Provided Chemicals: Difference between revisions
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| Line 15: | Line 15: | ||
* Citric Acid | * Citric Acid | ||
* Copper Etchant | * Copper Etchant | ||
* [https://caltech.box.com/s/0z0gpft6tm297fympdbwfbeopdddvi5u Gold Etchant TFA] | |||
* [https://caltech.box.com/s/y2o9z1zt1kor0we7erdkfyruxgyp82h7 Hexamethyldisilizane (HMDS)] | * [https://caltech.box.com/s/y2o9z1zt1kor0we7erdkfyruxgyp82h7 Hexamethyldisilizane (HMDS)] | ||
* [https://caltech.box.com/s/m1icrzidd6tw2ql7zke5p9v3mq2fx0br Hydrochloric Acid] | * [https://caltech.box.com/s/m1icrzidd6tw2ql7zke5p9v3mq2fx0br Hydrochloric Acid] | ||
Revision as of 16:54, 21 July 2022
Chemicals Provided by the KNI with typical SDS
- Acetic Acid Glacial
- Acetone
- Aluminum Etchant Type A
- Aluminum Etchant Type D
- Ammonium Hydroxide (NH4OH)
- Au Etchant
- AZ 400K Photoresist Developer
- AZ 726 MIF Developer
- AZ 4620
- AZ 5214-E Photoresist
- Buffered HF Improved
- CD 26 Developer
- Chromium Etchant CR-7S
- Citric Acid
- Copper Etchant
- Gold Etchant TFA
- Hexamethyldisilizane (HMDS)
- Hydrochloric Acid
- Hydrofluoric Acid (HF)
- Hydrogen Peroxide, 30% H2O2
- Isopropyl Alcohol (IPA)
- Methanol
- Methyl Isobutyl Ketone (MIBK, 4-Methyl-2-pentanone)
- Methylene Chlorine (Dichloromethane)
- MF 319 Developer
- Nano-strip and Nanostrip 2x
- Remover PG, Photoresist Remover (N-Methyl-2-Pyrrolidone)
- PGMEA
- Phosphoric Acid (H3PO4)
- Potassium Hydroxide
- SU-8 Developer (Micro-Chem)
- Sulfuric Acid (H2SO4)
- Titanium Etchant TFT
- Tetramethylammonium Hydroxide 25% (TMAH)