Scriber-Breaker: Difference between revisions
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===== SOPs & Troubleshooting ===== | ===== SOPs & Troubleshooting ===== | ||
* [https://caltech.box.com/s/f02g7mjwi4asprd2ekiiotq6c09gp2bc Dynatex GST-150 Operation SOP and Troubleshooting Guide] | * [https://caltech.box.com/s/f02g7mjwi4asprd2ekiiotq6c09gp2bc Dynatex GST-150 Operation SOP and Troubleshooting Guide] | ||
===== Labrunr Reservation Rules:===== | |||
{| class="wikitable" | |||
|- | |||
! !! Advanced Res (days) !! Limit per Res (hrs) !! Limit per week (hrs) | |||
|- | |||
| Weekday || 7 || 4 || 12 | |||
|- | |||
| Weeknight || 7 || 6 || 18 | |||
|- | |||
| Weekend || 14 || 6 || 18 | |||
|} | |||
''' Email the tool manager for reservations that do not follow the reservation policy BEFORE scheduling the reservation.''' | |||
'' Your reservation can be cancelled any time by the tool manager if it does not follow the tool reservation policy.'' | |||
===== Manufacturer Manuals ===== | ===== Manufacturer Manuals ===== | ||
Revision as of 16:29, 2 June 2022
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Description
The scriber-breaker uses a dry scribing and breaking technique to allow cleaner separation of dies on a wafer than can be done with a wet cutting saw. Some advantages are that the elimination of deionized water protects delicate structures on the wafer surface, decreasing street sizes of existing wafers, and allowing for the dicing of difficult-to-manage substrates. Many compound semiconductors can be challenging when dicing, and the dry scribe-break technology is successful for such materials.
Applications
- Scribing and/or breaking wafers
Resources
SOPs & Troubleshooting
Labrunr Reservation Rules:
| Advanced Res (days) | Limit per Res (hrs) | Limit per week (hrs) | |
|---|---|---|---|
| Weekday | 7 | 4 | 12 |
| Weeknight | 7 | 6 | 18 |
| Weekend | 14 | 6 | 18 |
Email the tool manager for reservations that do not follow the reservation policy BEFORE scheduling the reservation. Your reservation can be cancelled any time by the tool manager if it does not follow the tool reservation policy.
Manufacturer Manuals
Specifications
Specifications
- Accommodated Sizes: up to 6" wafers
- Acceptable Materials: InP, GaAs, or Silicon substrates.