Labline: Electron Beam Evaporator: Difference between revisions
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{{InstrumentInfoboxOneImage| | {{InstrumentInfoboxOneImage| | ||
|InstrumentName = Labline | |InstrumentName = Labline Evaporator | ||
|HeaderColor = #F2682A | |HeaderColor = #F2682A | ||
|ImageOne = KJLC-Labline-Metal-Evaporator.jpg | |ImageOne = KJLC-Labline-Metal-Evaporator.jpg | ||
|ImageTwo = | |ImageTwo = | ||
|InstrumentType = [[Equipment_List#Deposition|Deposition]] | |InstrumentType = [[Equipment_List#Deposition|Deposition]] | ||
|RoomLocation = | |RoomLocation = B235C Steele | ||
|LabPhone = 626-395-1539 | |LabPhone = 626-395-1539 | ||
|PrimaryStaff = [[Alex Wertheim]] | |PrimaryStaff = [[Alex Wertheim]] | ||
| Line 11: | Line 11: | ||
|StaffPhone = 626-395-3371 | |StaffPhone = 626-395-3371 | ||
|Manufacturer = Kurt J. Lesker Company | |Manufacturer = Kurt J. Lesker Company | ||
|Techniques = E-beam | |Model = Labline | ||
|EmailList = kni-labline | |Techniques = E-beam Evaporation,<br>Ion-Assisted Deposition (IAD),</br>Ion Milling | ||
|EmailList = kni-labline | |||
|EmailListName = Labline | |EmailListName = Labline | ||
}} | }} | ||
== Description == | == Description == | ||
The Labline electron beam evaporator system is a load-locked platform with cryopump for fast sample turnaround and user-friendly interface for precise control of film parameters during deposition. It is fitted with a Kaufman and Robinson EH 400 End-Hall permanent magnet ion source that can be used for cleaning and ion-assisted deposition during evaporation. | The Labline electron beam evaporator system is a load-locked platform with a cryopump for fast sample turnaround and a user-friendly interface for precise control of film parameters during deposition. It is fitted with a Kaufman and Robinson EH 400 End-Hall permanent magnet ion source that can be used for cleaning substrates and ion-assisted deposition during evaporation. | ||
===== Applications ===== | ===== Applications ===== | ||
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* Lift-off | * Lift-off | ||
* Non-selective etch | * Non-selective etch | ||
* Ion-assisted deposition (simultaneous etching | * Ion-assisted deposition (simultaneous etching & deposition) | ||
== Resources == | == Resources == | ||
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* [https://caltech.box.com/s/9sx2vhd9gz5rdhviexii8hj6lftvxguy KNI SOP] | * [https://caltech.box.com/s/9sx2vhd9gz5rdhviexii8hj6lftvxguy KNI SOP] | ||
* [https://caltech.box.com/s/sqfi1s85wykxzecvt0mqdv5fr27nggvc Troubleshooting Guide] | * [https://caltech.box.com/s/sqfi1s85wykxzecvt0mqdv5fr27nggvc Troubleshooting Guide] | ||
=== Tool Reservation Rules === | |||
{| class="wikitable" | |||
|- | |||
! !! Advanced Reservation (days) !! Limit per Reservation (hrs) !! Limit per week (hrs) | |||
|- | |||
| Weekday || 7 || 6 || 18 | |||
|- | |||
| Weeknight || 7 || 8 || 18 | |||
|- | |||
| Weekend || 7 || 12 || 18 | |||
|} | |||
===== Video Tutorials ===== | ===== Video Tutorials ===== | ||
* [https://youtu.be/jq5M7fkgpfM Labline Training] | * [https://youtu.be/jq5M7fkgpfM Labline Training] | ||
* [https://youtu.be/5C6It9YO_jg Sample Load & Transfer] | |||
== Specifications == | == Specifications == | ||
===== Hardware Specifications ===== | ===== Hardware Specifications ===== | ||
* Typical base pressure: 1E-7 to 1E-8 Torr | * Typical base pressure: 1E-7 to 1E-8 Torr | ||
* All dry pumping system (cryo | * All dry pumping system (cryo & scroll pumps) | ||
* Load lock equipped system with manual wafer transfer | * Load-lock-equipped system with manual wafer transfer | ||
* Evaporation Source: 1x single emitter, 4-pocket e-beam evaporation source | * Evaporation Source: 1x single emitter, 4-pocket e-beam evaporation source | ||
* 1x Argon ion source (Filament type) | * 1x Argon ion source (Filament type) | ||
* Accepts up to 1x 150mm wafer or smaller wafers/pieces | |||
== Related Instrumentation in the KNI == | |||
===== Sputtering Systems ===== | |||
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]] | |||
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]] | |||
===== Electron Beam Evaporation Systems ===== | |||
* [[CHA: Electron Beam Evaporator|CHA: Electron Beam Evaporator]] | |||
===== Chemical Vapor Deposition ===== | |||
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]] | |||
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]] | |||
Latest revision as of 23:24, 15 April 2024
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Description
The Labline electron beam evaporator system is a load-locked platform with a cryopump for fast sample turnaround and a user-friendly interface for precise control of film parameters during deposition. It is fitted with a Kaufman and Robinson EH 400 End-Hall permanent magnet ion source that can be used for cleaning substrates and ion-assisted deposition during evaporation.
Applications
- Metal deposition (Ti, Pt, Au, Al)
- Lift-off
- Non-selective etch
- Ion-assisted deposition (simultaneous etching & deposition)
Resources
SOPs & Troubleshooting
Tool Reservation Rules
| Advanced Reservation (days) | Limit per Reservation (hrs) | Limit per week (hrs) | |
|---|---|---|---|
| Weekday | 7 | 6 | 18 |
| Weeknight | 7 | 8 | 18 |
| Weekend | 7 | 12 | 18 |
Video Tutorials
Specifications
Hardware Specifications
- Typical base pressure: 1E-7 to 1E-8 Torr
- All dry pumping system (cryo & scroll pumps)
- Load-lock-equipped system with manual wafer transfer
- Evaporation Source: 1x single emitter, 4-pocket e-beam evaporation source
- 1x Argon ion source (Filament type)
- Accepts up to 1x 150mm wafer or smaller wafers/pieces