The KNI Lab at Caltech - User contributions [en]

Information on the 3D reconstruction PC

2023-09-12T00:23:49Z

Awolff: /* SOPs */

{{InstrumentInfobox|
|InstrumentName = Microscopy High Performance PC
|HeaderColor = #F5A81C
|ImageOne = MicroscopePC.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B2 242 Keck
|LabPhone = 626-395-1548
|PrimaryStaff = [[Annalena Wolff]]
|StaffEmail = awolff@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = Digital Storm
|Model = ORION NanoFab
|Techniques = 3D reconstruction, Offline processing of microscope data, Simulations for Microscopy
|RequestTraining = awolff@caltech.edu
|Slack = #high-performance-pc

}}
== Description ==
The Microscopy High Performance PC

===== Available Microscopy Programs =====
* Digital Micrograph
* Fiji / ImageJ shortcut is located on the desktop
* Dragonfly is located on the desktop
* WinCasino V2
* WinCasino V3
* SRIM
* pyPENELOPE

===== Other Available Programs =====
* Rhino7
* RhinoGrasshopper
* LycheeSlicer
* DeScribe
* Comsol Multiphysics 5.5

===== Applications =====
* Monte Carlo Simulations of electron- and ion solid interactions
* 3D reconstruction of microscopy data (FIB/SEM, TEM)
* Image post processing
* TEM data analysis
===== PC Configuration =====
* Processor: Intel Core i9-10900X (10-Core) (Boost Up to 4.5 GHz)
* Motherboard: MSI X299 PRO (Intel X299 Chipset) (Up to 4x PCI-E Devices)
* System Memory: 128GB DDR4 3200MHz Digital Storm Performance
* Power Supply: 850W Digital Storm Performance Series (Modular) (80Plus Gold)
* Storage Set 1: 1x SSD M.2 (2TB Samsung 970 EVO PLUS) (NVM Express)
* Storage Set 2: 1x Storage (2TB Seagate / Toshiba / Hitachi)
* Internet Access: High Speed Network Port (Supports High-Speed Cable/ DSL / Network Connections)
* Graphics Card(s): 1x NVIDIA RTX A4000 16GB (Professional Workstation)(Outputs: 4 x DisplayPort 1.4a)
* Sound Card: Integrated Motherboard Audio
* Extreme Cooling: H20: Stage 2: Digital Storm Vortex Liquid CPU Cooler(Dual Fan) (Fully Sealed + No Maintenance)
* Cable Management: Premium Cable Management (Strategically Routedand Organized for Airflow)
* Chassis Fans: Standard Factory Chassis Fans
* Boost Processor: Stage 1: Overclock CPU - Up to 4.5GHz via Intel Turbo
* Boost Max Technology 3.0
* Windows OS: Microsoft Windows 10 Professional (64-Bit)
* Virus Protection: Windows Defender Antivirus (Built-in to Windows)
* Surge Shield: APC 1500VA Uninterrupted Power and

== Resources ==
===== Equipment Status =====
* [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select Microscopy High Performance PC from the dropdown menu)

===== SOPs =====
* [https://caltech.box.com/s/6az94atn4i3dnd64oafyzet6t5c750k3 SOP Microscopy High Performance PC]
* [https://caltech.box.com/s/35frs7vq8ve3al73d8uyt4rq8w22ae7e SOP 3D Reconstruction via ORS Dragonfly]

Information on the 3D reconstruction PC

2023-09-12T00:21:09Z

Awolff: /* SOPs */

{{InstrumentInfobox|
|InstrumentName = Microscopy High Performance PC
|HeaderColor = #F5A81C
|ImageOne = MicroscopePC.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B2 242 Keck
|LabPhone = 626-395-1548
|PrimaryStaff = [[Annalena Wolff]]
|StaffEmail = awolff@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = Digital Storm
|Model = ORION NanoFab
|Techniques = 3D reconstruction, Offline processing of microscope data, Simulations for Microscopy
|RequestTraining = awolff@caltech.edu
|Slack = #high-performance-pc

}}
== Description ==
The Microscopy High Performance PC

===== Available Microscopy Programs =====
* Digital Micrograph
* Fiji / ImageJ shortcut is located on the desktop
* Dragonfly is located on the desktop
* WinCasino V2
* WinCasino V3
* SRIM
* pyPENELOPE

===== Other Available Programs =====
* Rhino7
* RhinoGrasshopper
* LycheeSlicer
* DeScribe
* Comsol Multiphysics 5.5

===== Applications =====
* Monte Carlo Simulations of electron- and ion solid interactions
* 3D reconstruction of microscopy data (FIB/SEM, TEM)
* Image post processing
* TEM data analysis
===== PC Configuration =====
* Processor: Intel Core i9-10900X (10-Core) (Boost Up to 4.5 GHz)
* Motherboard: MSI X299 PRO (Intel X299 Chipset) (Up to 4x PCI-E Devices)
* System Memory: 128GB DDR4 3200MHz Digital Storm Performance
* Power Supply: 850W Digital Storm Performance Series (Modular) (80Plus Gold)
* Storage Set 1: 1x SSD M.2 (2TB Samsung 970 EVO PLUS) (NVM Express)
* Storage Set 2: 1x Storage (2TB Seagate / Toshiba / Hitachi)
* Internet Access: High Speed Network Port (Supports High-Speed Cable/ DSL / Network Connections)
* Graphics Card(s): 1x NVIDIA RTX A4000 16GB (Professional Workstation)(Outputs: 4 x DisplayPort 1.4a)
* Sound Card: Integrated Motherboard Audio
* Extreme Cooling: H20: Stage 2: Digital Storm Vortex Liquid CPU Cooler(Dual Fan) (Fully Sealed + No Maintenance)
* Cable Management: Premium Cable Management (Strategically Routedand Organized for Airflow)
* Chassis Fans: Standard Factory Chassis Fans
* Boost Processor: Stage 1: Overclock CPU - Up to 4.5GHz via Intel Turbo
* Boost Max Technology 3.0
* Windows OS: Microsoft Windows 10 Professional (64-Bit)
* Virus Protection: Windows Defender Antivirus (Built-in to Windows)
* Surge Shield: APC 1500VA Uninterrupted Power and

== Resources ==
===== Equipment Status =====
* [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select Microscopy High Performance PC from the dropdown menu)

===== SOPs =====
* [https://caltech.box.com/s/35frs7vq8ve3al73d8uyt4rq8w22ae7e SOP Microscopy High Performance PC]
* [https://caltech.box.com/s/6az94atn4i3dnd64oafyzet6t5c750k3 SOP 3D Reconstruction via ORS Dragonfly]

Information on the 3D reconstruction PC

2023-06-29T20:48:28Z

Awolff:

Information on the 3D reconstruction PC

2023-06-29T20:45:02Z

Awolff:

{{InstrumentInfobox|
|InstrumentName = Microscopy High Performance PC
|HeaderColor = #F5A81C
|ImageOne = MicroscopePC.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B2 242 Keck
|LabPhone = 626-395-1548
|PrimaryStaff = [[Annalena Wolff]]
|StaffEmail = awolff@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = Digital Storm
|Model = ORION NanoFab
|Techniques = 3D reconstruction, Offline processing of microscope data, Simulations for Microscopy
|RequestTraining = awolff@caltech.edu
|Slack = #high-performance-pc

}}
== Description ==
The Microscopy High Performance PC

===== Available Microscopy Programs =====
* Digital Micrograph
* Fiji / ImageJ shortcut is located on the desktop
* Dragonfly is located on the desktop
* WinCasino V2
* WinCasino V3
* SRIM
* pyPENELOPE

===== Other Available Programs =====
* Rhino7
* RhinoGrasshopper
* LycheeSlicer
* DeScribe
* Comsol Multiphysics 5.5

===== Applications =====
* Monte Carlo Simulations of electron- and ion solid interactions
* 3D reconstruction of microscopy data (FIB/SEM, TEM)
* Image post processing
* TEM data analysis
===== PC Configuration =====
* Processor: Intel Core i9-10900X (10-Core) (Boost Up to 4.5 GHz)
* Motherboard: MSI X299 PRO (Intel X299 Chipset) (Up to 4x PCI-E Devices)
* System Memory: 128GB DDR4 3200MHz Digital Storm Performance
* Power Supply: 850W Digital Storm Performance Series (Modular) (80Plus Gold)
* Storage Set 1: 1x SSD M.2 (2TB Samsung 970 EVO PLUS) (NVM Express)
* Storage Set 2: 1x Storage (2TB Seagate / Toshiba / Hitachi)
* Internet Access: High Speed Network Port (Supports High-Speed Cable/ DSL / Network Connections)
* Graphics Card(s): 1x NVIDIA RTX A4000 16GB (Professional Workstation)(Outputs: 4 x DisplayPort 1.4a)
* Sound Card: Integrated Motherboard Audio
* Extreme Cooling: H20: Stage 2: Digital Storm Vortex Liquid CPU Cooler(Dual Fan) (Fully Sealed + No Maintenance)
* Cable Management: Premium Cable Management (Strategically Routedand Organized for Airflow)
* Chassis Fans: Standard Factory Chassis Fans
* Boost Processor: Stage 1: Overclock CPU - Up to 4.5GHz via Intel Turbo
* Boost Max Technology 3.0
vWindows OS: Microsoft Windows 10 Professional (64-Bit)
* Virus Protection: Windows Defender Antivirus (Built-in to Windows)
* Surge Shield: APC 1500VA Uninterrupted Power and

== Resources ==
===== Equipment Status =====
* [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select Microscopy High Performance PC from the dropdown menu)

===== SOPs =====
* [https://caltech.box.com/s/6az94atn4i3dnd64oafyzet6t5c750k3 SOP Microscopy High Performance PC]

Information on the 3D reconstruction PC

2023-06-29T18:35:12Z

Awolff:

{{InstrumentInfobox|
|InstrumentName = Microscopy High Performance PC
|HeaderColor = #F5A81C
|ImageOne = MicroscopePC.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B2 242 Keck
|LabPhone = 626-395-1548
|PrimaryStaff = [[Annalena Wolff]]
|StaffEmail = awolff@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = Digital Storm
|Model = ORION NanoFab
|Techniques = 3D reconstruction, Offline processing of microscope data, Simulations for Microscopy
|RequestTraining = awolff@caltech.edu
|Slack = kni-orion

}}
== Description ==
The Microscopy High Performance PC

===== Available Microscopy Programs =====
* Digital Micrograph
* Fiji / ImageJ shortcut is located on the desktop
* Dragonfly is located on the desktop
* WinCasino V2
* WinCasino V3
* SRIM
* pyPENELOPE

===== Other Available Programs =====
* Rhino7
* RhinoGrasshopper
* LycheeSlicer
* DeScribe
* Comsol Multiphysics 5.5

===== Applications =====
* Monte Carlo Simulations of electron- and ion solid interactions
* 3D reconstruction of microscopy data (FIB/SEM, TEM)
* Image post processing
* TEM data analysis
===== PC Configuration =====
* Processor: Intel Core i9-10900X (10-Core) (Boost Up to 4.5 GHz)
* Motherboard: MSI X299 PRO (Intel X299 Chipset) (Up to 4x PCI-E Devices)
* System Memory: 128GB DDR4 3200MHz Digital Storm Performance
* Power Supply: 850W Digital Storm Performance Series (Modular) (80Plus Gold)
* Storage Set 1: 1x SSD M.2 (2TB Samsung 970 EVO PLUS) (NVM Express)
* Storage Set 2: 1x Storage (2TB Seagate / Toshiba / Hitachi)
* Internet Access: High Speed Network Port (Supports High-Speed Cable/ DSL / Network Connections)
* Graphics Card(s): 1x NVIDIA RTX A4000 16GB (Professional Workstation)(Outputs: 4 x DisplayPort 1.4a)
* Sound Card: Integrated Motherboard Audio
* Extreme Cooling: H20: Stage 2: Digital Storm Vortex Liquid CPU Cooler(Dual Fan) (Fully Sealed + No Maintenance)
* Cable Management: Premium Cable Management (Strategically Routedand Organized for Airflow)
* Chassis Fans: Standard Factory Chassis Fans
* Boost Processor: Stage 1: Overclock CPU - Up to 4.5GHz via Intel Turbo
* Boost Max Technology 3.0
vWindows OS: Microsoft Windows 10 Professional (64-Bit)
* Virus Protection: Windows Defender Antivirus (Built-in to Windows)
* Surge Shield: APC 1500VA Uninterrupted Power and

