Critical Point Dryer: Difference between revisions
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== Specifications == | == Specifications == | ||
===== Manufacturer Specifications ===== | ===== Manufacturer Specifications ===== | ||
* [https://caltech.box.com/s/hkk7dboewyp9dr32i7f0fww6yaspcd3h | * [https://caltech.box.com/s/hkk7dboewyp9dr32i7f0fww6yaspcd3h Tousimis Automegasamdri 915B Manual] | ||
===== Notable Specifications ===== | ===== Notable Specifications ===== | ||
* Accommodated Sizes: Pieces & wafers up to 6" | * Accommodated Sizes: Pieces & wafers up to 6" | ||
Revision as of 21:45, 15 April 2020
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Description
For the preparation of nano-electromechanical structures as well as for the preparation of biological specimens, we operate a critical point dryer that prevents surface tension damage in nanostructures when removing them from etching or sample preparation solutions. Critical point drying is also a very common technique for the preparation of cell and bacteria samples before imaging with an electron microscope.
Applications
- Prepare biological specimens for e.g. microscopy
- Protect 3D-printed structures from surface tension damage in post-lithography processing
Resources
SOPs & Troubleshooting
Manufacturer Manual
Specifications
Manufacturer Specifications
Notable Specifications
- Accommodated Sizes: Pieces & wafers up to 6"