Optical Lithography Resources: Difference between revisions
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=Photolithography Resources= | =Addtional Photolithography Resources= | ||
*[https://cleanroom.byu.edu/processes#Microfab_PhotoLith BYU Photolithography Guide] | |||
https://cleanroom.byu.edu/processes#Microfab_PhotoLith | |||
*[https://kayakuam.com/techreferences/lithography-terms/ Lithography Terminology] | |||
https://kayakuam.com/techreferences/lithography-terms/ | |||
*[https://cleanroom.byu.edu/definitions Lithography Terminology 2] | |||
https://pages.mtu.edu/~microweb/chap1/ch1-4-1.htm | |||
*[https://pages.mtu.edu/~microweb/chap1/ch1-4-1.htm Resolution Limits of Photolithography] | |||
Revision as of 05:10, 4 November 2019
KNI Photoresists
Photoresists provided by KNI:
- S1813: standard positive, withstands acid etching
- AZ5214: positive and image reversal negative, good for liftoff
- SU-8: thick polymer structures
Positive Photoresist Recipes
See recipe notes for additional information on wafer cleaning and prep, edge bead removal, and spin curves.
| Resist | Wafer Prep | Spin | Thickness | Prebake | Exposure | Postbake | Flood | Development | Hardbake | Lamp | Notes |
|---|---|---|---|---|---|---|---|---|---|---|---|
| S1813 | Dehydrate on hot plate | 3000rpm | 1.5um | 115C 1min | X | - | - | X | - | Suss1 Ch1 15mW/cm^2 | Measured 10/19 (Link KNI recipe doc here) |
| AZ5214 | Dehydrate on hot plate | 2000rpm | 1um | 100C 1min | 25s | - | - | MF319 60s | - | Suss1 Ch1 15mW/cm^2 | Measured 10/19 |
Negative Photoresist Recipes
See recipe notes for additional information on wafer cleaning and prep, edge bead removal, and spin curves.
| Resist | Wafer Prep | Spin | Thickness | Prebake | Exposure | Postbake | Flood | Development | Hardbake | Lamp | Notes |
|---|---|---|---|---|---|---|---|---|---|---|---|
| AZ5214 | Dehydrate on hot plate | 2000rpm | 1.8um | 100C 1min | 12s | 110C 1min | 40s | MF319 60s | - | Suss1 Ch1 15mW/cm^2 | Measured 10/19 |
| Dehydrate on hot plate | 3500rpm | 1.4um | 100C 1min | 9s | 110C 1min | 30s | MF319 60s | - | Suss1 Ch1 15mW/cm^2 | Measured 10/19 |
SU-8 Recipes
SU-8 is available in thicknesses ranging from 500nm to 500microns. Remember to use Laurel Spinner 1.
Resist thicknesses currently provided by KNI: 2050, 2005, 2001, 2000.5
| Resist | Wafer Prep | Spin | Thickness | Prebake | Exposure | Postbake | Development | Hardbake | Lamp | Notes |
|---|---|---|---|---|---|---|---|---|---|---|
| 2050 | Dehydrate on hot plate | 3000rpm | 50um | 65C 3min 95C 9min | X | 65C 2min 95C 7min | SU-8 Developer X seconds | Optional | Suss1 Ch1 15mW/cm^2 | Measured 10/19 |
Other Photoresists
Non-KNI Photoresist Recipes
| Resist | Wafer Prep | Spin | Thickness | Prebake | Exposure | Postbake | Flood | Development | Hardbake | Lamp | Notes |
|---|---|---|---|---|---|---|---|---|---|---|---|
| nLoF 2070 | Dehydrate on hot plate | 2500rpm | 7um | 110C 90s | 12s | 110C 90s | - | AZ 729 2min | - | Suss1 Ch1 15mW/cm^2 | Measured 10/19 |