Critical Point Dryer: Difference between revisions
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== Resources == | == Resources == | ||
===== SOPs & Troubleshooting ===== | ===== SOPs & Troubleshooting ===== | ||
* [https://caltech.box.com/s/ | * [https://caltech.box.com/s/5hx3yl02u6yqxygs5af5gak34rok7hvk Tousimis 915B - SOP & Troubleshooting] | ||
===== Manufacturer Manual ===== | ===== Manufacturer Manual ===== | ||
* [https://caltech.box.com/s/hkk7dboewyp9dr32i7f0fww6yaspcd3h Manual] | * [https://caltech.box.com/s/hkk7dboewyp9dr32i7f0fww6yaspcd3h Manual] | ||
Revision as of 21:37, 15 April 2020
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Description
For the preparation of nano-electromechanical structures as well as for the preparation of biological specimens, we operate a critical point dryer that prevents surface tension damage in nanostructures when removing them from etching or sample preparation solutions. Critical point drying is also a very common technique for the preparation of cell and bacteria samples before imaging with an electron microscope.
Applications
- Prepare biological specimens for e.g. microscopy
- Protect 3D-printed structures from surface tension damage in post-lithography processing
Resources
SOPs & Troubleshooting
Manufacturer Manual
Specifications
Manufacturer Specifications
Notable Specifications
- Accommodated Sizes: Pieces & wafers up to 6"