Wedge-Wedge Wire Bonder: Difference between revisions
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== Resources == | == Resources == | ||
===== SOPs & Troubleshooting ===== | ===== SOPs & Troubleshooting ===== | ||
* [https://caltech.box.com/s/ | * [https://caltech.box.com/s/x5q9oxso8k1rn03d12iyqdr3egytg1br General SOP Short] | ||
===== Manufacturer Manuals ===== | ===== Manufacturer Manuals ===== | ||
* [https://caltech.box.com/s/rq3faoi1t59qf03l4j7bkwb8oewndsi3 Manual] | * [https://caltech.box.com/s/rq3faoi1t59qf03l4j7bkwb8oewndsi3 Manual] | ||
Revision as of 22:00, 10 January 2020
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Description
Machines of this series bond aluminum or gold wires, ranging from 0.0007 to 0.0020 inches in diameter, by the wedge-wedge technique. Ultrasonic energy is used to attach aluminum wire at room temperature, while adding work piece heat is used for attaching gold wire. Wire-bonding is often one of the last steps in the device fabrication process.
Applications
- Bonding aluminum wire to a metal bond pad
- Bonding gold wire to a metal bond pad