Wet Chemistry Resources: Difference between revisions
Jump to navigation
Jump to search
No edit summary |
|||
Line 78: | Line 78: | ||
| KNI PECVD SiN3|| Ex || ~1000 || Highly || SiN3 || High || measured 10/19 | | KNI PECVD SiN3|| Ex || ~1000 || Highly || SiN3 || High || measured 10/19 | ||
|- | |- | ||
| KNI PECVD a-Si|| KOH || ~1000 || Highly || Si || High || | | KNI PECVD a-Si|| KOH || ~1000 || Highly || Si || High || Link to KNI member's research paper | ||
|} | |} | ||
Revision as of 09:55, 31 October 2019
cleaning procedures links, breakout
Sample Cleaning Resources
https://cleanroom.byu.edu/clean
Solvent Cleans
- Acetone, IPA
- Solvent for organics, IPA cleans remaining residues due to acetone's high evaporation rate
- Acetone, Methanol
- Similar to above except Methanol is more toxic, and a polar chemical versus IPA which is non-polar
- Acetone, Methanol, IPA
- Acetone, Methanol, IPA, DI Water
- Remover PG (50°C), IPA
- Dichloromethane, IPA
- Caution, high evaporation rate may leave residue and beakers get quickly condense water/ice
- Nanostrip?
Etching Cleans
RCA-1
Recipe steps or links
Piranha Etch
HF Dip
Plasma Cleans
Wet Etching Resources
find etch list book and other links
Research Papers and Books
External Laboratories
also find alternative:
Commercial Materials
KNI Wet Etch Recipes Table
Table of Wet Etch recipes from KNI Papers
And general table from you, not from papers, maybe from recipes?
Material | Etchant | Rate (nm/min) | Anisotropy | Selective to | Selectivity | Origin and Notes |
---|---|---|---|---|---|---|
KNI CHA Al | Al Etch Type D | ~1000 | Highly | Al | High | Transene |
KNI PECVD SiO2 | HF | ~1000 | Highly | SiO2 | High | measured 10/19 |
KNI PECVD SiN3 | Ex | ~1000 | Highly | SiN3 | High | measured 10/19 |
KNI PECVD a-Si | KOH | ~1000 | Highly | Si | High | Link to KNI member's research paper |
Other Procedures
Liftoff
Electroplating
Safety Resources
Do we have materials to link to?
https://cleanroom.byu.edu/acid_safety