The KNI Lab at Caltech - Recent changes [en]

Carbon Evaporator

Ykim3 — Sat, 03 Oct 2026 02:49:43 GMT

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	== Resources ==		== Resources ==
	===== Equipment Data =====		===== Equipment Data =====
			[[File:Carbon Thread Installation 1.jpg\|thumb\|'''Carbon Thread Installation Picture 1: Correct parallel thread installation''']]

	[[~~Image~~:Carbon~~-Evaporator-Source-~~Thread.jpg\|thumb\|~~top~~\|~~upright~~=~~0.9\|~~The Carbon Evaporator source needs to be periodically disconnected from the instrument by the user so that the carbon thread can be changed; see the SOP and notes in the SOP section on this page for instructions on how to change the thread]]		[[File:Carbon Thread Installation 2.jpg\|thumb\|'''Carbon Thread Installation Picture 2: Thread properly wound around the outer surface of the clamp'''\|alt=The Carbon Evaporator source needs to be periodically disconnected from the instrument by the user so that the carbon thread can be changed; see the SOP and notes in the SOP section on this page for instructions on how to change the thread.]]

	===== SOP & Troubleshooting =====		===== SOP & Troubleshooting =====
	* [https://caltech.app.box.com/file/2102569954808 Updated SOP (01/14/2026)]		* [https://caltech.app.box.com/file/2102569954808 Updated SOP (01/14/2026)]
	* The procedure to install a new carbon thread can be found on [https://caltech.app.box.com/file/725150718178?s=xx5psvz8u0jqszdqhh44fd5xkxmhz4a6 Manual page 47]		* The procedure to install a new carbon thread can be found on [https://caltech.app.box.com/file/725150718178?s=xx5psvz8u0jqszdqhh44fd5xkxmhz4a6 Manual page 47]
	** Note: always install as a "double thread," i.e. double the thread back over itself before installing – a thread length that is approximately twice the length of the evaporator's door width is long enough to double over and install.		* The Carbon Evaporator source needs to be periodically disconnected from the instrument by the user so that the carbon thread can be changed; see the SOP and notes in the SOP section on this page for instructions on how to change the thread.
			* Note: always install as a "double thread," i.e. double the thread back over itself before installing – a thread length that is approximately twice the length of the evaporator's door width is long enough to double over and install.

	===== Video =====		===== Video =====
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	===== Carbon Evaporation Specifications =====		===== Carbon Evaporation Specifications =====
	* Average Deposition Rate: ~1 nm per pulse, when using a double thread (i.e. a thread that is doubled over on itself; see notes in SOP section above)		* Average Deposition Rate: ~1 nm per pulse, when using a double thread (i.e. a thread that is doubled over on itself; see notes in SOP section above)
	* Monitor deposition thickness using the quartz crystal thickness monitor, or simply program the number of pulses that you want		* Monitor deposition thickness using the quartz crystal thickness monitor, or simply program the number of pulses that you want<br>
	~~<br>~~
	<br>
	== Related Instrumentation in the KNI ==		== Related Instrumentation in the KNI ==
	===== Sample Preparation for Microscopy =====		===== Sample Preparation for Microscopy =====

File:Carbon Thread Installation 2.jpg

Ykim3 — Fri, 02 Oct 2026 19:50:39 GMT

Ykim3 uploaded File:Carbon Thread Installation 2.jpg

New page

File:Carbon Thread Installation 1.jpg

Ykim3 — Fri, 02 Oct 2026 19:49:08 GMT

Ykim3 uploaded File:Carbon Thread Installation 1.jpg

New page

Carbon Thread Installation 1

III-V Etcher and Atomic Layer Etching (ALE): Oxford Instruments PlasmaPro 100 Cobra 300 ICP-RIE with ALE

Kmmckenz — Thu, 01 Oct 2026 00:21:07 GMT

Created page with "{{InstrumentInfoboxOneImage| |InstrumentName = III-V, Metal & Si Etcher |HeaderColor = #FFE2B9 |ImageOne = ICP-RIE_III-V,Metal,Si-Etcher.jpg |ImageTwo = |InstrumentType = Etching |RoomLocation = B235 Steele |LabPhone = 626-395-1532 |PrimaryStaff = Kelly McKenzie |StaffEmail = kmmckenz@caltech.edu |StaffPhone = 626-395-5732 |Manufacturer = Oxford Instruments |Techniques = pseudo-Bosch & Cryogenic Si Etch Compound Semiconductor Etching |E..."