== Resources ==
===== Equipment Status =====
* [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select Microscopy High Performance PC from the dropdown menu)

===== SOPs =====
* [https://caltech.box.com/s/6az94atn4i3dnd64oafyzet6t5c750k3 SOP Microscopy High Performance PC]

File:MicroscopePC.jpg

2023-06-29T18:32:44Z

Awolff:

Presentations

2023-06-29T18:21:22Z

Awolff: /* KNI Lectures/Masterclasses */

== Safety Presentations ==
===== KNI Lectures =====
* [https://caltech.box.com/s/yigdk8rmx0oi2mo2y5ob67bs7gmtq48y KNI Chemistry Procedures Review 2019]
* [https://caltech.box.com/s/yigdk8rmx0oi2mo2y5ob67bs7gmtq48y KNI Chemistry Procedures Review 2016]

== Deposition Presentations ==
===== KNI Lectures =====
* Sputtering: [https://youtu.be/y7JbzNZwZvs Intro to Sputtering] | [https://youtu.be/MlxUnwviBiI Dielectric Sputter System Training]
* Evaporation: [https://youtu.be/4K75m4V0Lq4 CHA Mk40 E-beam Evaporator Training] | [https://youtu.be/jq5M7fkgpfM KJLC Labline E-beam Evaporator Training]

===== Manufacturer Lectures =====
* Kurt J. Lesker Company: [https://caltech.box.com/s/rc2pfgyrfesythq64oy0u31o6xex3ada Intro to Vacuum Technology and Vacuum System Design] | [https://caltech.box.com/s/w93a4ygcl4lfb6hdmqvlpxchk9jbd7jr Intro to Physical Vapor Deposition and Thin Film growth]

== Microscopy Presentations ==
===== KNI Lectures/Masterclasses =====
* Sample Preparation: Principles and Best Practices
** [https://caltech.box.com/s/eov4kcyl9ende8zn8j10v92xpxus60sl Pptx Slides]
* FIB Theory (FIB): Principles, Ion Solid Interactions & their Monte Carlo Simulations
** [https://caltech.box.com/s/r1ivh1od3noc95wzrk02wp8uo1hzv39t Pptx Slides]
** [https://caltech.box.com/s/53687wsk7ydn5mj49ts68vofn68g329n Exercises]
* Helium Ion Microscopy: Principles and Applications
** [https://caltech.box.com/s/ctfv8dv2mjptm1zsjwv257x1xeyqie1q Pptx Slides]
* Scanning Electron Microscopy (SEM): Principles, Techniques & Applications
** [https://caltech.box.com/s/ofqqy2xr71v4jkqbh6nuvnhqusv7oppa Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]
* Previous Scanning Electron Microscopy (SEM): Principles, Techniques & Applications
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]
* Previous Gallium Focused Ion Beam (Ga-FIB) Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]
* Previous Helium & Neon Focused Ion Beam (He- & Ne-FIB) Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/ibe1nt5rd1u2kmvnfbjs2dj9lg28mch7 Pptx Slides] | [https://youtu.be/JXS3K8G2CVY YouTube Lecture]

===== KNI Video Tutorials =====
* SEM: [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic Alignments]
* Astigmatism Correction: [https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment]
* [https://youtu.be/4V-bE6uqHY4 Eucentric Height: What it means, When to use it & How to get there]
* [https://www.youtube.com/watch?v=V0d5fog_tcg Ga-FIB Operation Basics]
* TEM Lamella Sample Prep: [https://www.youtube.com/playlist?list=PL7Lb5X_YIzOkg3wRe6A5a5b76fFxYyT3s Playlist]
* Cutting & Imaging Cross-sections with Ga-FIB: [https://www.youtube.com/playlist?list=PL7Lb5X_YIzOnW6dD0GHeasXS6MRVIgoTA Playlist]
* Miscellaneous SEM & Ga-FIB Techniques: [https://www.youtube.com/playlist?list=PL7Lb5X_YIzOnhm1ei1YtK-uIhT1UgKP4f Playlist]
* He/Ne-FIB Techniques: [https://www.youtube.com/watch?v=tWhyT3Rq_k8&list=PL7Lb5X_YIzOl80BSOR7I6yVP5fzzX0lws Playlist]
* He/Ne-FIB Source Rebuild & Alignment: [https://www.youtube.com/watch?v=PJXiQJxdLME&list=PL7Lb5X_YIzOlOckuecIhAau_2LAqU0FzL Playlist]
* AFM Operation Basics: [https://www.youtube.com/watch?v=HIaTe0Bb5xs&list=PL7Lb5X_YIzOkKijCVBCfpfpR8Jyw02q17 Playlist]
===== Manufacturer Presentations =====
* [https://caltech.box.com/s/giewllp5pybk4mdoj7g9jdvcsdk2jlpz Atomic Force Microscopy (AFM): Bruker's presentation on Image Quality & PeakForce Tapping]
* [https://caltech.box.com/s/giewllp5pybk4mdoj7g9jdvcsdk2jlpz Atomic Force Microscopy (AFM): Bruker's presentation on Quantitative NanoMechanics (QNM)]

== Ellipsometry Presentations ==
===== KNI Video Tutorials =====
* [https://youtu.be/M4jGUP-883U Data Fitting, Part 1: Fitting Basics for Transparent Films]
* [https://youtu.be/54w-i0R4SMA Data Fitting, Part 2: Transparent Polymers]
* [https://youtu.be/l6-uTJ-V3EU Data Fitting, Part 3: Absorbing Films via B-Spline]

Presentations

2023-06-29T18:20:35Z

Awolff: /* Microscopy Presentations */

== Safety Presentations ==
===== KNI Lectures =====
* [https://caltech.box.com/s/yigdk8rmx0oi2mo2y5ob67bs7gmtq48y KNI Chemistry Procedures Review 2019]
* [https://caltech.box.com/s/yigdk8rmx0oi2mo2y5ob67bs7gmtq48y KNI Chemistry Procedures Review 2016]

== Deposition Presentations ==
===== KNI Lectures =====
* Sputtering: [https://youtu.be/y7JbzNZwZvs Intro to Sputtering] | [https://youtu.be/MlxUnwviBiI Dielectric Sputter System Training]
* Evaporation: [https://youtu.be/4K75m4V0Lq4 CHA Mk40 E-beam Evaporator Training] | [https://youtu.be/jq5M7fkgpfM KJLC Labline E-beam Evaporator Training]

===== Manufacturer Lectures =====
* Kurt J. Lesker Company: [https://caltech.box.com/s/rc2pfgyrfesythq64oy0u31o6xex3ada Intro to Vacuum Technology and Vacuum System Design] | [https://caltech.box.com/s/w93a4ygcl4lfb6hdmqvlpxchk9jbd7jr Intro to Physical Vapor Deposition and Thin Film growth]

== Microscopy Presentations ==
===== KNI Lectures/Masterclasses =====
* Sample Preparation: Principles and Best Practices
** [https://caltech.box.com/s/eov4kcyl9ende8zn8j10v92xpxus60sl Pptx Slides]
* FIB Theory (FIB): Principles, Ion Solid Interactions & their Monte Carlo Simulations
** [https://caltech.box.com/s/r1ivh1od3noc95wzrk02wp8uo1hzv39t Pptx Slides]
** [https://caltech.box.com/s/53687wsk7ydn5mj49ts68vofn68g329n Exercises]
* Helium Ion Microscopy: Principles and Applications
** [https://caltech.box.com/s/ctfv8dv2mjptm1zsjwv257x1xeyqie1q Pptx Slides]
* Scanning Electron Microscopy (SEM): Principles, Techniques & Applications
** [https://caltech.box.com/s/ofqqy2xr71v4jkqbh6nuvnhqusv7oppa Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]
* Previous Scanning Electron Microscopy (SEM): Principles, Techniques & Applications
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]
* Previous Gallium Focused Ion Beam (Ga-FIB) Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]
* Previous Helium & Neon Focused Ion Beam (He- & Ne-FIB) Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/ibe1nt5rd1u2kmvnfbjs2dj9lg28mch7 Pptx Slides] | [https://youtu.be/JXS3K8G2CVY YouTube Lecture]
===== KNI Video Tutorials =====
* SEM: [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic Alignments]
* Astigmatism Correction: [https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment]
* [https://youtu.be/4V-bE6uqHY4 Eucentric Height: What it means, When to use it & How to get there]
* [https://www.youtube.com/watch?v=V0d5fog_tcg Ga-FIB Operation Basics]
* TEM Lamella Sample Prep: [https://www.youtube.com/playlist?list=PL7Lb5X_YIzOkg3wRe6A5a5b76fFxYyT3s Playlist]
* Cutting & Imaging Cross-sections with Ga-FIB: [https://www.youtube.com/playlist?list=PL7Lb5X_YIzOnW6dD0GHeasXS6MRVIgoTA Playlist]
* Miscellaneous SEM & Ga-FIB Techniques: [https://www.youtube.com/playlist?list=PL7Lb5X_YIzOnhm1ei1YtK-uIhT1UgKP4f Playlist]
* He/Ne-FIB Techniques: [https://www.youtube.com/watch?v=tWhyT3Rq_k8&list=PL7Lb5X_YIzOl80BSOR7I6yVP5fzzX0lws Playlist]
* He/Ne-FIB Source Rebuild & Alignment: [https://www.youtube.com/watch?v=PJXiQJxdLME&list=PL7Lb5X_YIzOlOckuecIhAau_2LAqU0FzL Playlist]
* AFM Operation Basics: [https://www.youtube.com/watch?v=HIaTe0Bb5xs&list=PL7Lb5X_YIzOkKijCVBCfpfpR8Jyw02q17 Playlist]
===== Manufacturer Presentations =====
* [https://caltech.box.com/s/giewllp5pybk4mdoj7g9jdvcsdk2jlpz Atomic Force Microscopy (AFM): Bruker's presentation on Image Quality & PeakForce Tapping]
* [https://caltech.box.com/s/giewllp5pybk4mdoj7g9jdvcsdk2jlpz Atomic Force Microscopy (AFM): Bruker's presentation on Quantitative NanoMechanics (QNM)]

== Ellipsometry Presentations ==
===== KNI Video Tutorials =====
* [https://youtu.be/M4jGUP-883U Data Fitting, Part 1: Fitting Basics for Transparent Films]
* [https://youtu.be/54w-i0R4SMA Data Fitting, Part 2: Transparent Polymers]
* [https://youtu.be/l6-uTJ-V3EU Data Fitting, Part 3: Absorbing Films via B-Spline]

Presentations

2023-06-29T18:19:05Z

Awolff:

== Safety Presentations ==
===== KNI Lectures =====
* [https://caltech.box.com/s/yigdk8rmx0oi2mo2y5ob67bs7gmtq48y KNI Chemistry Procedures Review 2019]
* [https://caltech.box.com/s/yigdk8rmx0oi2mo2y5ob67bs7gmtq48y KNI Chemistry Procedures Review 2016]

== Deposition Presentations ==
===== KNI Lectures =====
* Sputtering: [https://youtu.be/y7JbzNZwZvs Intro to Sputtering] | [https://youtu.be/MlxUnwviBiI Dielectric Sputter System Training]
* Evaporation: [https://youtu.be/4K75m4V0Lq4 CHA Mk40 E-beam Evaporator Training] | [https://youtu.be/jq5M7fkgpfM KJLC Labline E-beam Evaporator Training]

===== Manufacturer Lectures =====
* Kurt J. Lesker Company: [https://caltech.box.com/s/rc2pfgyrfesythq64oy0u31o6xex3ada Intro to Vacuum Technology and Vacuum System Design] | [https://caltech.box.com/s/w93a4ygcl4lfb6hdmqvlpxchk9jbd7jr Intro to Physical Vapor Deposition and Thin Film growth]

