Nathan S. Lee: Difference between revisions
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|StaffPhoto = Nathan-S-Lee.jpg | |StaffPhoto = Nathan-S-Lee.jpg | ||
|JobTitle = Plasma Process Engineer | |JobTitle = Plasma Process Engineer | ||
|AreasResponsibility = Reactive | |AreasResponsibility = Reactive Ion Etching,<br>Plasma-Enhanced CVD | ||
|CaltechID = nathslee | |CaltechID = nathslee | ||
|Phone = 626-395-1319 (office) | |Phone = 626-395-1319 (office) | ||
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== About == | == About == | ||
===== Role in the KNI ===== | ===== Role in the KNI ===== | ||
Sapien nec sagittis aliquam malesuada bibendum. Vel fringilla est ullamcorper eget nulla facilisi etiam dignissim diam. | |||
===== Education ===== | ===== Education ===== |
Revision as of 22:36, 28 May 2019
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About
Role in the KNI
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Education
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List of Managed Instruments
Etching
- Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE
- III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE
- Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE
- Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE
Deposition
- Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II
- Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100