Scriber-Breaker: Difference between revisions
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(Created page with "{{InstrumentInfoboxOneImage| |InstrumentName = Scriber-Breaker |HeaderColor = #FFFFFF |ImageOne = Dynatex-GST-150_Scriber-Breaker.jpg |ImageTwo = |InstrumentType = Equipmen...") |
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|Model = GST-150 | |Model = GST-150 | ||
|Techniques = Wafer & Chip Scribing,<br>Scribe Breaking | |Techniques = Wafer & Chip Scribing,<br>Scribe Breaking | ||
|EmailList = kni- | |EmailList = kni-scriber | ||
|EmailListName = | |EmailListName = Scriber | ||
}} | }} | ||
== Description == | == Description == | ||
The scriber-breaker uses a dry scribing and breaking technique to allow cleaner separation of dies on a wafer than can be done with a wet cutting saw. Some advantages are that the elimination of deionized water protects delicate structures on the wafer surface, decreasing street sizes of existing wafers, and dicing difficult-to-manage substrates. Many compound semiconductors can be challenging when dicing, and the dry scribe/break technology is successful for such materials. | The scriber-breaker uses a dry scribing and breaking technique to allow cleaner separation of dies on a wafer than can be done with a wet cutting saw. Some advantages are that the elimination of deionized water protects delicate structures on the wafer surface, decreasing street sizes of existing wafers, and dicing difficult-to-manage substrates. Many compound semiconductors can be challenging when dicing, and the dry scribe/break technology is successful for such materials. | ||
===== | ===== Applications ===== | ||
* | * Scribing and/or breaking wafers | ||
== Resources == | == Resources == | ||
===== SOPs & Troubleshooting ===== | ===== SOPs & Troubleshooting ===== | ||
* [https://caltech.box.com/s/BROKEN SOP | * [https://caltech.box.com/s/BROKEN General SOP & Troubleshooting (COMING SOON)] | ||
===== Manufacturer Manuals ===== | ===== Manufacturer Manuals ===== | ||
* [https://caltech.box.com/s/BROKEN Manual] | * [https://caltech.box.com/s/BROKEN Manual (COMING SOON)] | ||
== Specifications == | == Specifications == | ||
===== Notable Specifications ===== | ===== Notable Specifications ===== | ||
* | * Accommodated Sizes: up to 6" wafers | ||
* | * Materials excluded from scribing: COMING SOON | ||
Revision as of 21:12, 22 May 2019
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Description
The scriber-breaker uses a dry scribing and breaking technique to allow cleaner separation of dies on a wafer than can be done with a wet cutting saw. Some advantages are that the elimination of deionized water protects delicate structures on the wafer surface, decreasing street sizes of existing wafers, and dicing difficult-to-manage substrates. Many compound semiconductors can be challenging when dicing, and the dry scribe/break technology is successful for such materials.
Applications
- Scribing and/or breaking wafers
Resources
SOPs & Troubleshooting
Manufacturer Manuals
Specifications
Notable Specifications
- Accommodated Sizes: up to 6" wafers
- Materials excluded from scribing: COMING SOON