Scriber-Breaker: Difference between revisions
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== Resources == | == Resources == | ||
===== SOPs & Troubleshooting ===== | ===== SOPs & Troubleshooting ===== | ||
* [https://caltech.box.com/s/ | * [https://caltech.box.com/s/1cf8rglz8bj6olhm1sjr77uu885yrb5h Operation SOP] | ||
===== Manufacturer Manuals ===== | ===== Manufacturer Manuals ===== | ||
* [https://caltech.box.com/s/1cf8rglz8bj6olhm1sjr77uu885yrb5h Dynatex GST-150 Manual] | * [https://caltech.box.com/s/1cf8rglz8bj6olhm1sjr77uu885yrb5h Dynatex GST-150 Manual] | ||
Revision as of 21:12, 28 May 2019
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Description
The scriber-breaker uses a dry scribing and breaking technique to allow cleaner separation of dies on a wafer than can be done with a wet cutting saw. Some advantages are that the elimination of deionized water protects delicate structures on the wafer surface, decreasing street sizes of existing wafers, and allowing for the dicing of difficult-to-manage substrates. Many compound semiconductors can be challenging when dicing, and the dry scribe-break technology is successful for such materials.
Applications
- Scribing and/or breaking wafers
Resources
SOPs & Troubleshooting
Manufacturer Manuals
Specifications
Notable Specifications
- Accommodated Sizes: up to 6" wafers
- Materials excluded from scribing: COMING SOON