New page

{{InstrumentInfoboxOneImage|
|InstrumentName = III-V, Metal & Si Etcher
|HeaderColor = #FFE2B9
|ImageOne = ICP-RIE_III-V,Metal,Si-Etcher.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Etching|Etching]]
|RoomLocation = B235 Steele
|LabPhone = 626-395-1532
|PrimaryStaff = [[Kelly McKenzie]]
|StaffEmail = kmmckenz@caltech.edu
|StaffPhone = 626-395-5732
|Manufacturer = Oxford Instruments
|Techniques = pseudo-Bosch & Cryogenic Si Etch Compound Semiconductor Etching
|EmailList = kni-oxfordicp
|EmailListName = Oxford ICP
|Model = Plasmalab System 100
}}
== Description ==
The III-V, Metal & Silicon inductively-coupled plasma reactive-ion etcher (ICP-RIE) is an Oxford Instruments Plasma Technology Plasmalab System 100 ICP-RIE 380 system that is optimized for the etching of compound semiconductors, metals, and silicon. In addition to a wide range of gases for etching a variety of III-V materials and metals, this system is configured for highly-selective ICP-RIE of silicon via the pseudo-Bosch process, allowing silicon etching with SF6 and C4F8 gases as well as cryogenic silicon etching with SF6 and O2 over a temperature range of -140 to 300 °C. This system supports wafer sizes up to 6 inches.
===== Applications =====
* InP grating etch
* GaAs photonics device etch
* pseudo-Bosch of silicon
* Metals etch
* Cryogenic etch of silicon (available upon request)
===== Allowed Material in Etcher =====
* Etch materials: Si, SixNy, SiO2, Ge, InP, GaAs, Al, Mo, Nb, W, Ti
* Masks: PMMA/ZEP/SPR/AZ/maN resists, SiOx/Al2O3, Cr hard masks
* Other: Metal in etch stack (not exposed to plasma)
===== Etching Gas List =====
* SF6
* C4F8
* O2
* Ar
* Cl2
* SiCl4
* CH4
* H2
* HBr

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/0qe85zye5mjlgqxorxa77tzgqgblv3ep General Use SOP]
* [https://caltech.box.com/s/681uz0b8zsv6ivy43a5ggsoydp5zlyza Oxfords reservation and use policy]
* [https://caltech.box.com/s/4qbaqhklg9bak0hlgd469d1ixxtttgxp Etcher toxic gas handling SOP]
* [https://caltech.box.com/s/jesslkguhfgdl9pud83mmtm2ruf6vb50 Power Up Oxford ICP-RIE SOP]
* [https://caltech.box.com/s/29e5taof6r80d45lfb4sgbup1k6rebpx Gas Status Board SOP]

===== Process Documents =====
* [https://caltech.box.com/s/nondj2ore8rg61tpur6hj4a3hvj8j9s5 Process Standards]
* [https://caltech.box.com/s/8zfqalb9u11l31mj3iwydofa8qecyp47 Aluminum Etch via Chlorine/Methane/Hydrogen (KNI Recipe)]
* [https://caltech.box.com/s/wybxe3urco5s6bqw5getfu7p0amxq7wx AlGaN/GaN Etch with Photoresist Mask]
* [https://caltech.box.com/s/q3sq9cwkp5dicigkj6gkvohuqtf5ivwx InP Etch]
* [https://caltech.box.com/s/4e22q4i3e5cpgjyrykf7r4bm0m0pob59 InP/ InGaAsP Laser Facet ICP Etching]
* [https://caltech.box.com/s/borba8iuvxi9qj2pe8g0vj5vo7xpta0d GaAs Via Hole Etch]
* [https://caltech.box.com/s/x0mm9bsvwc17ev3vx5ks759mwa36tpxm Selective GaAs Etch]
* [https://caltech.box.com/s/z3ibiol0xp1qwi6cyvnghbxs81p8j5q5 Silicon Waveguide Etch]
* [https://caltech.box.com/s/k8gj2bcluhy50in9m2hwz379hnkn9bdw Silicon Nitride etch]
* [https://caltech.box.com/s/4e6rskkmv1sgu9ipgfnrzeq0cguo1gc0 Hard Mask Oxide Etch]
* [https://caltech.box.com/s/daa9zeonjqphc8v963mi3lojo8me0u9j Cryo-Si Etch]
* [https://caltech.box.com/s/ymt2wqtkkjwcyw5c71f2adm2a1u041zn Etch chamber cleaning recipes]
* [https://caltech.box.com/s/3b9zbdj1uoazz7zbz8png25c2ba65vas Comparison of etch rates using different sample-fixing oils]
* [https://caltech.box.com/s/40kaaqur8ohyg55uq2pv3jqrzlgi98ts Comparison of Pseudo-Bosch ICP-RIE Etch of SiO2-SiNx]
* [https://caltech.box.com/s/wemw91xtjrh7ac34ks9ai3lv1oujivxa Al2O3 Etch in Oxford ICP and Plasmatherm RIE]

