Scriber-Breaker

Scriber-Breaker Instrument Type Support Tools, Substrate Processing Techniques Wafer & Chip Scribing, Scribe Breaking Staff Manager Bert Mendoza Staff Email bertm@caltech.edu Staff Phone 626-395-4075 Reserve time on FBS Request training via FBS User Dashboard Lab Location B213 Steele Lab Phone 626-395-1537 Manufacturer Dynatex Model GST-150

Description

The scriber-breaker uses a dry scribing and breaking technique to allow cleaner separation of dies on a wafer than can be done with a wet cutting saw. Some advantages are that the elimination of deionized water protects delicate structures on the wafer surface, decreasing street sizes of existing wafers, and allowing for the dicing of difficult-to-manage substrates. Many compound semiconductors can be challenging when dicing, and the dry scribe-break technology is successful for such materials.

Applications

• Scribing and/or breaking wafers

Resources

SOPs & Troubleshooting

• Dynatex GST-150 Operation SOP and Troubleshooting Guide

Manufacturer Manuals

• Dynatex GST-150 Manual
• Scribe & Break Theory for GST-150

Specifications

Specifications

• Accommodated Sizes: up to 6" wafers
• Acceptable Materials: InP, GaAs, or Silicon substrates.