Wafer Bonder: Difference between revisions
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== Resources == | == Resources == | ||
===== SOPs ===== | ===== SOPs ===== | ||
* [https://caltech.box.com/s/jwm9iw0t64s7sznmzwjs32zjdjownts7 KNI SOP] | * [https://caltech.box.com/s/jwm9iw0t64s7sznmzwjs32zjdjownts7 KNI SB6L SOP] - Operating Instructions for the Suss SB6L Wafer Bonder | ||
===== Manufacturer Manuals ===== | ===== Manufacturer Manuals ===== | ||
* [https://caltech.box.com/s/7pj89gepa98exkv7gyy3hmzs0gv3jo72 Process Manual] | * [https://caltech.box.com/s/je95chbsbq3u14f3jchch4l79itshtb5 SB6L User Manual] - The SUSS SB6L Wafer Bonder System User Manual | ||
* [https://caltech.box.com/s/fiy5cjzv01tf7b1vglc1nl0iv4uidgmp NP12 User Manual] - The SUSS NP 12™ Plasma Activation System User Manual | |||
* [https://caltech.box.com/s/7pj89gepa98exkv7gyy3hmzs0gv3jo72 Suss Micro Tec Process Manual] -The Wafer Bonding Process Manual contains information on the different types of substrate bonding applications. | |||
Latest revision as of 21:19, 21 August 2023
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Description
The SB6L wafer bonder applies force and heat to the back side of two wafers in a vacuum chamber in order to bond them face to face. An automatic recipe can be created with control over bonding pressure, temperature, and chamber pressure as well as ramp & duration of any process step. Since heat and temperature can be controlled separately, temperature-sensitive materials such as polymers may be bonded.
Applications
- MEMS & Microelectronics Fabrication
Resources
SOPs
- KNI SB6L SOP - Operating Instructions for the Suss SB6L Wafer Bonder
Manufacturer Manuals
- SB6L User Manual - The SUSS SB6L Wafer Bonder System User Manual
- NP12 User Manual - The SUSS NP 12™ Plasma Activation System User Manual
- Suss Micro Tec Process Manual -The Wafer Bonding Process Manual contains information on the different types of substrate bonding applications.