Optical Lithography Resources: Difference between revisions
No edit summary |
|||
| Line 12: | Line 12: | ||
==Positive Photoresist Recipes== | ==Positive Photoresist Recipes== | ||
See recipe notes for additional information on wafer cleaning and prep, edge bead removal, and spin curves. | |||
{| class="wikitable sortable" style="text-align: center;" | {| class="wikitable sortable" style="text-align: center;" | ||
| Line 17: | Line 19: | ||
! Resist !! Wafer Prep !! Spin !! Thickness !! Prebake !! Exposure !! Postbake !! Flood !! Development !! Hardbake !! Lamp !! Notes | ! Resist !! Wafer Prep !! Spin !! Thickness !! Prebake !! Exposure !! Postbake !! Flood !! Development !! Hardbake !! Lamp !! Notes | ||
|- | |- | ||
| S1813 || Dehydrate on hot plate || | | S1813 || Dehydrate on hot plate || 3000rpm || 1.5um || 115C 1min || X || - || - || X || - || Suss1 Ch1 15mW/cm^2 || Measured 10/19 (Link KNI recipe doc here) | ||
|- | |- | ||
| AZ5214 || Dehydrate on hot plate || 2000rpm || 1um || 100C 1min || 25s || - || - || MF319 60s || - || Suss1 Ch1 15mW/cm^2 || Measured 10/19 | | AZ5214 || Dehydrate on hot plate || 2000rpm || 1um || 100C 1min || 25s || - || - || MF319 60s || - || Suss1 Ch1 15mW/cm^2 || Measured 10/19 | ||
|} | |} | ||
==Negative Photoresist Recipes== | ==Negative Photoresist Recipes== | ||
See recipe notes for additional information on wafer cleaning and prep, edge bead removal, and spin curves. | |||
{| class="wikitable sortable" style="text-align: center;" | {| class="wikitable sortable" style="text-align: center;" | ||
| Line 35: | Line 39: | ||
==SU-8 Guide== | ==SU-8 Guide== | ||
SU-8 is available in thicknesses ranging from 500nm to 500microns. Remember to use Laurel Spinner 1. | |||
https://cleanroom.byu.edu/su8 | |||
[https://cleanroom.byu.edu/su8 BYU SU-8 Guide] | |||
Resist thicknesses currently provided by KNI: 2050, 2005, 2001, 2000.5 | |||
Revision as of 04:52, 4 November 2019
KNI Photoresists
Photoresists provided by KNI:
- S1813: standard positive, withstands acid etching
- AZ5214: positive and image reversal negative, good for liftoff
- SU-8: thick polymer structures
Positive Photoresist Recipes
See recipe notes for additional information on wafer cleaning and prep, edge bead removal, and spin curves.
| Resist | Wafer Prep | Spin | Thickness | Prebake | Exposure | Postbake | Flood | Development | Hardbake | Lamp | Notes |
|---|---|---|---|---|---|---|---|---|---|---|---|
| S1813 | Dehydrate on hot plate | 3000rpm | 1.5um | 115C 1min | X | - | - | X | - | Suss1 Ch1 15mW/cm^2 | Measured 10/19 (Link KNI recipe doc here) |
| AZ5214 | Dehydrate on hot plate | 2000rpm | 1um | 100C 1min | 25s | - | - | MF319 60s | - | Suss1 Ch1 15mW/cm^2 | Measured 10/19 |
Negative Photoresist Recipes
See recipe notes for additional information on wafer cleaning and prep, edge bead removal, and spin curves.
| Resist | Wafer Prep | Spin | Thickness | Prebake | Exposure | Postbake | Flood | Development | Hardbake | Lamp | Notes |
|---|---|---|---|---|---|---|---|---|---|---|---|
| AZ5214 | Dehydrate on hot plate | 2000rpm | 1.8um | 100C 1min | 12s | 110C 1min | 40s | MF319 60s | - | Suss1 Ch1 15mW/cm^2 | Measured 10/19 |
| Dehydrate on hot plate | 3500rpm | 1.4um | 100C 1min | 9s | 110C 1min | 30s | MF319 60s | - | Suss1 Ch1 15mW/cm^2 | Measured 10/19 |
SU-8 Guide
SU-8 is available in thicknesses ranging from 500nm to 500microns. Remember to use Laurel Spinner 1.
Resist thicknesses currently provided by KNI: 2050, 2005, 2001, 2000.5
| Resist | Wafer Prep | Spin | Thickness | Prebake | Exposure | Postbake | Flood | Development | Hardbake | Lamp | Notes |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 2050 | Dehydrate on hot plate | 3000rpm | 50um | 65C 3min 95C 9min | X | 65C 2min 95C 7min | - | SU-8 Developer X seconds | Optional | Suss1 Ch1 15mW/cm^2 | Measured 10/19 (Link KNI recipe doc here) |
Other Photoresists
resist list https://cleanroom.byu.edu/resistmanufacturers
UCSB photoresist recipes:
https://www.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#Photolithography_Recipes
https://www.nanotech.ucsb.edu/wiki/index.php/Contact_Alignment_Recipes
BYU Photoresist recipes https://cleanroom.byu.edu/photoresists
| Resist | Wafer Prep | Spin | Thickness | Prebake | Exposure | Postbake | Flood | Developer | Development | Hardbake | Mask Aligner | Wattage | Notes |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| nLoF 2070 | Dehydrate on hot plate | 2000rpm | 7um | 100C 5min | 120s | - | - | MF319 | 120s | - | Suss1 Ch1 | 15mW/cm^2 | Measured 10/19 (Link KNI recipe doc here) |
Photolithography Resources
Link to BYU photolithograph https://cleanroom.byu.edu/processes#Microfab_PhotoLith
link to definitions: https://kayakuam.com/techreferences/lithography-terms/ https://cleanroom.byu.edu/definitions
resolution https://pages.mtu.edu/~microweb/chap1/ch1-4-1.htm