== Microscopy Presentations ==
===== KNI Lectures/Masterclasses =====
* Sample Preparation: Principles and Best Practices
** [https://caltech.box.com/s/eov4kcyl9ende8zn8j10v92xpxus60sl Pptx Slides]
* FIB Theory (FIB): Principles, Ion Solid Interactions & their Monte Carlo Simulations
** [https://caltech.box.com/s/r1ivh1od3noc95wzrk02wp8uo1hzv39t Pptx Slides and Exercises]
* Helium Ion Microscopy: Principles and Applications
** [https://caltech.box.com/s/ctfv8dv2mjptm1zsjwv257x1xeyqie1q Pptx Slides]
* Scanning Electron Microscopy (SEM): Principles, Techniques & Applications
** [https://caltech.box.com/s/ofqqy2xr71v4jkqbh6nuvnhqusv7oppa Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]
* Previous Scanning Electron Microscopy (SEM): Principles, Techniques & Applications
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]
* Previous Gallium Focused Ion Beam (Ga-FIB) Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]
* Previous Helium & Neon Focused Ion Beam (He- & Ne-FIB) Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/ibe1nt5rd1u2kmvnfbjs2dj9lg28mch7 Pptx Slides] | [https://youtu.be/JXS3K8G2CVY YouTube Lecture]
===== KNI Video Tutorials =====
* SEM: [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic Alignments]
* Astigmatism Correction: [https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment]
* [https://youtu.be/4V-bE6uqHY4 Eucentric Height: What it means, When to use it & How to get there]
* [https://www.youtube.com/watch?v=V0d5fog_tcg Ga-FIB Operation Basics]
* TEM Lamella Sample Prep: [https://www.youtube.com/playlist?list=PL7Lb5X_YIzOkg3wRe6A5a5b76fFxYyT3s Playlist]
* Cutting & Imaging Cross-sections with Ga-FIB: [https://www.youtube.com/playlist?list=PL7Lb5X_YIzOnW6dD0GHeasXS6MRVIgoTA Playlist]
* Miscellaneous SEM & Ga-FIB Techniques: [https://www.youtube.com/playlist?list=PL7Lb5X_YIzOnhm1ei1YtK-uIhT1UgKP4f Playlist]
* He/Ne-FIB Techniques: [https://www.youtube.com/watch?v=tWhyT3Rq_k8&list=PL7Lb5X_YIzOl80BSOR7I6yVP5fzzX0lws Playlist]
* He/Ne-FIB Source Rebuild & Alignment: [https://www.youtube.com/watch?v=PJXiQJxdLME&list=PL7Lb5X_YIzOlOckuecIhAau_2LAqU0FzL Playlist]
* AFM Operation Basics: [https://www.youtube.com/watch?v=HIaTe0Bb5xs&list=PL7Lb5X_YIzOkKijCVBCfpfpR8Jyw02q17 Playlist]
===== Manufacturer Presentations =====
* [https://caltech.box.com/s/giewllp5pybk4mdoj7g9jdvcsdk2jlpz Atomic Force Microscopy (AFM): Bruker's presentation on Image Quality & PeakForce Tapping]
* [https://caltech.box.com/s/giewllp5pybk4mdoj7g9jdvcsdk2jlpz Atomic Force Microscopy (AFM): Bruker's presentation on Quantitative NanoMechanics (QNM)]

== Ellipsometry Presentations ==
===== KNI Video Tutorials =====
* [https://youtu.be/M4jGUP-883U Data Fitting, Part 1: Fitting Basics for Transparent Films]
* [https://youtu.be/54w-i0R4SMA Data Fitting, Part 2: Transparent Polymers]
* [https://youtu.be/l6-uTJ-V3EU Data Fitting, Part 3: Absorbing Films via B-Spline]

TEM Sample Preparation Equipment

2023-06-29T18:04:31Z

Awolff: /* List of Equipment Available */

{{InstrumentInfobox|
|InstrumentName = TEM Sample Prep Tools
|HeaderColor = #F5A81C
|ImageOne = Argon-Mill-Fischione-Model-1010.jpg
|ImageTwo =
|InstrumentType = [[Equipment_List#Support_Tools|Support Tools]], [[Equipment_List#Sample_Preparation_for_Microscopy|Sample Prep for Microscopy]]
|RoomLocation = B242A Keck
|LabPhone = 626-395-8908
|PrimaryStaff = [[Guy A. DeRose, PhD]]
|StaffEmail = derose@caltech.edu
|StaffPhone = 626-395-3423
|Manufacturer = Assorted (see list on page)
|Model = Assorted (see list on page)
|Techniques = Cross-Section Sample Prep, Sample Polishing, 3 mm Core Drilling, Dimpling, Argon Milling
|RequestTraining = derose@caltech.edu
|EmailList = kni-tf30
|EmailListName = TF-30
}}
== Description ==
The KNI offers a lab in the Keck sub-basement for preparing TEM samples by traditional means, often to produce cross-section specimens from a bulk sample. This typically involves the following steps:
# Glue together a stack of materials, e.g. with the surface of two samples facing each other (if the surface is what you want to observe in the TEM)
# Cut the stack into thin slices of material, in the appropriate orientation (the thin dimension here will be the same thin dimension in the TEM)
# Cut out a 3 mm circle from this thin slice using a Disk Cutter
# Polish that thin disk down to a thickness of ~100 μm
# Use a Dimpler to polish a hemispherical dimple into the middle of the disk, such that only a few microns of material remain at the thinnest portion
# Use an Argon Mill to perform the final polish of the thinnest portion, until a hole has been bored through the middle and the edges of that hole are thin enough to be electron-transparent in the TEM

== List of Equipment Available ==
[[Image:Dimpler-and-Disk-Cuttter.jpg|thumb|top|upright=1.0|The Dimpler (left) and 3 mm Disk Cutter (right)]]
[[Image:Polishing-Station-Allied-TechPrep.jpg|thumb|top|upright=1.0|The polishing station with automated handling of the polishing jig and control of its sweeping motion]]
* This area is currently under refurbishment and not available. Please contact Annalena Wolff for more information
* Low-Angle Argon Milling & Polishing Station: Fischione Model 1010 (shown in infobox image)
* Dimpler: Fischione Model 2000
* Ultrasonic Disk Cutter: Model 170
* Polishing Station: Allied TechPrep
* Polishing Station: Buehler Ecomet 3
* Low Speed Saw: Isomet
* Roll Grinder: Buehler Handimet 2
* Various polishing media & accessories:
** Media: grit paper, lapping films, polishing cloths, diamond suspensions, alumina poweders
** Accessories: tripod polisher (South Bay Technology), endpoint polisher (Fischione Model 160)

== Resources ==
===== SOPs =====
* Paper copies of SOPs are available in the lab for the Argon Ion Mill & Dimpler
===== Manufacturer Manuals =====
* [http://www.labmet.cl/Documentos/Manuales/Manual%20-%20ION%20MILL%20MODEL%201010.pdf Fischione Model 1010 Argon Ion Mill]
===== Videos =====
* [https://www.youtube.com/watch?v=NyxfiC13kQ8 Ultrasonic Disk Cutter Model 170 Operation]
 
 
== Related Instrumentation in the KNI ==
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]


===== Sample Preparation for TEM =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]

Equipment List

2023-06-29T17:56:52Z

Awolff: /* Microscopy */

'''NOTE: For EQUIPMENT TRAINING, contact the tool owner via Email for scheduling - DO NOT USE Labrunr - Training Sessions.'''

== Lithography ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]]

===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)]]
===== Optical Lithography =====
* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Optical Lithography Resources]]

== Deposition ==
===== Evaporation =====
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]]
* [[CHA: Electron Beam Evaporator | Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator]]
* [[Carbon Evaporator | Carbon: Leica EM ACE600 Carbon Evaporator]]
===== Sputtering =====
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]

===== Chemical Vapor Deposition (CVD) =====
* [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]]
===== Dielectric Packaging / Moisture Barrier =====
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]

== Etching ==
===== Dry Etching =====
* [[DRIE: Bosch & Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE]]
* [[ICP-RIE: III-V, Metal & Silicon Etcher | III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]
* [[Dual Chamber RIE: Silicon, III-V Material & Organics Etcher | Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]]
* [[XeF2 Etcher for Silicon | XeF2 Etcher for Silicon]]

===== Wet Etching =====
* [[Wet Chemistry | Available Wet Etching Techniques]]

== Microscopy ==
===== KNI Microscopy Policies =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]

===== Microscopy High Performance PC =====
*[[Information on the 3D reconstruction PC | Microscopy High Perfomance PC for 3D reconstruction and data processing]]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

===== Focused Ion Beam (FIB) Systems =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | Helium, Neon & Gallium FIB: Zeiss ORION NanoFab]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 200 NanoLab: SEM & EDS | Nova 200 NanoLab: SEM & EDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]

===== Transmission Electron Microscope (TEM) =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | TEM, STEM, EDS & HAADF: Thermo Fisher Tecnai TF-30 (50-300 kV)]]


===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]

===== Optical Characterization =====
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]

===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

== Wet Chemistry ==
===== Wet Chemistry Main page=====
* [[Wet Chemistry | Wet Chemistry page:]]
- Facilities Procedures & Safety

- Chemicals Supplied by KNI

- Chemicals Approved for use in KNI cleanroom- Safety Data Sheet (SDS) Lists

- Requesting New Chemicals for use in the KNI cleanroom

===== Wet Chemistry Safety page=====
* [[Wet Chemistry Safety | Wet Chemistry Safety page]]
- PPE Overview

-Hazardous Waste Handling and Labeling

-Decanting Chemicals

-Hot Plate Rules

-KNI Buddy System

-Secondary Containment and Other Best Practices.

===== Wet Chemistry Resources page=====
* [[Wet Chemistry Resources | Wet Chemistry Resources page]]
- Contains fabrication recipes and procedures.

== Support Tools ==
===== Equipment Status =====

===== Thermal Processing =====
* [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]]
* [[Rapid Thermal Processor | Rapid Thermal Processing: Solaris 150]]
===== Substrate Processing =====
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]
* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]
* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]
===== Device Processing =====
* [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
===== Metrology =====
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* Light Microscope Nikon L200 / Nikon Camera - [https://caltech.box.com/s/3sxmh6pt073a7qgpohgzjdl53acmr2ho Nikon L200/L200D Manual], [https://caltech.box.com/s/4fmfx7mazcdpjy0edqbgi4e1jbb7azdy Nikon L200 Operation Quick Reference]

* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]

===== Sample Preparation =====
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]

Information on the 3D reconstruction PC

2023-06-29T17:51:32Z

Awolff:

{{InstrumentInfobox|
|InstrumentName = Microscopy High Performance PC
|HeaderColor = #F5A81C
|ImageOne = Nanocoil-Inductor_Matthew-S-Hunt.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B2 242 Keck
|LabPhone = 626-395-1548
|PrimaryStaff = [[Annalena Wolff]]
|StaffEmail = awolff@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = Digital Storm
|Model = ORION NanoFab
|Techniques = 3D reconstruction, Offline processing of microscope data, Simulations for Microscopy
|RequestTraining = awolff@caltech.edu
|Slack = kni-orion

}}
== Description ==
The Microscopy High Performance PC

===== Available Microscopy Programs =====
* Digital Micrograph
* Fiji / ImageJ shortcut is located on the desktop
* Dragonfly is located on the desktop
* WinCasino V2
* WinCasino V3
* SRIM
* pyPENELOPE

===== Other Available Programs =====
* Rhino7
* RhinoGrasshopper
* LycheeSlicer
* DeScribe
* Comsol Multiphysics 5.5

