Scriber-Breaker: Difference between revisions
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{{InstrumentInfoboxOneImage| | {{InstrumentInfoboxOneImage| | ||
|InstrumentName = Scriber-Breaker | |InstrumentName = Scriber-Breaker | ||
|HeaderColor = # | |HeaderColor = #E6E7E8 | ||
|ImageOne = Dynatex-GST-150_Scriber-Breaker.jpg | |ImageOne = Dynatex-GST-150_Scriber-Breaker.jpg | ||
|ImageTwo = | |ImageTwo = | ||
|InstrumentType = [[Equipment_List#Support | |InstrumentType = [[Equipment_List#Support_Tools|Support Tools]],<br>[[Equipment_List#Substrate_Processing|Substrate Processing]] | ||
|RoomLocation = B213 Steele | |RoomLocation = B213 Steele | ||
|LabPhone = 626-395-1537 | |LabPhone = 626-395-1537 | ||
|PrimaryStaff = [[ | |PrimaryStaff = [[Alireza Ghaffari]] | ||
|StaffEmail = | |StaffEmail = alireza@caltech.edu | ||
|StaffPhone = 626-395- | |StaffPhone = 626-395-3984 | ||
|Manufacturer = Dynatex | |Manufacturer = Dynatex | ||
|Model = GST-150 | |Model = GST-150 | ||
|Techniques = Wafer & Chip Scribing,<br>Scribe Breaking | |Techniques = Wafer & Chip Scribing,<br>Scribe Breaking | ||
|EmailList = kni- | |EmailList = kni-scriber | ||
|EmailListName = | |EmailListName = Scriber | ||
}} | }} | ||
== Description == | == Description == | ||
The scriber-breaker uses a dry scribing and breaking technique to allow cleaner separation of dies on a wafer than can be done with a wet cutting saw. Some advantages are that the elimination of deionized water protects delicate structures on the wafer surface, decreasing street sizes of existing wafers, and dicing difficult-to-manage substrates. Many compound semiconductors can be challenging when dicing, and the dry scribe | The scriber-breaker uses a dry scribing and breaking technique to allow cleaner separation of dies on a wafer than can be done with a wet cutting saw. Some advantages are that the elimination of deionized water protects delicate structures on the wafer surface, decreasing street sizes of existing wafers, and allowing for the dicing of difficult-to-manage substrates. Many compound semiconductors can be challenging when dicing, and the dry scribe-break technology is successful for such materials. | ||
===== | ===== Applications ===== | ||
* | * Scribing and/or breaking wafers | ||
== Resources == | == Resources == | ||
===== SOPs & Troubleshooting ===== | ===== SOPs & Troubleshooting ===== | ||
* [https://caltech.box.com/s/ | * [https://caltech.box.com/s/f02g7mjwi4asprd2ekiiotq6c09gp2bc Dynatex GST-150 - Operation SOP and Troubleshooting Guide] | ||
* [https://caltech.box.com/s/ | * [https://caltech.box.com/s/6sv7l95xxx8927f19sv04vcycx2p8yhq Dynatex GST-150 - Operation Quick Reference Guide] | ||
* [https://caltech.box.com/s/4yd6vvov0fk759pzh2e5dihcuipbeptc Dynatex GST-150 - Tool Change SOP - STAFF or Qualified Personel Only] | |||
===== FBS Reservation Rules:===== | |||
{| class="wikitable" | |||
|- | |||
! !! Advanced Res (days) !! Limit per Res (hrs) !! Limit per week (hrs) | |||
|- | |||
| Weekday || 7 || 4 || 12 | |||
|- | |||
| Weeknight || 7 || 6 || 18 | |||
|- | |||
| Weekend || 14 || 6 || 18 | |||
|} | |||
''' For reservations that DO NOT follow the reservation policy, email the tool manager BEFORE scheduling.''' | |||
'' Your reservation can be cancelled at any time by the tool manager if it does not follow the tool reservation policy.'' | |||
===== Manufacturer Manuals ===== | ===== Manufacturer Manuals ===== | ||
* [https://caltech.box.com/s/ | * [https://caltech.box.com/s/1cf8rglz8bj6olhm1sjr77uu885yrb5h Dynatex GST-150 Manual] | ||
* [https://caltech.box.com/s/2hbk1r4847wru8tqayxjkw0soejpvx0k Scribe & Break Theory for GST-150] | |||
== Specifications == | == Specifications == | ||
===== | ===== Specifications ===== | ||
* | * Accommodated Sizes: up to 6" wafers | ||
* Acceptable Materials: InP, GaAs, or Silicon substrates. | |||
* | |||
Latest revision as of 16:52, 2 June 2025
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Description
The scriber-breaker uses a dry scribing and breaking technique to allow cleaner separation of dies on a wafer than can be done with a wet cutting saw. Some advantages are that the elimination of deionized water protects delicate structures on the wafer surface, decreasing street sizes of existing wafers, and allowing for the dicing of difficult-to-manage substrates. Many compound semiconductors can be challenging when dicing, and the dry scribe-break technology is successful for such materials.
Applications
- Scribing and/or breaking wafers
Resources
SOPs & Troubleshooting
- Dynatex GST-150 - Operation SOP and Troubleshooting Guide
- Dynatex GST-150 - Operation Quick Reference Guide
- Dynatex GST-150 - Tool Change SOP - STAFF or Qualified Personel Only
FBS Reservation Rules:
| Advanced Res (days) | Limit per Res (hrs) | Limit per week (hrs) | |
|---|---|---|---|
| Weekday | 7 | 4 | 12 |
| Weeknight | 7 | 6 | 18 |
| Weekend | 14 | 6 | 18 |
For reservations that DO NOT follow the reservation policy, email the tool manager BEFORE scheduling. Your reservation can be cancelled at any time by the tool manager if it does not follow the tool reservation policy.
Manufacturer Manuals
Specifications
Specifications
- Accommodated Sizes: up to 6" wafers
- Acceptable Materials: InP, GaAs, or Silicon substrates.