===== Review Articles =====
* [https://caltech.box.com/s/3fnc4a7qeyr1up6kth599j7ojybka2vb Guidelines for Etching Silicon MEMS Structures]
* [https://caltech.box.com/s/j61w7vr4f8cdjr64jrnz1t37oizdhl7f Etch rates for MEMS Processing - Part I]
* [https://caltech.box.com/s/ls0jl268j4at6z39g6kv8wivevpq80eh Etch Rates for MEMS Processing - Part II]
* [https://caltech.box.com/s/cetpre7d66gssbhtaicnhtovyo6ngzjv Dry Etching of Electronic Oxides, Polymers, and Semiconductors]
* [https://caltech.box.com/s/pauf384duhejuwzfwan71eam7nkvdrxw Alumina etch masks for fabrication of high-aspect-ratio silicon micropillars and nanopillars]
* [https://caltech.box.com/s/q42u5q46nmx2hm53szub556kwcrc0oih David Henry's thesis on dry etching in the KNI's tools]

===== Manufacturer Manuals =====
* [https://labrunr.caltech.edu/machinefiles/126/System%20Manual%20for%20Caltech%2094-219845.pdf Oxford III-V Metal Etcher System Manual] (login to LabRunr required)
* [https://caltech.box.com/s/gclvux5tu28rpssvwncx5sm518uhmebl Edwards QDP 80 dry vacuum pump Manual]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/f8f1fx1ffz4ql71suxsvrw0p20b2inp5 Manufacturer Data Sheet]

===== System Features =====
* Universal base console that houses the electronic sub systems, control units, pneumatics, and turbomolecular pump
* PC 2000 Operating system
* ICP process chamber with 200 mm pumping port, view port and end-point-detection ports for optical emission spectrometer and laser interferometer
* Variable height 240 mm Cryo RIE electrode
* Parameter ramping software (Not Bosch)
* 100-mTorr, temperature-stabilized capacitance manometer for process control with an active penning gauge for base pressure measurement
* 200 mm pumping port is fitted with a 200 mm variable gate valve for chamber isolation and process pressure control
* Twelve line gas pod with three non-toxic and six toxic digital mass-flow-controlled gas lines
* Alcatel 1300 l/s MAGLEV turbo pump
* Single-wafer automatic insertion load lock with soft pump option

===== System Specifications =====
* Chamber wall heating 80 °C
* Cryo table range -140 to 400 °C
* ICP 380 mm remote high-density plasma source with 5 kW RF generator and automatic matching unit close-coupled to the source
* Substrate bias control by 30 / 300 W RIE source
* Helium back-side wafer cooling

== Related Tools ==
* [https://lab.kni.caltech.edu/ICP-RIE:_Dielectric_Etcher Oxford Dielectric ICP-RIE]
* [https://lab.kni.caltech.edu/DRIE:_Bosch_%26_Cryo_ICP-RIE_for_Silicon Oxford DRIE ICP-RIE]
* [https://lab.kni.caltech.edu/Dual_Chamber_RIE:_Silicon,_III-V_Material_%26_Organics_Etcher Plasma-Therm RIE]
* [https://lab.kni.caltech.edu/XeF2_Etcher_for_Silicon XeF2 Etcher]
* [https://lab.kni.caltech.edu/Plasma-Enhanced_Chemical_Vapor_Deposition_(PECVD) Oxford PECVD]
* [https://lab.kni.caltech.edu/FlexAL_II:_Atomic_Layer_Deposition_(ALD) Oxford ALD]