===== Applications =====
* Monte Carlo Simulations of electron- and ion solid interactions
* 3D reconstruction of microscopy data (FIB/SEM, TEM)
* Image post processing
* TEM data analysis
===== PC Configuration =====
* Processor: Intel Core i9-10900X (10-Core) (Boost Up to 4.5 GHz)
* Motherboard: MSI X299 PRO (Intel X299 Chipset) (Up to 4x PCI-E Devices)
* System Memory: 128GB DDR4 3200MHz Digital Storm Performance
* Power Supply: 850W Digital Storm Performance Series (Modular) (80Plus Gold)
* Storage Set 1: 1x SSD M.2 (2TB Samsung 970 EVO PLUS) (NVM Express)
* Storage Set 2: 1x Storage (2TB Seagate / Toshiba / Hitachi)
* Internet Access: High Speed Network Port (Supports High-Speed Cable/ DSL / Network Connections)
* Graphics Card(s): 1x NVIDIA RTX A4000 16GB (Professional Workstation)(Outputs: 4 x DisplayPort 1.4a)
* Sound Card: Integrated Motherboard Audio
* Extreme Cooling: H20: Stage 2: Digital Storm Vortex Liquid CPU Cooler(Dual Fan) (Fully Sealed + No Maintenance)
* Cable Management: Premium Cable Management (Strategically Routedand Organized for Airflow)
* Chassis Fans: Standard Factory Chassis Fans
* Boost Processor: Stage 1: Overclock CPU - Up to 4.5GHz via Intel Turbo
* Boost Max Technology 3.0
vWindows OS: Microsoft Windows 10 Professional (64-Bit)
* Virus Protection: Windows Defender Antivirus (Built-in to Windows)
* Surge Shield: APC 1500VA Uninterrupted Power and

== Resources ==
===== Equipment Status =====
* [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select Microscopy High Performance PC from the dropdown menu)

===== SOPs =====
* [https://caltech.box.com/s/6az94atn4i3dnd64oafyzet6t5c750k3 SOP Microscopy High Performance PC]

Information on the 3D reconstruction PC

2023-06-29T17:12:55Z

Awolff:

PC configuration
Processor: Intel Core i9-10900X (10-Core) (Boost Up to 4.5 GHz) Motherboard: MSI X299 PRO (Intel X299 Chipset) (Up to 4x PCI-E De-
vices)
System Memory: 128GB DDR4 3200MHz Digital Storm Performance Power Supply: 850W Digital Storm Performance Series (Modular) (80
Plus Gold)
Storage Set 1: 1x SSD M.2 (2TB Samsung 970 EVO PLUS) (NVM Ex-
press)
Storage Set 2: 1x Storage (2TB Seagate / Toshiba / Hitachi)
Internet Access: High Speed Network Port (Supports High-Speed Ca-
ble / DSL / Network Connections)
Graphics Card(s): 1x NVIDIA RTX A4000 16GB (Professional Worksta-
tion) (Outputs: 4 x DisplayPort 1.4a)
Sound Card: Integrated Motherboard Audio
ExtremeCooling: H20:Stage2:DigitalStormVortexLiquidCPUCooler
(Dual Fan) (Fully Sealed + No Maintenance)
CableManagement: PremiumCableManagement(StrategicallyRouted
and Organized for Airflow)
Chassis Fans: Standard Factory Chassis Fans
BoostProcessor: Stage1:OverclockCPU-Upto4.5GHzviaIntelTurbo
Boost Max Technology 3.0
Windows OS: Microsoft Windows 10 Professional (64-Bit)
Virus Protection: Windows Defender Antivirus (Built-in to Windows) SurgeShield: APC1500VAUninterruptedPowerandSurgeConditioner
- BX1500M - (NOTE: Ships VIA Ground ONLY)

Available Programs Microscopy Programs
Digital Micrograph
Fiji / ImageJ shortcut is located on the desktop Dragonfly is located on the desktop WinCasino V2
WinCasino V3
SRIM
pyPENELOPE
DesignPrograms
Rhino7 RhinoGrasshopper LycheeSlicer DeScribe
Other Simulation software
Comsol Multiphysics 5.5

Information on the 3D reconstruction PC

2023-06-29T17:11:46Z

Awolff: Created page with "THis is the 3D PC"

THis is the 3D PC

Equipment List

2023-06-29T17:09:07Z

Awolff: /* Microscopy */

'''NOTE: For EQUIPMENT TRAINING, contact the tool owner via Email for scheduling - DO NOT USE Labrunr - Training Sessions.'''

== Lithography ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]]

===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)]]
===== Optical Lithography =====
* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Optical Lithography Resources]]

== Deposition ==
===== Evaporation =====
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]]
* [[CHA: Electron Beam Evaporator | Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator]]
* [[Carbon Evaporator | Carbon: Leica EM ACE600 Carbon Evaporator]]
===== Sputtering =====
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]

===== Chemical Vapor Deposition (CVD) =====
* [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]]
===== Dielectric Packaging / Moisture Barrier =====
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]

== Etching ==
===== Dry Etching =====
* [[DRIE: Bosch & Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE]]
* [[ICP-RIE: III-V, Metal & Silicon Etcher | III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]
* [[Dual Chamber RIE: Silicon, III-V Material & Organics Etcher | Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]]
* [[XeF2 Etcher for Silicon | XeF2 Etcher for Silicon]]

===== Wet Etching =====
* [[Wet Chemistry | Available Wet Etching Techniques]]

== Microscopy ==
===== KNI Microscopy Policies =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]

===== Microscopy High Performance PC =====
*[[Information on the 3D reconstruction PC | Consult this page for information on the PC as well as available offline processing programs]]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

===== Focused Ion Beam (FIB) Systems =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | Helium, Neon & Gallium FIB: Zeiss ORION NanoFab]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 200 NanoLab: SEM & EDS | Nova 200 NanoLab: SEM & EDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]

===== Transmission Electron Microscope (TEM) =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | TEM, STEM, EDS & HAADF: Thermo Fisher Tecnai TF-30 (50-300 kV)]]


===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]

===== Optical Characterization =====
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]

===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

== Wet Chemistry ==
===== Wet Chemistry Main page=====
* [[Wet Chemistry | Wet Chemistry page:]]
- Facilities Procedures & Safety

- Chemicals Supplied by KNI

- Chemicals Approved for use in KNI cleanroom- Safety Data Sheet (SDS) Lists

- Requesting New Chemicals for use in the KNI cleanroom

===== Wet Chemistry Safety page=====
* [[Wet Chemistry Safety | Wet Chemistry Safety page]]
- PPE Overview

-Hazardous Waste Handling and Labeling

-Decanting Chemicals

-Hot Plate Rules

-KNI Buddy System

-Secondary Containment and Other Best Practices.

===== Wet Chemistry Resources page=====
* [[Wet Chemistry Resources | Wet Chemistry Resources page]]
- Contains fabrication recipes and procedures.

== Support Tools ==
===== Equipment Status =====

===== Thermal Processing =====
* [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]]
* [[Rapid Thermal Processor | Rapid Thermal Processing: Solaris 150]]
===== Substrate Processing =====
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]
* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]
* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]
===== Device Processing =====
* [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
===== Metrology =====
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* Light Microscope Nikon L200 / Nikon Camera - [https://caltech.box.com/s/3sxmh6pt073a7qgpohgzjdl53acmr2ho Nikon L200/L200D Manual], [https://caltech.box.com/s/4fmfx7mazcdpjy0edqbgi4e1jbb7azdy Nikon L200 Operation Quick Reference]

* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]

===== Sample Preparation =====
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]

Equipment List

2022-06-29T22:16:46Z

Awolff: /* Scanning Electron Microscopes (SEMs) */

'''NOTE: For EQUIPMENT TRAINING, contact the tool owner via Email for scheduling - DO NOT USE Labrunr - Training Sessions.'''

== Lithography ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]]

===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)]]
===== Optical Lithography =====
* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Optical Lithography Resources]]

== Deposition ==
===== Evaporation =====
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]]
* [[CHA: Electron Beam Evaporator | Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator]]
* [[Carbon Evaporator | Carbon: Leica EM ACE600 Carbon Evaporator]]
===== Sputtering =====
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]

===== Chemical Vapor Deposition (CVD) =====
* [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]]
===== Dielectric Packaging / Moisture Barrier =====
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]

== Etching ==
===== Dry Etching =====
* [[DRIE: Bosch & Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE]]
* [[ICP-RIE: III-V, Metal & Silicon Etcher | III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]
* [[Dual Chamber RIE: Silicon, III-V Material & Organics Etcher | Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]]
* [[XeF2 Etcher for Silicon | XeF2 Etcher for Silicon]]

===== Wet Etching =====
* [[Wet Chemistry | Available Wet Etching Techniques]]

== Microscopy ==
===== KNI Microscopy Policies =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

===== Focused Ion Beam (FIB) Systems =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | Helium, Neon & Gallium FIB: Zeiss ORION NanoFab]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]

===== Transmission Electron Microscope (TEM) =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | TEM, STEM, EDS & HAADF: Thermo Fisher Tecnai TF-30 (50-300 kV)]]


===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]

===== Optical Characterization =====
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]

===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

== Wet Chemistry ==
===== Wet Chemistry Main page=====
* [[Wet Chemistry | Wet Chemistry page:]]
- Facilities Procedures & Safety

- Chemicals Supplied by KNI

- Chemicals Approved for use in KNI cleanroom- Safety Data Sheet (SDS) Lists

- Requesting New Chemicals for use in the KNI cleanroom

===== Wet Chemistry Safety page=====
* [[Wet Chemistry Safety | Wet Chemistry Safety page]]
- PPE Overview

-Hazardous Waste Handling and Labeling

-Decanting Chemicals

-Hot Plate Rules

-KNI Buddy System

-Secondary Containment and Other Best Practices.

===== Wet Chemistry Resources page=====
* [[Wet Chemistry Resources | Wet Chemistry Resources page]]
- Contains fabrication recipes and procedures.

== Support Tools ==
===== Laboratory Data =====
* [https://caltech.box.com/s/cl3ujgau2afl45joem7mg15e0oyxcgab General Laboratory Pass-down status information]
===== Thermal Processing =====
* [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]]

===== Substrate Processing =====
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]
* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]
* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]
===== Device Processing =====
* [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
===== Metrology =====
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]

===== Sample Preparation =====
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]

Equipment List

2022-06-29T22:10:48Z

Awolff: /* Scanning Electron Microscopes (SEMs) */

'''NOTE: For EQUIPMENT TRAINING, contact the tool owner via Email for scheduling - DO NOT USE Labrunr - Training Sessions.'''

== Lithography ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]]

===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)]]
===== Optical Lithography =====
* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Optical Lithography Resources]]

== Deposition ==
===== Evaporation =====
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]]
* [[CHA: Electron Beam Evaporator | Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator]]
* [[Carbon Evaporator | Carbon: Leica EM ACE600 Carbon Evaporator]]
===== Sputtering =====
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]

===== Chemical Vapor Deposition (CVD) =====
* [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]]
===== Dielectric Packaging / Moisture Barrier =====
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]

== Etching ==
===== Dry Etching =====
* [[DRIE: Bosch & Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE]]
* [[ICP-RIE: III-V, Metal & Silicon Etcher | III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]
* [[Dual Chamber RIE: Silicon, III-V Material & Organics Etcher | Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]]
* [[XeF2 Etcher for Silicon | XeF2 Etcher for Silicon]]

===== Wet Etching =====
* [[Wet Chemistry | Available Wet Etching Techniques]]

== Microscopy ==
===== KNI Microscopy Policies =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

===== Focused Ion Beam (FIB) Systems =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | Helium, Neon & Gallium FIB: Zeiss ORION NanoFab]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 200 NanoLab: SEM, EDS | SEM & EDS: Thermo Fisher Nova 200 NanoLab]]
* [[Sirion: SEM | SEM : Thermo Fisher Sirion]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]

===== Transmission Electron Microscope (TEM) =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | TEM, STEM, EDS & HAADF: Thermo Fisher Tecnai TF-30 (50-300 kV)]]


===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]

===== Optical Characterization =====
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]

===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

== Wet Chemistry ==
===== Wet Chemistry Main page=====
* [[Wet Chemistry | Wet Chemistry page:]]
- Facilities Procedures & Safety

- Chemicals Supplied by KNI

- Chemicals Approved for use in KNI cleanroom- Safety Data Sheet (SDS) Lists

- Requesting New Chemicals for use in the KNI cleanroom

===== Wet Chemistry Safety page=====
* [[Wet Chemistry Safety | Wet Chemistry Safety page]]
- PPE Overview

-Hazardous Waste Handling and Labeling

-Decanting Chemicals

-Hot Plate Rules

-KNI Buddy System

-Secondary Containment and Other Best Practices.

