MLA-150 Maskless Aligner - Revision history

Alexw: /* Optical Lithography */

2026-10-26T17:20:00Z

Optical Lithography

← Older revision		Revision as of 17:20, 26 October 2026
Line 64:		Line 64:
	=== Optical Lithography ===		=== Optical Lithography ===
	* [[Wafer Stepper \| i-Line Wafer Stepper: GCA model 6300]]		* [[Wafer Stepper \| i-Line Wafer Stepper: GCA model 6300]]
			* [[Contact Mask Aligners: MA6 & MA6/BA6]]
	* [[CNI-PV 2.1: Nano Imprint Lithography \| Nano Imprint Lithography: NILT CNI-PV 2.1]]		* [[CNI-PV 2.1: Nano Imprint Lithography \| Nano Imprint Lithography: NILT CNI-PV 2.1]]
	* [[Nanoscribe PPGT: Microscale 3D Printer \| Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]		* [[Nanoscribe PPGT: Microscale 3D Printer \| Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]

Alexw: /* SOPs & Troubleshooting */

2026-10-26T17:18:40Z

SOPs & Troubleshooting

← Older revision		Revision as of 17:18, 26 October 2026
Line 34:		Line 34:
	=== SOPs & Troubleshooting ===		=== SOPs & Troubleshooting ===
	* [placeholder link General SOP & Troubleshooting]		* [placeholder link General SOP & Troubleshooting]
	Manufacturer Manuals		=== Manufacturer Manuals ===
	* [placeholder link Heidelberg MLA150 Operator Manual]		* [placeholder link Heidelberg MLA150 Operator Manual]

Alexw: /* Suss1 MA6/BA6 Applications */

2026-10-26T17:15:02Z

Suss1 MA6/BA6 Applications

← Older revision		Revision as of 17:15, 26 October 2026
Line 18:		Line 18:
	== Description ==		== Description ==
	The maskless aligner is a tool that enables fast iteration on layout designs by enabling patterns to be exposed without the need for a photomask. In addition, can be used to fabricate photomasks for use with mask aligners such as the Suss MA6 mask aligners. Compatible with broadband photoresists. Can achieve a minimum feature size of 450 nm. Accepts wafers and mask plates up to 200 mm.		The maskless aligner is a tool that enables fast iteration on layout designs by enabling patterns to be exposed without the need for a photomask. In addition, can be used to fabricate photomasks for use with mask aligners such as the Suss MA6 mask aligners. Compatible with broadband photoresists. Can achieve a minimum feature size of 450 nm. Accepts wafers and mask plates up to 200 mm.
	==== ~~Suss1 MA6/BA6~~ Applications ====		==== Maskless Aligner Applications ====
	* Maskless photolithography		* Maskless photolithography
	* Photomask fabrication		* Photomask fabrication

Alexw: Created page with "{{InstrumentInfoboxOneImage| |InstrumentName = MLA-150 Maskless Aligner |HeaderColor = #FFFFFF |ImageOne = needs image |ImageTwo = needs image |InstrumentType = Lithography |RoomLocation = B217 Steele |LabPhone = 626-395-1535 |PrimaryStaff = Alex Wertheim |StaffEmail = alexw@caltech.edu |StaffPhone = 626-395-3371 |Manufacturer = Heidelberg |Model = MLA-150 |Techniques = Frontside Alignment,
Backside Alignment,
Maskless lithograph..."

2026-10-26T17:14:24Z

Created page with "{{InstrumentInfoboxOneImage| |InstrumentName = MLA-150 Maskless Aligner |HeaderColor = #FFFFFF |ImageOne = *needs image* |ImageTwo = *needs image* |InstrumentType = Lithography |RoomLocation = B217 Steele |LabPhone = 626-395-1535 |PrimaryStaff = Alex Wertheim |StaffEmail = alexw@caltech.edu |StaffPhone = 626-395-3371 |Manufacturer = Heidelberg |Model = MLA-150 |Techniques = Frontside Alignment,<br>Backside Alignment,</br>Maskless lithograph..."

New page

{{InstrumentInfoboxOneImage|
|InstrumentName = MLA-150 Maskless Aligner
|HeaderColor = #FFFFFF
|ImageOne = *needs image*
|ImageTwo = *needs image*
|InstrumentType = [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B217 Steele
|LabPhone = 626-395-1535
|PrimaryStaff = Alex Wertheim
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = Heidelberg
|Model = MLA-150
|Techniques = Frontside Alignment,<br>Backside Alignment,</br>Maskless lithography
|EmailList = kni-photolith
|EmailListName = Photolithography
}}
== Description ==
The maskless aligner is a tool that enables fast iteration on layout designs by enabling patterns to be exposed without the need for a photomask. In addition, can be used to fabricate photomasks for use with mask aligners such as the Suss MA6 mask aligners. Compatible with broadband photoresists. Can achieve a minimum feature size of 450 nm. Accepts wafers and mask plates up to 200 mm.
==== Suss1 MA6/BA6 Applications ====
* Maskless photolithography
* Photomask fabrication

== Resources ==
=== Manufacturer Specifications ===
* 375 nm laser compatible with broadband photoresists.
* Supports both high quality (450 nm minimum feature) and fast write modes (1 um minimum features).
* Wafers and mask plates up to 200 mm supported.
* Minimum chip size acceptable: 10 mm.
* Automatic global and field alignment capability.
* Optical and pneumatic autofocusing.

=== SOPs & Troubleshooting ===
* [*placeholder link* General SOP & Troubleshooting]
Manufacturer Manuals
* [*placeholder link* Heidelberg MLA150 Operator Manual]

==== FBS Reservation Rules:====
{| class="wikitable"
|-
! !! Advanced Res (days) !! Limit per Res (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 4 || 12
|-
| Weeknight || 7 || 6 || 18
|-
| Weekend || 14 || 6 || 18
|}
''' For reservations that DO NOT follow the reservation policy, email the tool manager BEFORE scheduling.'''
'' Your reservation can be cancelled at any time by the tool manager if it does not follow the tool reservation policy.''

=== Optical Lithography Resources ===
* [[Optical Lithography Resources | Optical Lithography Resources Page]]
* [https://caltech.box.com/s/jsetuvrq4ec1alqvn25pz11kmtzuw8rc Laurell Spinner Cleaning SOP]
* [https://caltech.box.com/s/evjv6kciuamgl42moa8vug60dpc0gimp Laurell Spinner - Spinning Resist Video]

=== Process Recipes ===
* [https://lab.kni.caltech.edu/index.php/Process_Recipe_Library#Optical_Lithography Optical Lithography Photoresist Recipes]

== Related Instrumentation in the KNI ==
=== Optical Lithography ===
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Optical Lithography Resources]]
=== Electron Beam Lithography ===
* [[EBPG 5200: 100 kV Electron Beam Lithography|EBPG 5200: 100 kV Electron Beam Lithography]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: 100 kV Electron Beam Lithography]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]
=== Ion Beam Lithography ===
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]