Equipment List

Nathslee — Fri, 18 Sep 2026 21:17:58 GMT

Optical Lithography

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	* [[Wafer Stepper \| i-Line Wafer Stepper: GCA model 6300]]		* [[Wafer Stepper \| i-Line Wafer Stepper: GCA model 6300]]
	* [[CNI-PV 2.1: Nano Imprint Lithography \| Nano Imprint Lithography: NILT CNI-PV 2.1]]		* [[CNI-PV 2.1: Nano Imprint Lithography \| Nano Imprint Lithography: NILT CNI-PV 2.1]]
	* [[DWL-66: Direct-Write Laser System \| Direct-Write Laser System: Heidelberg Instruments DWL-66]]
	* [[Nanoscribe PPGT: Microscale 3D Printer \| Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]		* [[Nanoscribe PPGT: Microscale 3D Printer \| Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
	* [[Optical Lithography Resources]]		* [[Optical Lithography Resources]]

Contact Mask Aligners: MA6 & MA6/BA6

Derose — Fri, 18 Sep 2026 20:51:24 GMT

Related Instrumentation in the KNI

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	== Description ==		== Description ==
	[[Image:Mask-Aligner_Suss-MicroTec-MA6.jpg\|thumb\|upright=1.12\|Suss MicroTec model MA6 Mask Aligner (model MA6/BA6 is shown at the top of the infobox)]]		[[Image:Mask-Aligner_Suss-MicroTec-MA6.jpg\|thumb\|upright=1.12\|Suss MicroTec model MA6 Mask Aligner (model MA6/BA6 is shown at the top of the infobox)]]
	The contact mask aligner is a tool that enables front- and back-side alignment of photo masks to create structures as small as 500 nm on sample sizes up to 6 inches. These systems are ideally suited for rapid definition of sub-micron devices through contact printing, and enable the high-resolution alignment of several lithographic layers to define complex devices. They are typically used to define contacts and connections to the nanostructures that are defined using the KNI's other fabrication instruments (e.g. e-beam lithography)~~. The MA6/BA6 is also configured to do bond aligning in support of the Suss Microtec SB6L Wafer Bonder~~.		The contact mask aligner is a tool that enables front- and back-side alignment of photo masks to create structures as small as 500 nm on sample sizes up to 6 inches. These systems are ideally suited for rapid definition of sub-micron devices through contact printing, and enable the high-resolution alignment of several lithographic layers to define complex devices. They are typically used to define contacts and connections to the nanostructures that are defined using the KNI's other fabrication instruments (e.g. e-beam lithography).
	==== Suss1 MA6/BA6 Applications ====		==== Suss1 MA6/BA6 Applications ====
	* Front Side Flood Exposure (no mask)		* Front Side Flood Exposure (no mask)
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	* [[Wafer Stepper \| i-Line Wafer Stepper: GCA model 6300]]		* [[Wafer Stepper \| i-Line Wafer Stepper: GCA model 6300]]
	* [[CNI-PV 2.1: Nano Imprint Lithography \| Nano Imprint Lithography: NILT CNI-PV 2.1]]		* [[CNI-PV 2.1: Nano Imprint Lithography \| Nano Imprint Lithography: NILT CNI-PV 2.1]]
	* [[DWL-66: Direct-Write Laser System \| Direct-Write Laser System: Heidelberg Instruments DWL-66]]
	* [[Nanoscribe PPGT: Microscale 3D Printer \| Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]		* [[Nanoscribe PPGT: Microscale 3D Printer \| Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
	* [[Optical Lithography Resources]]		* [[Optical Lithography Resources]]
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	* [[EBPG 5000+: 100 kV Electron Beam Lithography \| EBPG 5000+: 100 kV Electron Beam Lithography]]		* [[EBPG 5000+: 100 kV Electron Beam Lithography \| EBPG 5000+: 100 kV Electron Beam Lithography]]
	* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station \| Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]		* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station \| Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]
	* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography \| Tecnai TF-20: TEM & STEM with 80-200 kV Electron Beam Lithography]]
	=== Ion Beam Lithography ===		=== Ion Beam Lithography ===
	* [[ORION NanoFab: Helium, Neon & Gallium FIB \| ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]		* [[ORION NanoFab: Helium, Neon & Gallium FIB \| ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]

