Wafer Bonder: Difference between revisions
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|RoomLocation = B217 Steele | |RoomLocation = B217 Steele | ||
|LabPhone = 626-395-1539 | |LabPhone = 626-395-1539 | ||
|PrimaryStaff = [[ | |PrimaryStaff = [[Alireza Ghaffari]] | ||
|StaffEmail = | |StaffEmail = alireza@caltech.edu | ||
|StaffPhone = 626-395- | |StaffPhone = 626-395-3984 | ||
|Manufacturer = Suss Microtec | |Manufacturer = Suss Microtec | ||
|Model = SBL6 | |Model = SBL6 | ||
|Techniques = Pressure/Heat Bonding | |Techniques = Pressure/Heat Bonding | ||
|RequestTraining = | |RequestTraining = alireza@caltech.edu | ||
|EmailList = kni-sb6l | |EmailList = kni-sb6l | ||
|EmailListName = Wafer Bonder | |EmailListName = Wafer Bonder | ||
Revision as of 21:05, 12 May 2023
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Description
The SB6L wafer bonder applies force and heat to the back side of two wafers in a vacuum chamber in order to bond them face to face. An automatic recipe can be created with control over bonding pressure, temperature, and chamber pressure as well as ramp & duration of any process step. Since heat and temperature can be controlled separately, temperature-sensitive materials such as polymers may be bonded.
Applications
- MEMS & Microelectronics Fabrication