Wet Chemistry: Difference between revisions
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| Line 25: | Line 25: | ||
* Electroplating | * Electroplating | ||
===== Chemicals Provided by the KNI ===== | ===== Chemicals Provided by the KNI ===== | ||
* | * Acetic Acid, Glacial | ||
* Acetone | * Acetone | ||
* | * Aluminum etchant A | ||
* | * Alumnium etchant D | ||
* | * Ammonium Hydroxide BDH chemicals (NH4OH) | ||
* Ammonium Hydroxide JT Baker | * Ammonium Hydroxide JT Baker | ||
* Au Etchant | * Au Etchant | ||
* AZ 400 Photoresist Developer | * AZ 400 Photoresist Developer | ||
| Line 48: | Line 36: | ||
* AZ4620 | * AZ4620 | ||
* AZ 5214 E IR | * AZ 5214 E IR | ||
* | * Buffered Hydrofluoric Acid (BHF) | ||
* CD-26 | * CD-26 | ||
* Chrome | * Chrome Etchant | ||
* Citric Acid | * Citric Acid | ||
* | * Copper Etchant | ||
* Hexamethyldisilazane (HMDS) | |||
* Hydrochloric Acid (HCl) | |||
* Hydrofluoric Acid (HF) | |||
* Hydrogen Peroxide (H<sub>2</sub>O<sub>2</sub>) | |||
* Isopropyl Alchohol (IPA) | |||
* Methanol | |||
* Methyl Iso Butyl Ketone (MIBK) | |||
* Methylene Chloride (Dichloromethane) | |||
* MF 319 | * MF 319 | ||
* Nanostrip | * Nanostrip | ||
* Nanostrip 2x | * Nanostrip 2x | ||
* PG Remover | * PG Remover | ||
* PGMEA | |||
* Phosphoric Acid (H3PO4) | |||
* Potassium Hydroxide (KOH) | |||
* SU-8 Developer | |||
* Sulfuric Acid (H2SO4) | |||
* Ti etchant | * Ti etchant | ||
* | * TetraMethylAmmoniumHydroxide (TMAH) | ||
===== Approved Chemicals ===== | ===== Approved Chemicals ===== | ||
* [[Material Safety Data Sheets (MSDS)#Liquids | See List]] | * [[Material Safety Data Sheets (MSDS)#Liquids | See List]] | ||
Revision as of 22:03, 26 May 2019
|
Description
Available Benches
- Acids
- Hydrofluoric Acid (HF)
- Bases
- Potassium Hydroxide (KOH)
- Solvents
- Electroplating
Chemicals Provided by the KNI
- Acetic Acid, Glacial
- Acetone
- Aluminum etchant A
- Alumnium etchant D
- Ammonium Hydroxide BDH chemicals (NH4OH)
- Ammonium Hydroxide JT Baker
- Au Etchant
- AZ 400 Photoresist Developer
- AZ 726 Photoresist Developer
- AZ4620
- AZ 5214 E IR
- Buffered Hydrofluoric Acid (BHF)
- CD-26
- Chrome Etchant
- Citric Acid
- Copper Etchant
- Hexamethyldisilazane (HMDS)
- Hydrochloric Acid (HCl)
- Hydrofluoric Acid (HF)
- Hydrogen Peroxide (H2O2)
- Isopropyl Alchohol (IPA)
- Methanol
- Methyl Iso Butyl Ketone (MIBK)
- Methylene Chloride (Dichloromethane)
- MF 319
- Nanostrip
- Nanostrip 2x
- PG Remover
- PGMEA
- Phosphoric Acid (H3PO4)
- Potassium Hydroxide (KOH)
- SU-8 Developer
- Sulfuric Acid (H2SO4)
- Ti etchant
- TetraMethylAmmoniumHydroxide (TMAH)