===== Wet Chemistry Resources page=====
* [[Wet Chemistry Resources | Wet Chemistry Resources page]]
- Contains fabrication recipes and procedures.

== Support Tools ==
===== Laboratory Data =====
* [https://caltech.box.com/s/cl3ujgau2afl45joem7mg15e0oyxcgab General Laboratory Pass-down status information]
===== Thermal Processing =====
* [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]]

===== Substrate Processing =====
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]
* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]
* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]
===== Device Processing =====
* [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
===== Metrology =====
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]

===== Sample Preparation =====
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]

Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe

2022-06-29T22:09:10Z

Awolff: /* Related Instrumentation in the KNI */

{{InstrumentInfobox|
|InstrumentName = Nova 600
|HeaderColor = #F5A81C
|ImageOne = YVO-Nanobeam-Resonator_Jake-Rochman.jpg
|ImageTwo = Nova-NanoLab-600.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B233B Steele
|LabPhone = 626-395-1534
|PrimaryStaff = [[Annalena Wolff]]
|StaffEmail = awolff@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = FEI (now Thermo Fisher)
|Model = Nova 600 NanoLab
|Techniques = SEM, Ga-FIB, Omniprobe, Immersion Lens Imaging, GIS, Cross-sectioning, TEM Lamella Sample Prep
|RequestTraining = awolff@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Nova 600 is a "dual-beam" system that combines a field emission gun (FEG) scanning electron microscope (SEM) with a gallium focused ion beam (Ga-FIB). It can be used to capture high-quality images (clearly resolving sub-10 nm features) and perform site-specific etching and material deposition (creating sub-20 nm features). It is also equipped with an Omniprobe nanomanipulator, which can be used to lift out lamella samples that are prepared for use in a transmission electron microscope (TEM). See a full list of training and educational resources for this instrument below.
===== SEM Applications =====
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* Secondary Electron (SE) imaging with an Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)
* Backscattered Electron (BSE) imaging with a TLD
* Platinum deposition via Gas Injection System (GIS)
* Automated imaging with RunScript program & AutoScript language
===== Ga-FIB Applications =====
* Directly etch patterns into material
* Cutting & Imaging Cross-Sections
* TEM Lamella Sample Preparation using an Omniprobe for Liftout
* Platinum & SiOx deposition via GIS
* Enhanced etch with XeF2 via GIS
* Automated patterning with RunScript program & AutoScript language

== Resources ==
===== Equipment Data =====
* [https://caltech.box.com/s/oy9kdmiwszygacoov2ko1a9njb8jghod Microscopy Pass-down equipment information]

===== SOPs & Manuals & SDS =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* [https://caltech.box.com/s/3v19boseiba88mcujrljctpafyz8f4sh SOP, Manuals and SDS]
* [https://caltech.box.com/s/og4309108q4k2jwhkaxqtpiujg2al5iu Nova NanoLab Operation Manual]
* [https://caltech.box.com/s/j0t3w6i53jhfjcva8i4qvlatdh7t1tzw Gas Injection Systems – Deposition of Platinum (Technical Note)]
* [https://caltech.box.com/s/sm7q7teh5fo5hg3e6flkjbcbycmarrm3 Gas Injection Systems – Deposition of SiOx (Technical Note)]
* [https://caltech.box.com/s/4pcym0l9j1e8t9b2vznrzps9uk7b85mh Gas Injection Systems – Etching with IEE aka XeF2 Etch (Technical Note)]
* [https://caltech.box.com/s/110tb0o8avjziwa1y4d017dbbcpkxfop Scripting – AutoScript Language Manual (year 2000 Technical Note: most complete)]
* [https://caltech.box.com/s/tlqgvtkkiahi261megm087i61gqlfzrc Scripting – RunScript Manual]

===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]

===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM Concepts]
* [https://caltech.box.com/s/kxaxtslwol1o5a276f3lrqbhss8zvwje Ga-FIB Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM & Ga-FIB Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]

===== Presentations =====
* Scanning Electron Microscopy (SEM): Principles, Techniques & Applications
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]
* Gallium Focused Ion Beam (Ga-FIB) Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software – simulate e-beam/specimen interactions]
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM) – simulate i-beam/specimen interactions]
===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM and Ga-FIB measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.

===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/nmws6w7643ne8mraljjar6c4epw0anpp Nova 600 NanoLab Data Sheet] (not all parameters apply to our instrument, see below for details specific to the KNI's Nova 600)
===== SEM Specifications =====
* Minimum Feature Size Resolved in Immersion Mode: ~5 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: ~10 pA to 20 nA
* Apertures: 10 μm, 15 μm, 20 μm, 30 μm
* Eucentric Height: ~5.15 mm working distance (WD)
* Stage Range: ±80 mm X & Y travel, 12 mm Z travel, -12 to 58° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
* Ultimate Vacuum: 5e-7 mbar
===== Ga-FIB Specifications =====
* Minumum Probe Size Achieved: ~7 nm
* Minimum Feature Size Etched: ~25 nm
* Minimum Feature Size Resolved by Imaging: ~10 nm
* Voltage Range: 5 to 30 kV
* Current Range: 1 pA to 20 nA
* Eucentric Height: ~5.15 mm working distance (WD)
* Stage Tilt to be perpendicular to Ga-FIB: 52°
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V

Nova 200 NanoLab: SEM & EDS

2022-06-29T22:07:35Z

Awolff: /* Related Instrumentation in the KNI */

{{InstrumentInfoboxOneImage|
|InstrumentName = Nova 200
|HeaderColor = #F5A81C
|ImageOne = Nova-200-NanoLab.jpg
|ImageTwo = Nova-200-NanoLab.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B203 Steele
|LabPhone = 626-395-1542
|PrimaryStaff = [[Annalena Wolff]]
|StaffEmail = awolff@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = FEI (now Thermo Fisher)
|Model = Nova 200 NanoLab
|Techniques = SEM, EDS Immersion Lens Imaging
|RequestTraining = awolff@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Nova 200 is the KNI's highest-resolution field-emission gun (FEG) analytical scanning electron microscope (SEM), equipped with an immersion lens for imaging sub-10 nm features and energy dispersive spectroscopy (EDS) for compositional analysis. It is also outfitted with a gallium focused ion beam (Ga-FIB) column, which is currently not operational because the [[Nova_600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600 NanoLab]] and [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]] together meet the KNI's Ga-FIB demand; Ga-FIB could be reactivated on the Nova 200 in the future. See a full list of training and educational resources for this instrument below.
===== SEM Applications =====
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* Secondary Electron (SE) imaging with an Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)
* Backscattered Electron (BSE) imaging with a TLD
* Tungsten deposition via Gas Injection System (GIS)
* Automated imaging with RunScript program & AutoScript language
===== EDS Applications =====
* Spectrum acquisition for qualitative and quantitative compositional analysis
* Linescan acquisition for 1D spatial compositional analysis
* Map acquisition for 2D spatial compositional analysis

== Resources ==
===== Equipment Data =====
* [https://caltech.box.com/s/oy9kdmiwszygacoov2ko1a9njb8jghod Microscopy Pass-down equipment information]
===== SOPs & Manuals & SDS =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* [https://caltech.box.com/s/4f1hqp83pwc1v1k5qke6xi68i28fjvz8 Nova200 and EDS SOP, Manuals, SDS]
* [https://caltech.box.com/s/og4309108q4k2jwhkaxqtpiujg2al5iu Nova NanoLab Operation Manual]
* [https://caltech.box.com/s/fime6qbew8bj2zac9a0vc4gx4qaivssd Bruker Quantax EDS Operation Manual]
* [https://caltech.box.com/s/zb5m72tc5c61pegangjjwj3wc8rbj1vr Gas Injection Systems – Deposition of Tungsten (Technical Note)]
* [https://caltech.box.com/s/th6cpko7opc9pccn2ukmdc88oh8oa6zw Gas Injection Systems – Delineation Etch for SiO2 (Technical Note)]
* [https://caltech.box.com/s/u56ho1hve4pf9713aw09iolukfc8wsb1 Gas Injection Systems – Selective Carbon Etching (Technical Note)]
* [https://caltech.box.com/s/110tb0o8avjziwa1y4d017dbbcpkxfop Scripting – AutoScript Language Manual (year 2000 Technical Note: most complete)]
* [https://caltech.box.com/s/tlqgvtkkiahi261megm087i61gqlfzrc Scripting – RunScript Manual]

===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]
* Bruker EDS ESPRIT 2 Software ([https://caltech.app.box.com/file/766742876889 Overview] | [https://caltech.box.com/s/gbzj8crfyhwkvs3aelsjpdfe9zpd8goc Basic Spectrum Collection and ID] | [https://caltech.app.box.com/file/766741864978?s=l77v3pct05r6q856sq53az5t0bugc6n4 Spectrum Acquisiton] | [https://caltech.box.com/s/cjshqsjmpto2sac78xw46anc6j1fl2y6 AutoID Verification] | [https://caltech.box.com/s/lbywvcpdw4t1i892b2bo0qg7jztf23jb Object Mode (Multi-Point Analysis)] | [https://caltech.app.box.com/file/766738174372 Line Profile Analysis])

===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM & EDS/WDS Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]
===== Presentations =====
* Scanning Electron Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]
* Gallium Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software] – simulate e-beam/specimen interactions (very useful for EDS & WDS)
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM)] – simulate i-beam/specimen interactions
===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.
===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/nmws6w7643ne8mraljjar6c4epw0anpp Nova 200 NanoLab Data Sheet] (not all parameters apply to our instrument, see below for details specific to the KNI's Nova 200)
===== SEM Specifications =====
* Minimum Feature Size Resolved in Immersion Mode: ~5 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: ~10 pA to 20 nA
* Apertures: 30 μm, 40 μm, 50 μm, 100 μm
* Eucentric Height: ~4.8 mm working distance (WD)
* Stage Range: ±25 mm X & Y travel, 50 mm Z travel, -12 to 58° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
* Ultimate Vacuum: 5e-6 mbar

Sirion: SEM & EDS

2022-06-29T22:05:47Z

Awolff: /* Related Instrumentation in the KNI */

Sirion: SEM & EDS

2022-06-29T22:04:31Z

Awolff: /* SEM Applications */

{{InstrumentInfoboxOneImage|
|InstrumentName = Sirion SEM
|HeaderColor = #F5A81C
|ImageOne = Sirion-SEM.jpg
|ImageTwo = Sirion-SEM.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B209 Steele
|LabPhone = 626-395-1541
|PrimaryStaff = [[Annalena Wolff]]
|StaffEmail = awolff@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = FEI (now Thermo Fisher)
|Model = Sirion (aka XL-30)
|Techniques = SEM, EDS, Immersion Lens Imaging
|RequestTraining = awolff@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Sirion is a field emission gun (FEG) scanning electron microscope (SEM) equipped with an immersion lens for imaging sub-10 nm features (so-called "ultra high resolution mode," UHR). While it is the KNI's oldest SEM, it is also a very steady instrument, offering a lower-cost alternative to similar high-resolution imaging that is available on the newer [[Nova_600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]] & [[Nova_200 NanoLab: SEM, EDS | Nova 200 NanoLab]] platforms. The smaller Sirion chamber also allows for fast pump and vent times, which makes this SEM very useful for quick inspection. See a full list of training and educational resources for this instrument below.
===== SEM Applications =====
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* Secondary Electron (SE) & Backscattered Electron (BSE) Imaging
* Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)

== Resources ==
===== Equipment Data =====
* [https://caltech.box.com/s/xlvbr7cfwiqzcpc9hpq4jxed8mhl6c4j Microscopy Pass-down equipment information]
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* [https://caltech.box.com/s/xuympwz92lbi2cps7l5mskq9sky9intd SOP & Manuals & SDS]
* [https://caltech.box.com/s/p9pgau696uipjrb2vdkhixynmc3es322 FEI Sirion Series SEM Manufacturer Operations Manual]

===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]

===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM & EDS Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]
===== Presentations =====
* Scanning Electron Microscopy: Principles, Techniques & Applications (includes slides on EDS)
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]

===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software] – simulate e-beam/specimen interactions (very useful for EDS)
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.

