Wedge-Wedge Wire Bonder: Difference between revisions
Jump to navigation
Jump to search
| Line 31: | Line 31: | ||
== Specifications == | == Specifications == | ||
===== Manufacturer Specifications ===== | ===== Manufacturer Specifications ===== | ||
* [https://caltech.box.com/s/rq3faoi1t59qf03l4j7bkwb8oewndsi3 See Manual] | * [https://caltech.box.com/s/rq3faoi1t59qf03l4j7bkwb8oewndsi3 See - WestBond 7476D Wire Bonder Manual] | ||
Revision as of 21:32, 9 March 2020
|
Description
Machines of this series bond aluminum or gold wires, ranging from 0.0007 to 0.0020 inches in diameter, by the wedge-wedge technique. Ultrasonic energy is used to attach aluminum wire at room temperature, while adding work piece heat is used for attaching gold wire. Wire-bonding is often one of the last steps in the device fabrication process.
Applications
- Bonding aluminum wire to a metal bond pad
- Bonding gold wire to a metal bond pad