 |PrimaryStaff = Alex Wertheim |StaffEmail = alexw@caltech.edu |StaffPhone = 626-395-3371 |Manufacturer = Heidelberg |Model = MLA-150 |Techniques = Frontside Alignment,<br>Backside Alignment,</br>Maskless lithograph..."
 
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== Description ==
== Description ==
The maskless aligner is a tool that enables fast iteration on layout designs by enabling patterns to be exposed without the need for a photomask. In addition, can be used to fabricate photomasks for use with mask aligners such as the Suss MA6 mask aligners. Compatible with broadband photoresists. Can achieve a minimum feature size of 450 nm. Accepts wafers and mask plates up to 200 mm.  
The maskless aligner is a tool that enables fast iteration on layout designs by enabling patterns to be exposed without the need for a photomask. In addition, can be used to fabricate photomasks for use with mask aligners such as the Suss MA6 mask aligners. Compatible with broadband photoresists. Can achieve a minimum feature size of 450 nm. Accepts wafers and mask plates up to 200 mm.  
==== Suss1 MA6/BA6 Applications ====
==== Maskless Aligner Applications ====
* Maskless photolithography
* Maskless photolithography
* Photomask fabrication
* Photomask fabrication
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=== SOPs & Troubleshooting ===
=== SOPs & Troubleshooting ===
* [*placeholder link* General SOP & Troubleshooting]
* [*placeholder link* General SOP & Troubleshooting]
Manufacturer Manuals
=== Manufacturer Manuals ===
* [*placeholder link* Heidelberg MLA150 Operator Manual]
* [*placeholder link* Heidelberg MLA150 Operator Manual]


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=== Optical Lithography ===
=== Optical Lithography ===
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[Contact Mask Aligners: MA6 & MA6/BA6]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]

Latest revision as of 17:20, 26 October 2026

MLA-150 Maskless Aligner
File:*needs image*
Instrument Type Lithography
Techniques Frontside Alignment,
Backside Alignment,
Maskless lithography
Staff Manager Alex Wertheim
Staff Email alexw@caltech.edu
Staff Phone 626-395-3371
Reserve time on FBS
Request training via FBS User Dashboard
Lab Location B217 Steele
Lab Phone 626-395-1535
Manufacturer Heidelberg
Model MLA-150

Description

The maskless aligner is a tool that enables fast iteration on layout designs by enabling patterns to be exposed without the need for a photomask. In addition, can be used to fabricate photomasks for use with mask aligners such as the Suss MA6 mask aligners. Compatible with broadband photoresists. Can achieve a minimum feature size of 450 nm. Accepts wafers and mask plates up to 200 mm.

Maskless Aligner Applications

  • Maskless photolithography
  • Photomask fabrication

Resources

Manufacturer Specifications

  • 375 nm laser compatible with broadband photoresists.
  • Supports both high quality (450 nm minimum feature) and fast write modes (1 um minimum features).
  • Wafers and mask plates up to 200 mm supported.
  • Minimum chip size acceptable: 10 mm.
  • Automatic global and field alignment capability.
  • Optical and pneumatic autofocusing.


SOPs & Troubleshooting

  • [*placeholder link* General SOP & Troubleshooting]

Manufacturer Manuals

  • [*placeholder link* Heidelberg MLA150 Operator Manual]


FBS Reservation Rules:

Advanced Res (days) Limit per Res (hrs) Limit per week (hrs)
Weekday 7 4 12
Weeknight 7 6 18
Weekend 14 6 18

For reservations that DO NOT follow the reservation policy, email the tool manager BEFORE scheduling. Your reservation can be cancelled at any time by the tool manager if it does not follow the tool reservation policy.

Optical Lithography Resources

Process Recipes


Optical Lithography

Electron Beam Lithography

Ion Beam Lithography