===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/s70o8bkorrygdmmyxmwazr6jyhzb11ma Sirion SEM Product Guide & Data Sheet]
===== SEM Specifications =====
* Minimum Feature Size Resolved: ~7 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: "Spotsize" 1 to 7 (approximately 30 pA to 20 nA), with increments of 1
* Apertures: 30 μm, 40 μm, 50 μm, 100 μm
* Eucentric Height: 5 mm working distance (WD)
* Stage Range: ±25 mm X & Y travel, 50 mm Z travel, 0-45° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
* Ultimate Vacuum: 3e-6 mbar
 
 
== Related Instrumentation in the KNI ==
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]


===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

Sirion: SEM & EDS

2022-06-29T21:48:09Z

Awolff: /* Video Tutorials */

{{InstrumentInfoboxOneImage|
|InstrumentName = Sirion SEM
|HeaderColor = #F5A81C
|ImageOne = Sirion-SEM.jpg
|ImageTwo = Sirion-SEM.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B209 Steele
|LabPhone = 626-395-1541
|PrimaryStaff = [[Annalena Wolff]]
|StaffEmail = awolff@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = FEI (now Thermo Fisher)
|Model = Sirion (aka XL-30)
|Techniques = SEM, EDS, Immersion Lens Imaging
|RequestTraining = awolff@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Sirion is a field emission gun (FEG) scanning electron microscope (SEM) equipped with an immersion lens for imaging sub-10 nm features (so-called "ultra high resolution mode," UHR). While it is the KNI's oldest SEM, it is also a very steady instrument, offering a lower-cost alternative to similar high-resolution imaging that is available on the newer [[Nova_600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]] & [[Nova_200 NanoLab: SEM, EDS | Nova 200 NanoLab]] platforms. The smaller Sirion chamber also allows for fast pump and vent times, which makes this SEM very useful for quick inspection. See a full list of training and educational resources for this instrument below.
===== SEM Applications =====
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* EDX Mode Imaging (reduces background signal on EDS spectra)
* Secondary Electron (SE) & Backscattered Electron (BSE) Imaging
* Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)

== Resources ==
===== Equipment Data =====
* [https://caltech.box.com/s/xlvbr7cfwiqzcpc9hpq4jxed8mhl6c4j Microscopy Pass-down equipment information]
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* [https://caltech.box.com/s/xuympwz92lbi2cps7l5mskq9sky9intd SOP & Manuals & SDS]
* [https://caltech.box.com/s/p9pgau696uipjrb2vdkhixynmc3es322 FEI Sirion Series SEM Manufacturer Operations Manual]

===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]

===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM & EDS Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]
===== Presentations =====
* Scanning Electron Microscopy: Principles, Techniques & Applications (includes slides on EDS)
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]

===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software] – simulate e-beam/specimen interactions (very useful for EDS)
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.

===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/s70o8bkorrygdmmyxmwazr6jyhzb11ma Sirion SEM Product Guide & Data Sheet]
===== SEM Specifications =====
* Minimum Feature Size Resolved: ~7 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: "Spotsize" 1 to 7 (approximately 30 pA to 20 nA), with increments of 1
* Apertures: 30 μm, 40 μm, 50 μm, 100 μm
* Eucentric Height: 5 mm working distance (WD)
* Stage Range: ±25 mm X & Y travel, 50 mm Z travel, 0-45° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
* Ultimate Vacuum: 3e-6 mbar
 
 
== Related Instrumentation in the KNI ==
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]


===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

Sirion: SEM & EDS

2022-06-29T21:46:45Z

Awolff: /* Resources */

{{InstrumentInfoboxOneImage|
|InstrumentName = Sirion SEM
|HeaderColor = #F5A81C
|ImageOne = Sirion-SEM.jpg
|ImageTwo = Sirion-SEM.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B209 Steele
|LabPhone = 626-395-1541
|PrimaryStaff = [[Annalena Wolff]]
|StaffEmail = awolff@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = FEI (now Thermo Fisher)
|Model = Sirion (aka XL-30)
|Techniques = SEM, EDS, Immersion Lens Imaging
|RequestTraining = awolff@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Sirion is a field emission gun (FEG) scanning electron microscope (SEM) equipped with an immersion lens for imaging sub-10 nm features (so-called "ultra high resolution mode," UHR). While it is the KNI's oldest SEM, it is also a very steady instrument, offering a lower-cost alternative to similar high-resolution imaging that is available on the newer [[Nova_600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]] & [[Nova_200 NanoLab: SEM, EDS | Nova 200 NanoLab]] platforms. The smaller Sirion chamber also allows for fast pump and vent times, which makes this SEM very useful for quick inspection. See a full list of training and educational resources for this instrument below.
===== SEM Applications =====
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* EDX Mode Imaging (reduces background signal on EDS spectra)
* Secondary Electron (SE) & Backscattered Electron (BSE) Imaging
* Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)

== Resources ==
===== Equipment Data =====
* [https://caltech.box.com/s/xlvbr7cfwiqzcpc9hpq4jxed8mhl6c4j Microscopy Pass-down equipment information]
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* [https://caltech.box.com/s/xuympwz92lbi2cps7l5mskq9sky9intd SOP & Manuals & SDS]
* [https://caltech.box.com/s/p9pgau696uipjrb2vdkhixynmc3es322 FEI Sirion Series SEM Manufacturer Operations Manual]

===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/4V-bE6uqHY4 Eucentric Height: What it means, When to use it & How to get there]
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]
===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM & EDS Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]
===== Presentations =====
* Scanning Electron Microscopy: Principles, Techniques & Applications (includes slides on EDS)
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]

===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software] – simulate e-beam/specimen interactions (very useful for EDS)
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.

===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/s70o8bkorrygdmmyxmwazr6jyhzb11ma Sirion SEM Product Guide & Data Sheet]
===== SEM Specifications =====
* Minimum Feature Size Resolved: ~7 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: "Spotsize" 1 to 7 (approximately 30 pA to 20 nA), with increments of 1
* Apertures: 30 μm, 40 μm, 50 μm, 100 μm
* Eucentric Height: 5 mm working distance (WD)
* Stage Range: ±25 mm X & Y travel, 50 mm Z travel, 0-45° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
* Ultimate Vacuum: 3e-6 mbar
 
 
== Related Instrumentation in the KNI ==
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]


===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

Sirion: SEM & EDS

2022-06-29T21:45:29Z

Awolff: /* SOPs & Troubleshooting */

{{InstrumentInfoboxOneImage|
|InstrumentName = Sirion SEM
|HeaderColor = #F5A81C
|ImageOne = Sirion-SEM.jpg
|ImageTwo = Sirion-SEM.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B209 Steele
|LabPhone = 626-395-1541
|PrimaryStaff = [[Annalena Wolff]]
|StaffEmail = awolff@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = FEI (now Thermo Fisher)
|Model = Sirion (aka XL-30)
|Techniques = SEM, EDS, Immersion Lens Imaging
|RequestTraining = awolff@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Sirion is a field emission gun (FEG) scanning electron microscope (SEM) equipped with an immersion lens for imaging sub-10 nm features (so-called "ultra high resolution mode," UHR). While it is the KNI's oldest SEM, it is also a very steady instrument, offering a lower-cost alternative to similar high-resolution imaging that is available on the newer [[Nova_600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]] & [[Nova_200 NanoLab: SEM, EDS | Nova 200 NanoLab]] platforms. The smaller Sirion chamber also allows for fast pump and vent times, which makes this SEM very useful for quick inspection. See a full list of training and educational resources for this instrument below.
===== SEM Applications =====
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* EDX Mode Imaging (reduces background signal on EDS spectra)
* Secondary Electron (SE) & Backscattered Electron (BSE) Imaging
* Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)

== Resources ==
===== Equipment Data =====
* [https://caltech.box.com/s/xlvbr7cfwiqzcpc9hpq4jxed8mhl6c4j Microscopy Pass-down equipment information]
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* [https://caltech.box.com/s/xuympwz92lbi2cps7l5mskq9sky9intd SOP & Manuals & SDS]

===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/4V-bE6uqHY4 Eucentric Height: What it means, When to use it & How to get there]
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]
===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM & EDS Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]
===== Presentations =====
* Scanning Electron Microscopy: Principles, Techniques & Applications (includes slides on EDS)
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/p9pgau696uipjrb2vdkhixynmc3es322 FEI Sirion Series SEM Manufacturer Operations Manual]
* [https://caltech.box.com/s/36j0n01ig7f757kvkiebvqjqj0el2yvp EDAX Genesis EDS Operation Manual]

===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software] – simulate e-beam/specimen interactions (very useful for EDS)
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.
===== Order Your Own Stubs =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some old stubs at each SEM, yet you should buy your own so that you can keep them clean and available to you. There are many stub geometries and configurations, some of which will be right for you to purchase and keep with your other cleanroom items.
** [https://www.tedpella.com/SEM_html/SEMclip.htm.aspx Buy stubs with copper clips] (recommended for most devices, especially those with non-conductive substrates)
** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips] (OK for devices with conductive substrates)
===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/s70o8bkorrygdmmyxmwazr6jyhzb11ma Sirion SEM Product Guide & Data Sheet]
===== SEM Specifications =====
* Minimum Feature Size Resolved: ~7 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: "Spotsize" 1 to 7 (approximately 30 pA to 20 nA), with increments of 1
* Apertures: 30 μm, 40 μm, 50 μm, 100 μm
* Eucentric Height: 5 mm working distance (WD)
* Stage Range: ±25 mm X & Y travel, 50 mm Z travel, 0-45° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
* Ultimate Vacuum: 3e-6 mbar
 
 
== Related Instrumentation in the KNI ==
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]


===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

Sirion: SEM & EDS

2022-06-29T21:44:00Z

Awolff: /* Description */

{{InstrumentInfoboxOneImage|
|InstrumentName = Sirion SEM
|HeaderColor = #F5A81C
|ImageOne = Sirion-SEM.jpg
|ImageTwo = Sirion-SEM.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B209 Steele
|LabPhone = 626-395-1541
|PrimaryStaff = [[Annalena Wolff]]
|StaffEmail = awolff@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = FEI (now Thermo Fisher)
|Model = Sirion (aka XL-30)
|Techniques = SEM, EDS, Immersion Lens Imaging
|RequestTraining = awolff@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Sirion is a field emission gun (FEG) scanning electron microscope (SEM) equipped with an immersion lens for imaging sub-10 nm features (so-called "ultra high resolution mode," UHR). While it is the KNI's oldest SEM, it is also a very steady instrument, offering a lower-cost alternative to similar high-resolution imaging that is available on the newer [[Nova_600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]] & [[Nova_200 NanoLab: SEM, EDS | Nova 200 NanoLab]] platforms. The smaller Sirion chamber also allows for fast pump and vent times, which makes this SEM very useful for quick inspection. See a full list of training and educational resources for this instrument below.
===== SEM Applications =====
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* EDX Mode Imaging (reduces background signal on EDS spectra)
* Secondary Electron (SE) & Backscattered Electron (BSE) Imaging
* Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)

== Resources ==
===== Equipment Data =====
* [https://caltech.box.com/s/xlvbr7cfwiqzcpc9hpq4jxed8mhl6c4j Microscopy Pass-down equipment information]
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* SEM SOPs ([https://caltech.box.com/s/rontehfysbmcyia4448wi31g8gbhepz9 Short Version] | [https://caltech.box.com/s/llpi6ct5wvw6c2tnh81zu32autbi2doy Long Version])
* EDS SOPs ([https://caltech.box.com/s/ltcra2dk47k5s8r5mqotbad3i2e6r3lk Short Version] | [https://caltech.box.com/s/kukccwu1m8ekfjo6jds4jupvzwsjs3z1 Long Version])
* [https://caltech.box.com/s/u4c7ep9wyxb3tvcp0o38tczf0o8vpffi Troubleshooting Guide]

===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/4V-bE6uqHY4 Eucentric Height: What it means, When to use it & How to get there]
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]
===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM & EDS Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]
===== Presentations =====
* Scanning Electron Microscopy: Principles, Techniques & Applications (includes slides on EDS)
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/p9pgau696uipjrb2vdkhixynmc3es322 FEI Sirion Series SEM Manufacturer Operations Manual]
* [https://caltech.box.com/s/36j0n01ig7f757kvkiebvqjqj0el2yvp EDAX Genesis EDS Operation Manual]