Equipment List

Nathslee — Fri, 18 Sep 2026 17:22:14 GMT

Device Processing

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	===== Device Processing =====		===== Device Processing =====
	* [[Wedge-Wedge Wire Bonder \| Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]		* [[Wedge-Wedge Wire Bonder \| Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]
			* Wedge-Wedge, Ball-Wedge Wire Bonder: TPT HB05 Wire Bonder
	* [[Electrical Probing Station \| Electrical Probing Station: Cascade Microtech M150]]		* [[Electrical Probing Station \| Electrical Probing Station: Cascade Microtech M150]]

	===== Metrology =====		===== Metrology =====
	* [[Profilometer: Keyence VK-X3000 \|Optical Profilometer: Keyence VK-X3000]]		* [[Profilometer: Keyence VK-X3000 \|Optical Profilometer: Keyence VK-X3000]]

Lab Phone List

Tkimoto — Fri, 18 Sep 2026 17:16:24 GMT

Call the Staff

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	{{StaffPhoneTableItem\|		{{StaffPhoneTableItem\|
	\|StaffName = [[Alex Wertheim \| Wertheim, Alex]]		\|StaffName = [[Alex Wertheim \| Wertheim, Alex]]
	\|StaffOfficeNumber = ~~303~~ Steele		\|StaffOfficeNumber = 330 Steele
	\|StaffOfficePhone = 3371		\|StaffOfficePhone = 3371
	\|CaltechID = alexw		\|CaltechID = alexw

Carbon Evaporator

Tkimoto — Wed, 16 Sep 2026 23:17:04 GMT

Description

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	}}		}}
	== Description ==		== Description ==
	For non-conductive specimens that cannot be effectively SEM- or FIB-imaged with some combination of low voltage, low current, zero detector bias, and scanning filters, depositing a thin conductive layer of carbon on the surface can improve imaging. This carbon evaporator produces high-quality amorphous films with thicknesses ranging from sub-nm to 10 nm, with a morphology that is generally undetectable in electron microscopes. After imaging, the carbon layer can be gently removed using an O<sub>2</sub> plasma, for example, with the lab's[[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner \| Tergeo Plus Plasma Cleaner]]. The is also equipped with a metal sputtering capability (e.g., Au), which produces a fine-grained metallic layer and expands its range of applications.		For non-conductive specimens that cannot be effectively SEM- or FIB-imaged with some combination of low voltage, low current, zero detector bias, and scanning filters, depositing a thin conductive layer of carbon on the surface can improve imaging. This carbon evaporator produces high-quality amorphous films with thicknesses ranging from sub-nm to 10 nm, with a morphology that is generally undetectable in electron microscopes. After imaging, the carbon layer can be gently removed using an O<sub>2</sub> plasma, for example, with the lab's[[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner \| Tergeo Plus Plasma Cleaner]]. The system is also equipped with a metal sputtering capability (e.g., Au), which produces a fine-grained metallic layer and expands its range of applications.

	===== Applications =====		===== Applications =====

Dimension Icon: Atomic Force Microscope (AFM)

Ykim3 — Tue, 15 Sep 2026 20:40:05 GMT

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	* Electrostatic Force Microscopy (EFM) using Lift Mode		* Electrostatic Force Microscopy (EFM) using Lift Mode
	* Surface Potential measurements		* Surface Potential measurements
	* Measurements in liquid environments are possible
	* See Bruker's Scanning Probe Microscopy Techniques [https://caltech.box.com/s/i7vmlrfk4py4wp2o6wpfek1iduigvrqr Poster]		* See Bruker's Scanning Probe Microscopy Techniques [https://caltech.box.com/s/i7vmlrfk4py4wp2o6wpfek1iduigvrqr Poster]
	** The KNI does not currently have modules for Scanning Tunneling, TUNA & Conductive, Scanning Spreading Resistance, Scanning Capacitance, or Scanning Thermal modes; inquire with the [https://mmrc.caltech.edu/AFM%20Dimension%20Icon/Dimension%20Icon.html MMRC at Caltech] for access to some of these advanced techniques.		** The KNI does not currently have modules for Scanning Tunneling, TUNA & Conductive, Scanning Spreading Resistance, Scanning Capacitance, or Scanning Thermal modes; inquire with the [https://mmrc.caltech.edu/AFM%20Dimension%20Icon/Dimension%20Icon.html MMRC at Caltech] for access to some of these advanced techniques.

