Scriber-Breaker: Difference between revisions
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* [https://caltech.box.com/s/BROKEN General SOP & Troubleshooting (COMING SOON)] | * [https://caltech.box.com/s/BROKEN General SOP & Troubleshooting (COMING SOON)] | ||
===== Manufacturer Manuals ===== | ===== Manufacturer Manuals ===== | ||
* [https://caltech.box.com/s/1cf8rglz8bj6olhm1sjr77uu885yrb5h Dynatex GTS-150 Manual | * [https://caltech.box.com/s/1cf8rglz8bj6olhm1sjr77uu885yrb5h Dynatex GTS-150 Manual] | ||
== Specifications == | == Specifications == | ||
Revision as of 20:23, 23 May 2019
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Description
The scriber-breaker uses a dry scribing and breaking technique to allow cleaner separation of dies on a wafer than can be done with a wet cutting saw. Some advantages are that the elimination of deionized water protects delicate structures on the wafer surface, decreasing street sizes of existing wafers, and dicing difficult-to-manage substrates. Many compound semiconductors can be challenging when dicing, and the dry scribe/break technology is successful for such materials.
Applications
- Scribing and/or breaking wafers
Resources
SOPs & Troubleshooting
Manufacturer Manuals
Specifications
Notable Specifications
- Accommodated Sizes: up to 6" wafers
- Materials excluded from scribing: COMING SOON