===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software] – simulate e-beam/specimen interactions (very useful for EDS)
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.
===== Order Your Own Stubs =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some old stubs at each SEM, yet you should buy your own so that you can keep them clean and available to you. There are many stub geometries and configurations, some of which will be right for you to purchase and keep with your other cleanroom items.
** [https://www.tedpella.com/SEM_html/SEMclip.htm.aspx Buy stubs with copper clips] (recommended for most devices, especially those with non-conductive substrates)
** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips] (OK for devices with conductive substrates)
===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/s70o8bkorrygdmmyxmwazr6jyhzb11ma Sirion SEM Product Guide & Data Sheet]
===== SEM Specifications =====
* Minimum Feature Size Resolved: ~7 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: "Spotsize" 1 to 7 (approximately 30 pA to 20 nA), with increments of 1
* Apertures: 30 μm, 40 μm, 50 μm, 100 μm
* Eucentric Height: 5 mm working distance (WD)
* Stage Range: ±25 mm X & Y travel, 50 mm Z travel, 0-45° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
* Ultimate Vacuum: 3e-6 mbar
 
 
== Related Instrumentation in the KNI ==
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]


===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

Sirion: SEM & EDS

2022-06-29T21:42:09Z

Awolff:

{{InstrumentInfoboxOneImage|
|InstrumentName = Sirion SEM
|HeaderColor = #F5A81C
|ImageOne = Sirion-SEM.jpg
|ImageTwo = Sirion-SEM.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B209 Steele
|LabPhone = 626-395-1541
|PrimaryStaff = [[Annalena Wolff]]
|StaffEmail = awolff@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = FEI (now Thermo Fisher)
|Model = Sirion (aka XL-30)
|Techniques = SEM, EDS, Immersion Lens Imaging
|RequestTraining = awolff@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Sirion is a field emission gun (FEG) scanning electron microscope (SEM) equipped with an immersion lens for imaging sub-10 nm features (so-called "ultra high resolution mode," UHR) and an energy dispersive spectroscopy (EDS) detector for compositional analysis. While it is the KNI's oldest SEM, it is also a very steady instrument, offering a lower-cost alternative to similar high-resolution imaging that is available on the newer [[Nova_600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600]] & [[Nova_200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab]] platforms. The smaller Sirion chamber also allows for fast pump and vent times, which makes this SEM very useful for quick inspection. See a full list of training and educational resources for this instrument below.
===== SEM Applications =====
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* EDX Mode Imaging (reduces background signal on EDS spectra)
* Secondary Electron (SE) & Backscattered Electron (BSE) Imaging
* Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)
===== EDS Applications =====
* Spectrum acquisition for quantitative compositional analysis
* Linescan acquisition for 1D spatial compositional analysis
* Map acquisition for 2D spatial compositional analysis

== Resources ==
===== Equipment Data =====
* [https://caltech.box.com/s/xlvbr7cfwiqzcpc9hpq4jxed8mhl6c4j Microscopy Pass-down equipment information]
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* SEM SOPs ([https://caltech.box.com/s/rontehfysbmcyia4448wi31g8gbhepz9 Short Version] | [https://caltech.box.com/s/llpi6ct5wvw6c2tnh81zu32autbi2doy Long Version])
* EDS SOPs ([https://caltech.box.com/s/ltcra2dk47k5s8r5mqotbad3i2e6r3lk Short Version] | [https://caltech.box.com/s/kukccwu1m8ekfjo6jds4jupvzwsjs3z1 Long Version])
* [https://caltech.box.com/s/u4c7ep9wyxb3tvcp0o38tczf0o8vpffi Troubleshooting Guide]

===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/4V-bE6uqHY4 Eucentric Height: What it means, When to use it & How to get there]
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]
===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM & EDS Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]
===== Presentations =====
* Scanning Electron Microscopy: Principles, Techniques & Applications (includes slides on EDS)
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/p9pgau696uipjrb2vdkhixynmc3es322 FEI Sirion Series SEM Manufacturer Operations Manual]
* [https://caltech.box.com/s/36j0n01ig7f757kvkiebvqjqj0el2yvp EDAX Genesis EDS Operation Manual]

===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software] – simulate e-beam/specimen interactions (very useful for EDS)
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.
===== Order Your Own Stubs =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some old stubs at each SEM, yet you should buy your own so that you can keep them clean and available to you. There are many stub geometries and configurations, some of which will be right for you to purchase and keep with your other cleanroom items.
** [https://www.tedpella.com/SEM_html/SEMclip.htm.aspx Buy stubs with copper clips] (recommended for most devices, especially those with non-conductive substrates)
** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips] (OK for devices with conductive substrates)
===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/s70o8bkorrygdmmyxmwazr6jyhzb11ma Sirion SEM Product Guide & Data Sheet]
===== SEM Specifications =====
* Minimum Feature Size Resolved: ~7 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: "Spotsize" 1 to 7 (approximately 30 pA to 20 nA), with increments of 1
* Apertures: 30 μm, 40 μm, 50 μm, 100 μm
* Eucentric Height: 5 mm working distance (WD)
* Stage Range: ±25 mm X & Y travel, 50 mm Z travel, 0-45° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
* Ultimate Vacuum: 3e-6 mbar
 
 
== Related Instrumentation in the KNI ==
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]


===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe

2022-06-29T21:36:56Z

Awolff: /* Video Tutorials */

Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe

2022-06-29T21:35:40Z

Awolff: /* Video Tutorials */

{{InstrumentInfobox|
|InstrumentName = Nova 600
|HeaderColor = #F5A81C
|ImageOne = YVO-Nanobeam-Resonator_Jake-Rochman.jpg
|ImageTwo = Nova-NanoLab-600.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B233B Steele
|LabPhone = 626-395-1534
|PrimaryStaff = [[Annalena Wolff]]
|StaffEmail = awolff@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = FEI (now Thermo Fisher)
|Model = Nova 600 NanoLab
|Techniques = SEM, Ga-FIB, Omniprobe, Immersion Lens Imaging, GIS, Cross-sectioning, TEM Lamella Sample Prep
|RequestTraining = awolff@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Nova 600 is a "dual-beam" system that combines a field emission gun (FEG) scanning electron microscope (SEM) with a gallium focused ion beam (Ga-FIB). It can be used to capture high-quality images (clearly resolving sub-10 nm features) and perform site-specific etching and material deposition (creating sub-20 nm features). It is also equipped with an Omniprobe nanomanipulator, which can be used to lift out lamella samples that are prepared for use in a transmission electron microscope (TEM). See a full list of training and educational resources for this instrument below.
===== SEM Applications =====
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* Secondary Electron (SE) imaging with an Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)
* Backscattered Electron (BSE) imaging with a TLD
* Platinum deposition via Gas Injection System (GIS)
* Automated imaging with RunScript program & AutoScript language
===== Ga-FIB Applications =====
* Directly etch patterns into material
* Cutting & Imaging Cross-Sections
* TEM Lamella Sample Preparation using an Omniprobe for Liftout
* Platinum & SiOx deposition via GIS
* Enhanced etch with XeF2 via GIS
* Automated patterning with RunScript program & AutoScript language

== Resources ==
===== Equipment Data =====
* [https://caltech.box.com/s/oy9kdmiwszygacoov2ko1a9njb8jghod Microscopy Pass-down equipment information]

===== SOPs & Manuals & SDS =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* [https://caltech.box.com/s/3v19boseiba88mcujrljctpafyz8f4sh SOP, Manuals and SDS]
* [https://caltech.box.com/s/og4309108q4k2jwhkaxqtpiujg2al5iu Nova NanoLab Operation Manual]
* [https://caltech.box.com/s/j0t3w6i53jhfjcva8i4qvlatdh7t1tzw Gas Injection Systems – Deposition of Platinum (Technical Note)]
* [https://caltech.box.com/s/sm7q7teh5fo5hg3e6flkjbcbycmarrm3 Gas Injection Systems – Deposition of SiOx (Technical Note)]
* [https://caltech.box.com/s/4pcym0l9j1e8t9b2vznrzps9uk7b85mh Gas Injection Systems – Etching with IEE aka XeF2 Etch (Technical Note)]
* [https://caltech.box.com/s/110tb0o8avjziwa1y4d017dbbcpkxfop Scripting – AutoScript Language Manual (year 2000 Technical Note: most complete)]
* [https://caltech.box.com/s/tlqgvtkkiahi261megm087i61gqlfzrc Scripting – RunScript Manual]

===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/V0d5fog_tcg Introduction to Using a Ga-FIB]
* [https://youtu.be/67RdSeJcaGs Milling Non-Conductive Samples using Charge Compensation]
* [https://youtu.be/XNgYe8ZDJvo Perfecting Ga-FIB Alignments]
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]

===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM Concepts]
* [https://caltech.box.com/s/kxaxtslwol1o5a276f3lrqbhss8zvwje Ga-FIB Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM & Ga-FIB Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]

===== Presentations =====
* Scanning Electron Microscopy (SEM): Principles, Techniques & Applications
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]
* Gallium Focused Ion Beam (Ga-FIB) Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software – simulate e-beam/specimen interactions]
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM) – simulate i-beam/specimen interactions]
===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM and Ga-FIB measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.

===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/nmws6w7643ne8mraljjar6c4epw0anpp Nova 600 NanoLab Data Sheet] (not all parameters apply to our instrument, see below for details specific to the KNI's Nova 600)
===== SEM Specifications =====
* Minimum Feature Size Resolved in Immersion Mode: ~5 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: ~10 pA to 20 nA
* Apertures: 10 μm, 15 μm, 20 μm, 30 μm
* Eucentric Height: ~5.15 mm working distance (WD)
* Stage Range: ±80 mm X & Y travel, 12 mm Z travel, -12 to 58° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
* Ultimate Vacuum: 5e-7 mbar
===== Ga-FIB Specifications =====
* Minumum Probe Size Achieved: ~7 nm
* Minimum Feature Size Etched: ~25 nm
* Minimum Feature Size Resolved by Imaging: ~10 nm
* Voltage Range: 5 to 30 kV
* Current Range: 1 pA to 20 nA
* Eucentric Height: ~5.15 mm working distance (WD)
* Stage Tilt to be perpendicular to Ga-FIB: 52°
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
 
 
== Related Instrumentation in the KNI ==
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM & EDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]


===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe

2022-06-29T21:32:55Z

Awolff: /* Resources */

{{InstrumentInfobox|
|InstrumentName = Nova 600
|HeaderColor = #F5A81C
|ImageOne = YVO-Nanobeam-Resonator_Jake-Rochman.jpg
|ImageTwo = Nova-NanoLab-600.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B233B Steele
|LabPhone = 626-395-1534
|PrimaryStaff = [[Annalena Wolff]]
|StaffEmail = awolff@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = FEI (now Thermo Fisher)
|Model = Nova 600 NanoLab
|Techniques = SEM, Ga-FIB, Omniprobe, Immersion Lens Imaging, GIS, Cross-sectioning, TEM Lamella Sample Prep
|RequestTraining = awolff@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Nova 600 is a "dual-beam" system that combines a field emission gun (FEG) scanning electron microscope (SEM) with a gallium focused ion beam (Ga-FIB). It can be used to capture high-quality images (clearly resolving sub-10 nm features) and perform site-specific etching and material deposition (creating sub-20 nm features). It is also equipped with an Omniprobe nanomanipulator, which can be used to lift out lamella samples that are prepared for use in a transmission electron microscope (TEM). See a full list of training and educational resources for this instrument below.
===== SEM Applications =====
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* Secondary Electron (SE) imaging with an Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)
* Backscattered Electron (BSE) imaging with a TLD
* Platinum deposition via Gas Injection System (GIS)
* Automated imaging with RunScript program & AutoScript language
===== Ga-FIB Applications =====
* Directly etch patterns into material
* Cutting & Imaging Cross-Sections
* TEM Lamella Sample Preparation using an Omniprobe for Liftout
* Platinum & SiOx deposition via GIS
* Enhanced etch with XeF2 via GIS
* Automated patterning with RunScript program & AutoScript language