ORION NanoFab: Helium, Neon & Gallium FIB

Ykim3 — Tue, 15 Sep 2026 19:10:13 GMT

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	* Import CAD files as .dxf or .gds files		* Import CAD files as .dxf or .gds files
	* Writing Speed: 20 MHz		* Writing Speed: 20 MHz
	* Digital-to-Analog Converter (DAC): 16-bit		* Digital-to-Analog Converter (DAC): 16-bit<br>
	~~<br>~~
	<br>
	== Related Instrumentation in the KNI ==		== Related Instrumentation in the KNI ==
	===== Focused Ion Beam (FIB) Systems =====		===== Focused Ion Beam (FIB) Systems =====

KNI Staff Members

Tkimoto — Tue, 15 Sep 2026 00:04:11 GMT

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 |AreasResponsibility = Accounts, Billing,<br>Purchase Orders
 |Photo = Sydney-Garstang.jpg
 }}
 |-

Alireza Ghaffari

Tkimoto — Tue, 15 Sep 2026 00:03:20 GMT

Tkimoto deleted page Alireza Ghaffari content was: "__NOTOC__ {{StaffMemberInfobox |StaffName = Alireza Ghaffari |StaffPhoto = Coming Soon |JobTitle = KNI Laboratory Staff |AreasResponsibility = Foundry |CaltechID = ghaffari |Phone = 626-395-3984 (office) |OfficeLocation = 176 Watson }} == About == ===== Role in the KNI =====", and the only contributor was "Jpalmer" (talk)

Annalena Wolff

Tkimoto — Tue, 15 Sep 2026 00:03:05 GMT

Tkimoto deleted page Annalena Wolff content was: "__NOTOC__ {{StaffMemberInfobox |StaffName = Annalena Wolff, PhD |StaffPhoto = Wolff_annalena.jpg |JobTitle = Microscopist |AreasResponsibility = SEM/FIB/TEM/Microscopy |CaltechID = awolff |Phone = 626-395-5994 (office) |OfficeLocation = 303 Steele }} == About == Dr. Annalena (Lena) Wolff is the Microscopist at the Kavli Nanoscience Institute. Lena joins the KNI from the Central Analytical Research Facility (CARF) at Queensland University of Technology, where she managed, traine..."

Annalena Wolff, PhD

Tkimoto — Tue, 15 Sep 2026 00:02:48 GMT

Tkimoto deleted page Annalena Wolff, PhD content was: "{{#allow-groups:sysop}} __NOINDEX__ {{StaffMemberInfobox |StaffName = Annalena Wolff |StaffPhoto = Wolff_annalena.jpg |JobTitle = Microscopist |AreasResponsibility = SEM/FIB/TEM/Microscopy |CaltechID = awolff |Phone = 626-395-5994 (office) |OfficeLocation = 303 Steele }} == About == ===== Role in the KNI ===== ===== Education ====="

Miguel Caban-Acevedo, PhD

Tkimoto — Tue, 15 Sep 2026 00:01:31 GMT

Tkimoto deleted page Miguel Caban-Acevedo, PhD content was: "__NOTOC__ {{StaffMemberInfobox |StaffName = Miguel Caban-Acevedo, PhD |StaffPhoto = miguel-caban-acevedo.jpg |JobTitle = Microscopist |AreasResponsibility = Microscopy |CaltechID = mcaban |Phone = 626-395-5994 (office) |OfficeLocation = 303 Steele }} == About == ===== Role in the KNI ===== Miguel Caban-Acevedo is the Microscopist for the Kavli Nan...", and the only contributor was "Tkimoto" (talk)

