Optical Lithography Resources: Difference between revisions

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! Resist !! Wafer Prep !! Spin !! Thickness !! Prebake !! Exposure !! Postbake !! Flood !! Development  !! Hardbake !! Lamp !! Notes  
! Resist !! Wafer Prep !! Spin !! Thickness !! Prebake !! Exposure !! Postbake !! Flood !! Development  !! Hardbake !! Lamp !! Notes  
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| AZ5214 || Dehydrate on hot plate || 2000rpm || 1um || 100C 1min || 12s || 110C 1min || 30s || MF319 60s || - || Suss1 Ch1 15mW/cm^2 || Measured 10/19 (Link KNI recipe doc here)
| AZ5214 || Dehydrate on hot plate || 2000rpm || 1.8um || 100C 1min || 12s || 110C 1min || 40s || MF319 60s || - || Suss1 Ch1 15mW/cm^2 || Measured 10/19 (Link KNI recipe doc here)
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| AZ5214 || Dehydrate on hot plate || 3500rpm || 1.4um || 100C 1min || 9s || 110C 1min || 30s || MF319 60s || - || Suss1 Ch1 15mW/cm^2 || Measured 10/19 (Link KNI recipe doc here)
|}
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Revision as of 03:24, 4 November 2019

Template:NOINDEX

Trove of lithography application notes:

https://www.microchemicals.com/downloads/application_notes.html

troubleshooting, photoresist procedures, liftoff, etching, etc.

KNI Photoresists

List of KNI Photoresists

  • S1813 standard positive, withstands acid etching
  • AZ5214, positive and image reversal negative, good for liftoff

Table of photoresist recipes from KNI papers:

Resist, parameters, notes

Positive

Resist Wafer Prep Spin Thickness Prebake Exposure Postbake Flood Development Hardbake Lamp Notes
S1813 Dehydrate on hot plate 2000rpm 1um 100C 1min 12s - - MF319 60s - Suss1 Ch1 15mW/cm^2 Measured 10/19 (Link KNI recipe doc here)
AZ5214 Dehydrate on hot plate 2000rpm 1um 100C 1min 25s - - MF319 60s - Suss1 Ch1 15mW/cm^2 Measured 10/19 (Link KNI recipe doc here)

Negative

Resist Wafer Prep Spin Thickness Prebake Exposure Postbake Flood Development Hardbake Lamp Notes
AZ5214 Dehydrate on hot plate 2000rpm 1.8um 100C 1min 12s 110C 1min 40s MF319 60s - Suss1 Ch1 15mW/cm^2 Measured 10/19 (Link KNI recipe doc here)
AZ5214 Dehydrate on hot plate 3500rpm 1.4um 100C 1min 9s 110C 1min 30s MF319 60s - Suss1 Ch1 15mW/cm^2 Measured 10/19 (Link KNI recipe doc here)

SU8 Guide

BYU SU-8 Guide https://cleanroom.byu.edu/su8

Sizes provided by KNI: 2050, 2005, 2001, 2000.5

Other Photoresists

resist list https://cleanroom.byu.edu/resistmanufacturers

UCSB photoresist recipes:

https://www.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#Photolithography_Recipes

https://www.nanotech.ucsb.edu/wiki/index.php/Contact_Alignment_Recipes

BYU Photoresist recipes https://cleanroom.byu.edu/photoresists


Resist Wafer Prep Spin Thickness Prebake Exposure Postbake Flood Developer Development Hardbake Mask Aligner Wattage Notes
nLoF 2070 Dehydrate on hot plate 2000rpm 7um 100C 5min 120s - - MF319 120s - Suss1 Ch1 15mW/cm^2 Measured 10/19 (Link KNI recipe doc here)

Photolithography Resources

Link to BYU photolithograph https://cleanroom.byu.edu/processes#Microfab_PhotoLith

link to definitions: https://kayakuam.com/techreferences/lithography-terms/ https://cleanroom.byu.edu/definitions

resolution https://pages.mtu.edu/~microweb/chap1/ch1-4-1.htm