Wedge-Wedge Wire Bonder: Difference between revisions

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{{InstrumentInfoboxOneImage|
{{InstrumentInfoboxOneImage|
|InstrumentName = Wire Bonder
|InstrumentName = Wire Bonder
|HeaderColor = #FFFFFF
|HeaderColor = #E6E7E8
|ImageOne =  
|ImageOne = Wedge-Wedge-Wire-Bonder_Westbond-7476D-79.jpg
|ImageTwo =  
|ImageTwo =  
|InstrumentType = [[Equipment_List#Support tools|Device Processing]]
|InstrumentType = [[Equipment_List#Support_Tools|Support Tools]],<br>[[Equipment_List#Device_Processing|Device Processing]]
|RoomLocation = B233 Steele
|RoomLocation = B233 Steele
|LabPhone = 626-395-5429
|LabPhone = 626-395-5429
|PrimaryStaff = [[Bert Mendoza]]
|PrimaryStaff = [[Nathan Lee]]
|StaffEmail = bertm@caltech.edu
|StaffEmail = nathslee@caltech.edu
|StaffPhone = 626-395-4075
|StaffPhone = 626-395-4075
|Manufacturer = WestBond
|Manufacturer = WestBond
|Model = 7476D-79
|Model = 7476D-79
|Techniques = Wire Bonding
|Techniques = Wire Bonding
|EmailList = kni-photolith
|EmailList = kni-wirebonder
|EmailListName = Photolithography
|EmailListName = WestBond Wire Bonder
}}
}}
== Description ==
== Description ==
Machines of this series bond aluminum or gold wires, ranging from 0.0007 to 0.002 inches in diameter, by the wedge-wedge technique. Ultrasonic energy is used to attach aluminum wire at room temperature, while adding work piece heat is used for attaching gold wire. Wire-bonding is often one of the last steps in a device fabrication process.
Machines of this series bond aluminum or gold wires, ranging from 0.0007 to 0.0020 inches in diameter, by the wedge-wedge technique. Ultrasonic energy is used to attach aluminum wire at room temperature, while adding work piece heat is used for attaching gold wire. Wire-bonding is often one of the last steps in the device fabrication process.
===== Type1 Applications =====
===== Applications =====
* Application1
* Bonding aluminum wire to a metal bond pads.
* Application2
* Aluminum wire thickness currently being used is 0.001 inch.
* Application3


== Resources ==
== Resources ==
===== SOPs & Troubleshooting =====
===== SOPs & Troubleshooting =====
* SOP Type  ([https://caltech.box.com/s/4yv8f5att77k3zq1rm6p0mqhkd8quslh Short Version] | [https://caltech.box.com/s/xwjdudqdl793gkc5kl71zez5nnc5y2xb Long Version])
* [https://caltech.box.com/s/x5q9oxso8k1rn03d12iyqdr3egytg1br WestBond - General SOP]
* [https://caltech.box.com/s/kdcnpkzlkb3sz42elrs07wq8wstr8pvr GCA 6300 Power-up SOP]
* [https://caltech.box.com/s/rx72y31eba3tnn36mq5ewwcdwpsgxmfe WestBond - Tool Change SOP]  
* [https://caltech.box.com/s/BROKEN Troubleshooting Guide]
* [https://caltech.box.com/s/l8y5e4etpes7v7vpih57w043dzvean7r WestBond - Changing the wire spool]-This presentation also give guidance on THREADING THE WIRE.
 
===== Manufacturer Manuals =====
===== Manufacturer Manuals =====
* [https://caltech.box.com/s/BROKEN Manual ]
* [https://caltech.box.com/s/rq3faoi1t59qf03l4j7bkwb8oewndsi3 WestBond 7476D Wire Bonder Manual]
* [https://caltech.box.com/s/7yfera0l0q9hpc5i4rcmameuu6h3yszs WestBond K1200D Temperature Controller Manual]
===== FBS Reservation Rules:=====
{| class="wikitable"
|-
!  !! Advanced Res (days) !! Limit per Res (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 4 || 12
|-
| Weeknight || 7 || 6 || 18
|-
| Weekend || 14 || 6 || 18
|}
'''  For reservations that DO NOT follow the reservation policy, email the tool manager BEFORE scheduling.'''
''  Your reservation can be cancelled at any time by the tool manager if it does not follow the tool reservation policy.''


== Specifications ==
== Specifications ==
===== Manufacturer Specifications =====
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/BROKEN Manufacturuer Data Sheet]
* [https://caltech.box.com/s/rq3faoi1t59qf03l4j7bkwb8oewndsi3 See - WestBond 7476D Wire Bonder Manual]
===== Mode 1 Specifications =====
* Recommended Bond Pad Requirements:
* Voltage Range: 0.5 to 30.0 kV
::1. Minimum Pad Size - 60um wide by 90um tall with 50um spacing between pads. 
* Aperture Sizes: 10 mm, 15 mm, 20 mmm, 30 mm
:::Bonding will be difficult and little room for error.
* etc.
::2. Suggested Pad Size - 120um wide by 120um tall with 50um spacing between pads (larger is better).
::3. Minimum Pad Thickness - 150nm Gold (thicker is better).
::4. Suggested Pad Thickness - 250nm Gold.

Latest revision as of 17:53, 18 February 2025

Wire Bonder
Wedge-Wedge-Wire-Bonder Westbond-7476D-79.jpg
Instrument Type Support Tools,
Device Processing
Techniques Wire Bonding
Staff Manager Nathan Lee
Staff Email nathslee@caltech.edu
Staff Phone 626-395-4075
Reserve time on FBS
Request training via FBS User Dashboard
Lab Location B233 Steele
Lab Phone 626-395-5429
Manufacturer WestBond
Model 7476D-79

Description

Machines of this series bond aluminum or gold wires, ranging from 0.0007 to 0.0020 inches in diameter, by the wedge-wedge technique. Ultrasonic energy is used to attach aluminum wire at room temperature, while adding work piece heat is used for attaching gold wire. Wire-bonding is often one of the last steps in the device fabrication process.

Applications
  • Bonding aluminum wire to a metal bond pads.
  • Aluminum wire thickness currently being used is 0.001 inch.

Resources

SOPs & Troubleshooting
Manufacturer Manuals
FBS Reservation Rules:
Advanced Res (days) Limit per Res (hrs) Limit per week (hrs)
Weekday 7 4 12
Weeknight 7 6 18
Weekend 14 6 18

For reservations that DO NOT follow the reservation policy, email the tool manager BEFORE scheduling. Your reservation can be cancelled at any time by the tool manager if it does not follow the tool reservation policy.

Specifications

Manufacturer Specifications
1. Minimum Pad Size - 60um wide by 90um tall with 50um spacing between pads.
Bonding will be difficult and little room for error.
2. Suggested Pad Size - 120um wide by 120um tall with 50um spacing between pads (larger is better).
3. Minimum Pad Thickness - 150nm Gold (thicker is better).
4. Suggested Pad Thickness - 250nm Gold.