Sirion: SEM & EDS

Ykim3 — Mon, 14 Sep 2026 20:20:51 GMT

SOPs & Troubleshooting

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	===== SOPs & Troubleshooting =====		===== SOPs & Troubleshooting =====
	* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]		* [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies]
	* [https://caltech.box.com/s/xuympwz92lbi2cps7l5mskq9sky9intd SOP & Manuals & SDS]		* [https://caltech.box.com/s/xuympwz92lbi2cps7l5mskq9sky9intd Sirion SEM SOP & Manuals & SDS]
			* [https://caltech.box.com/s/zg1ifp20khk6uv79jh3bukm46xh5gong GenISys InSPEC SOP]
	* [https://caltech.box.com/s/p9pgau696uipjrb2vdkhixynmc3es322 FEI Sirion Series SEM Manufacturer Operations Manual]		* [https://caltech.box.com/s/p9pgau696uipjrb2vdkhixynmc3es322 FEI Sirion Series SEM Manufacturer Operations Manual]

Equipment List

Ykim3 — Mon, 14 Sep 2026 20:09:08 GMT

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	===== Scanning Electron Microscopes (SEMs) =====		===== Scanning Electron Microscopes (SEMs) =====
	<!---* [[Nova 200 NanoLab: SEM & EDS \| Nova 200 NanoLab: SEM & EDS]]--->		<!---* [[Nova 200 NanoLab: SEM & EDS \| Nova 200 NanoLab: SEM & EDS]]--->
	* [[Sirion: SEM & EDS \| Sirion: FESEM & InSPEC]]		* [[Sirion: SEM & EDS \| Sirion: FESEM & GenISys InSPEC]]
	* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station \| SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]		* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station \| SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]
	* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe\|SEM, Ga-FIB, EDS, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]		* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe\|SEM, Ga-FIB, EDS, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]

Sirion: SEM & EDS

Ykim3 — Mon, 14 Sep 2026 20:08:21 GMT

Description

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	}}		}}
	== Description ==		== Description ==
	The Sirion is a field emission gun (FEG) scanning electron microscope (SEM) equipped with an immersion lens for imaging sub-10 nm features (so-called "ultra high resolution mode," UHR). While it is the KNI's oldest SEM, it is also a very steady instrument, offering a lower-cost alternative to similar high-resolution imaging that is available on the newer [[Nova_600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe \| Nova 600]] platform. The smaller Sirion chamber also allows for fast pump and vent times, which makes this SEM very useful for quick inspection. See a full list of training and educational resources for this instrument below.		The Sirion is a field emission gun (FEG) scanning electron microscope (SEM) equipped with an immersion lens for imaging sub-10 nm features (so-called "ultra high resolution mode," UHR). While it is the KNI's oldest SEM, it is also a very steady instrument, offering a lower-cost alternative to similar high-resolution imaging that is available on the newer [[Nova_600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe \| Nova 600]] platform. The smaller Sirion chamber also allows for fast pump and vent times, which makes this SEM very useful for quick inspection. The Sirion is equipped with the GenISys InSPEC upgrade kit and software, which converts a standard SEM into an integrated, high-precision metrology and inspection tool. See a full list of training and educational resources for this instrument below.

	===== SEM Applications =====		===== SEM Applications =====
	* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)		* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)
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	* Secondary Electron (SE) & Backscattered Electron (BSE) Imaging		* Secondary Electron (SE) & Backscattered Electron (BSE) Imaging
	* Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)		* Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)
			* GenISys InSPEC for high-precision metrology and inspection

	== Resources ==		== Resources ==

Equipment List

Ykim3 — Mon, 14 Sep 2026 20:03:37 GMT

Scanning Electron Microscopes (SEMs)

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	===== Scanning Electron Microscopes (SEMs) =====		===== Scanning Electron Microscopes (SEMs) =====
	<!---* [[Nova 200 NanoLab: SEM & EDS \| Nova 200 NanoLab: SEM & EDS]]--->		<!---* [[Nova 200 NanoLab: SEM & EDS \| Nova 200 NanoLab: SEM & EDS]]--->
	* [[Sirion: SEM & EDS \| Sirion: FESEM]]		* [[Sirion: SEM & EDS \| Sirion: FESEM & InSPEC]]
	* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station \| SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]		* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station \| SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]
	* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe\|SEM, Ga-FIB, EDS, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]		* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe\|SEM, Ga-FIB, EDS, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]

