Wafer Bonder

Suss Microtec SB6L Wafer Bonder [[image:|320px|center|]] Instrument Type Support Tools Techniques Pressure/Heat bonding Staff Manager Alex Wertheim Staff Email alexw@caltech.edu Staff Phone 626-395-3371 Reserve time on FBS Request training via FBS User Dashboard Lab Location Lab Phone 626-395-1539 Manufacturer Suss Microtec Model {{{Model}}} [[image:|320px|center|]]

Description

The SB6L wafer bonder applies force and heat to the back side of two wafers in a vacuum chamber to bond them face to face. An automatic recipe can be created with control over bonding pressure, temperature, and chamber pressure as well as ramp/duration of any process step. Since heat and temperature can be controlled separately, temperature sensitive materials such as polymers may be bonded.

Applications

• MEMS & Microelectronics fabrication