Sirion: SEM & EDS

Ykim3 — Mon, 14 Sep 2026 20:02:35 GMT

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	* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.		* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

	** [https://www.tedpella.com/~~sem_html~~/SEMpinmount.~~htm~~ Buy stubs without copper clips]		*[https://www.tedpella.com/SEM_html/SEMpinmount.aspx Buy stubs without copper clips]

	===== Guide to Choosing KNI SEMs & FIBs =====		===== Guide to Choosing KNI SEMs & FIBs =====
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	* ETD Grid Bias Range: -150 to 300 V		* ETD Grid Bias Range: -150 to 300 V
	* TLD Bias Range: -100 to 150 V		* TLD Bias Range: -100 to 150 V
	* Ultimate Vacuum: 3e-6 mbar		* Ultimate Vacuum: 3e-6 mbar<br>
	~~<br>~~
	<br>

Carbon Evaporator

Derose — Wed, 09 Sep 2026 15:40:03 GMT

Sample Preparation for Microscopy

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	* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner \| Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]		* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner \| Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
	* [[Carbon Evaporator \| Carbon Evaporator (Leica EM ACE600) to make samples conductive]]		* [[Carbon Evaporator \| Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
	* [[TEM Sample Preparation Equipment \| TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
	===== Scanning Electron & Ion Microscopes =====		===== Scanning Electron & Ion Microscopes =====
	* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe\|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]		* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe\|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]

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	* [[Wafer Stepper \| i-Line Wafer Stepper: GCA model 6300]]		* [[Wafer Stepper \| i-Line Wafer Stepper: GCA model 6300]]
	* [[CNI-PV 2.1: Nano Imprint Lithography \| Nano Imprint Lithography: NILT CNI-PV 2.1]]		* [[CNI-PV 2.1: Nano Imprint Lithography \| Nano Imprint Lithography: NILT CNI-PV 2.1]]
	* [[DWL-66: Direct-Write Laser System \| Direct-Write Laser System: Heidelberg Instruments DWL-66]]
	* [[Nanoscribe PPGT: Microscale 3D Printer \| Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]		* [[Nanoscribe PPGT: Microscale 3D Printer \| Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
	* [[Optical Lithography Resources]]		* [[Optical Lithography Resources]]

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	===== Scanning Electron Microscopes (SEMs) =====		===== Scanning Electron Microscopes (SEMs) =====
	<!---* [[Nova 200 NanoLab: SEM & EDS \| Nova 200 NanoLab: SEM & EDS]]--->		<!---* [[Nova 200 NanoLab: SEM & EDS \| Nova 200 NanoLab: SEM & EDS]]--->
	* [[Sirion: SEM & EDS \| Sirion: FESEM & InSPEC]]		* [[Sirion: SEM & EDS \| Sirion: FESEM & GenISys InSPEC]]
	* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station \| SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]		* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station \| SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]
	* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe\|SEM, Ga-FIB, EDS, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]		* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe\|SEM, Ga-FIB, EDS, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]

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	===== Scanning Electron Microscopes (SEMs) =====		===== Scanning Electron Microscopes (SEMs) =====
	<!---* [[Nova 200 NanoLab: SEM & EDS \| Nova 200 NanoLab: SEM & EDS]]--->		<!---* [[Nova 200 NanoLab: SEM & EDS \| Nova 200 NanoLab: SEM & EDS]]--->
	* [[Sirion: SEM & EDS \| Sirion: FESEM]]		* [[Sirion: SEM & EDS \| Sirion: FESEM & InSPEC]]
	* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station \| SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]		* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station \| SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]
	* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe\|SEM, Ga-FIB, EDS, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]		* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe\|SEM, Ga-FIB, EDS, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]

← Older revision		Revision as of 15:40, 9 September 2026
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	* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner \| Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]		* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner \| Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
	* [[Carbon Evaporator \| Carbon Evaporator (Leica EM ACE600) to make samples conductive]]		* [[Carbon Evaporator \| Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
	* [[TEM Sample Preparation Equipment \| TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
	===== Scanning Electron & Ion Microscopes =====		===== Scanning Electron & Ion Microscopes =====
	* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe\|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]		* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe\|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]