== Resources ==
===== Equipment Data =====
* [https://caltech.box.com/s/oy9kdmiwszygacoov2ko1a9njb8jghod Microscopy Pass-down equipment information]

===== SOPs & Manuals & SDS =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* [https://caltech.box.com/s/3v19boseiba88mcujrljctpafyz8f4sh SOP, Manuals and SDS]
* [https://caltech.box.com/s/og4309108q4k2jwhkaxqtpiujg2al5iu Nova NanoLab Operation Manual]
* [https://caltech.box.com/s/j0t3w6i53jhfjcva8i4qvlatdh7t1tzw Gas Injection Systems – Deposition of Platinum (Technical Note)]
* [https://caltech.box.com/s/sm7q7teh5fo5hg3e6flkjbcbycmarrm3 Gas Injection Systems – Deposition of SiOx (Technical Note)]
* [https://caltech.box.com/s/4pcym0l9j1e8t9b2vznrzps9uk7b85mh Gas Injection Systems – Etching with IEE aka XeF2 Etch (Technical Note)]
* [https://caltech.box.com/s/110tb0o8avjziwa1y4d017dbbcpkxfop Scripting – AutoScript Language Manual (year 2000 Technical Note: most complete)]
* [https://caltech.box.com/s/tlqgvtkkiahi261megm087i61gqlfzrc Scripting – RunScript Manual]

===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/4V-bE6uqHY4 Eucentric Height: What it means, When to use it & How to get there]
* [https://youtu.be/V0d5fog_tcg Introduction to Using a Ga-FIB]
* TEM Lamella Sample Prep ([https://www.youtube.com/playlist?list=PL7Lb5X_YIzOkg3wRe6A5a5b76fFxYyT3s Playlist])
* Cutting & Imaging Cross-sections ([https://www.youtube.com/playlist?list=PL7Lb5X_YIzOnW6dD0GHeasXS6MRVIgoTA Playlist])
* [https://youtu.be/67RdSeJcaGs Milling Non-Conductive Samples using Charge Compensation]
* [https://youtu.be/XNgYe8ZDJvo Perfecting Ga-FIB Alignments]
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]

===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM Concepts]
* [https://caltech.box.com/s/kxaxtslwol1o5a276f3lrqbhss8zvwje Ga-FIB Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM & Ga-FIB Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]

===== Presentations =====
* Scanning Electron Microscopy (SEM): Principles, Techniques & Applications
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]
* Gallium Focused Ion Beam (Ga-FIB) Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software – simulate e-beam/specimen interactions]
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM) – simulate i-beam/specimen interactions]
===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM and Ga-FIB measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.

===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/nmws6w7643ne8mraljjar6c4epw0anpp Nova 600 NanoLab Data Sheet] (not all parameters apply to our instrument, see below for details specific to the KNI's Nova 600)
===== SEM Specifications =====
* Minimum Feature Size Resolved in Immersion Mode: ~5 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: ~10 pA to 20 nA
* Apertures: 10 μm, 15 μm, 20 μm, 30 μm
* Eucentric Height: ~5.15 mm working distance (WD)
* Stage Range: ±80 mm X & Y travel, 12 mm Z travel, -12 to 58° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
* Ultimate Vacuum: 5e-7 mbar
===== Ga-FIB Specifications =====
* Minumum Probe Size Achieved: ~7 nm
* Minimum Feature Size Etched: ~25 nm
* Minimum Feature Size Resolved by Imaging: ~10 nm
* Voltage Range: 5 to 30 kV
* Current Range: 1 pA to 20 nA
* Eucentric Height: ~5.15 mm working distance (WD)
* Stage Tilt to be perpendicular to Ga-FIB: 52°
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
 
 
== Related Instrumentation in the KNI ==
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM & EDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]


===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe

2022-06-29T21:26:34Z

Awolff: /* Equipment Data */

{{InstrumentInfobox|
|InstrumentName = Nova 600
|HeaderColor = #F5A81C
|ImageOne = YVO-Nanobeam-Resonator_Jake-Rochman.jpg
|ImageTwo = Nova-NanoLab-600.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B233B Steele
|LabPhone = 626-395-1534
|PrimaryStaff = [[Annalena Wolff]]
|StaffEmail = awolff@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = FEI (now Thermo Fisher)
|Model = Nova 600 NanoLab
|Techniques = SEM, Ga-FIB, Omniprobe, Immersion Lens Imaging, GIS, Cross-sectioning, TEM Lamella Sample Prep
|RequestTraining = awolff@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Nova 600 is a "dual-beam" system that combines a field emission gun (FEG) scanning electron microscope (SEM) with a gallium focused ion beam (Ga-FIB). It can be used to capture high-quality images (clearly resolving sub-10 nm features) and perform site-specific etching and material deposition (creating sub-20 nm features). It is also equipped with an Omniprobe nanomanipulator, which can be used to lift out lamella samples that are prepared for use in a transmission electron microscope (TEM). See a full list of training and educational resources for this instrument below.
===== SEM Applications =====
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* Secondary Electron (SE) imaging with an Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)
* Backscattered Electron (BSE) imaging with a TLD
* Platinum deposition via Gas Injection System (GIS)
* Automated imaging with RunScript program & AutoScript language
===== Ga-FIB Applications =====
* Directly etch patterns into material
* Cutting & Imaging Cross-Sections
* TEM Lamella Sample Preparation using an Omniprobe for Liftout
* Platinum & SiOx deposition via GIS
* Enhanced etch with XeF2 via GIS
* Automated patterning with RunScript program & AutoScript language

== Resources ==
===== Equipment Data =====
* [https://caltech.box.com/s/oy9kdmiwszygacoov2ko1a9njb8jghod Microscopy Pass-down equipment information]

===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* SEM SOPs ([https://caltech.box.com/s/4yv8f5att77k3zq1rm6p0mqhkd8quslh Short Version] | [https://caltech.box.com/s/xwjdudqdl793gkc5kl71zez5nnc5y2xb Long Version])
* Ga-FIB SOPs ([https://caltech.box.com/s/8uch8ygjmesmjtdfy65xth47izib0prg Short Version] | [https://caltech.box.com/s/grg6j3rob7c4ciblom1tdshklq62oxqp Long Version])
* TEM Lamella Sample Preparation SOPs ([https://caltech.box.com/s/3l3w507dxwosuya3nbxgk30tdqyp4qy9 Short Version] | [https://caltech.box.com/s/pgioaribs7oj8r7g5nncmjjee2uyez2d Long Version])
** [https://caltech.box.com/s/lhaweqbefmep8n79u4nvynsv0cjctuc1 Process Recipe for TEM Lamella prep for Thin Films on Si Substrates]
* [https://caltech.box.com/s/1nmp75l3166vj9t1vwwpwu2zyfc4j6ol Cutting & Imaging Cross-Sections SOP]
* [https://caltech.box.com/s/sz9pai0icsntnef6me23veiwtwdui0gm Troubleshooting Guide]

===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/4V-bE6uqHY4 Eucentric Height: What it means, When to use it & How to get there]
* [https://youtu.be/V0d5fog_tcg Introduction to Using a Ga-FIB]
* TEM Lamella Sample Prep ([https://www.youtube.com/playlist?list=PL7Lb5X_YIzOkg3wRe6A5a5b76fFxYyT3s Playlist])
* Cutting & Imaging Cross-sections ([https://www.youtube.com/playlist?list=PL7Lb5X_YIzOnW6dD0GHeasXS6MRVIgoTA Playlist])
* [https://youtu.be/67RdSeJcaGs Milling Non-Conductive Samples using Charge Compensation]
* [https://youtu.be/XNgYe8ZDJvo Perfecting Ga-FIB Alignments]
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]

===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM Concepts]
* [https://caltech.box.com/s/kxaxtslwol1o5a276f3lrqbhss8zvwje Ga-FIB Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM & Ga-FIB Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]

===== Presentations =====
* Scanning Electron Microscopy (SEM): Principles, Techniques & Applications
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]
* Gallium Focused Ion Beam (Ga-FIB) Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/og4309108q4k2jwhkaxqtpiujg2al5iu Nova NanoLab Operation Manual]
* [https://caltech.box.com/s/j0t3w6i53jhfjcva8i4qvlatdh7t1tzw Gas Injection Systems – Deposition of Platinum (Technical Note)]
* [https://caltech.box.com/s/sm7q7teh5fo5hg3e6flkjbcbycmarrm3 Gas Injection Systems – Deposition of SiOx (Technical Note)]
* [https://caltech.box.com/s/4pcym0l9j1e8t9b2vznrzps9uk7b85mh Gas Injection Systems – Etching with IEE aka XeF2 Etch (Technical Note)]
* [https://caltech.box.com/s/b95pg59k003i9vn8y9elzem0tnxqg3fb Gas Injection Systems – Beam Chemistries Presentation]
* [https://caltech.box.com/s/110tb0o8avjziwa1y4d017dbbcpkxfop Scripting – AutoScript Language Manual (year 2000 Technical Note: most complete)]
* [https://caltech.box.com/s/n0abqy5z1e9a8hbyf38qybxu86sqz3vb Scripting – AutoScript Language Manual (year 2005 Technical Note: less complete, still useful)]
* [https://caltech.box.com/s/tlqgvtkkiahi261megm087i61gqlfzrc Scripting – RunScript Manual]

===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software – simulate e-beam/specimen interactions]
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM) – simulate i-beam/specimen interactions]
===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM and Ga-FIB measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.
===== Order Your Own Stubs =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some old stubs at each SEM/FIB, yet you should buy your own so that you can keep them clean and available to you. There are many stub geometries and configurations, some of which will be right for you to purchase and keep with your other cleanroom items.
** [https://www.tedpella.com/SEM_html/SEMclip.htm.aspx Buy stubs with copper clips] (recommended for most devices, esp with non-conductive substrates);
** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips] (ok for devices with conductive substrates)
===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/nmws6w7643ne8mraljjar6c4epw0anpp Nova 600 NanoLab Data Sheet] (not all parameters apply to our instrument, see below for details specific to the KNI's Nova 600)
===== SEM Specifications =====
* Minimum Feature Size Resolved in Immersion Mode: ~5 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: ~10 pA to 20 nA
* Apertures: 10 μm, 15 μm, 20 μm, 30 μm
* Eucentric Height: ~5.15 mm working distance (WD)
* Stage Range: ±80 mm X & Y travel, 12 mm Z travel, -12 to 58° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
* Ultimate Vacuum: 5e-7 mbar
===== Ga-FIB Specifications =====
* Minumum Probe Size Achieved: ~7 nm
* Minimum Feature Size Etched: ~25 nm
* Minimum Feature Size Resolved by Imaging: ~10 nm
* Voltage Range: 5 to 30 kV
* Current Range: 1 pA to 20 nA
* Eucentric Height: ~5.15 mm working distance (WD)
* Stage Tilt to be perpendicular to Ga-FIB: 52°
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
 
 
== Related Instrumentation in the KNI ==
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM & EDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]


===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

Nova 200 NanoLab: SEM & EDS

2022-06-29T21:19:59Z

Awolff: /* Resources */

Nova 200 NanoLab: SEM & EDS

2022-06-29T21:13:51Z

Awolff: /* Order Your Own Stubs */

{{InstrumentInfoboxOneImage|
|InstrumentName = Nova 200
|HeaderColor = #F5A81C
|ImageOne = Nova-200-NanoLab.jpg
|ImageTwo = Nova-200-NanoLab.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B203 Steele
|LabPhone = 626-395-1542
|PrimaryStaff = [[Annalena Wolff]]
|StaffEmail = awolff@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = FEI (now Thermo Fisher)
|Model = Nova 200 NanoLab
|Techniques = SEM, EDS Immersion Lens Imaging
|RequestTraining = awolff@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Nova 200 is the KNI's highest-resolution field-emission gun (FEG) analytical scanning electron microscope (SEM), equipped with an immersion lens for imaging sub-10 nm features and energy dispersive spectroscopy (EDS) for compositional analysis. It is also outfitted with a gallium focused ion beam (Ga-FIB) column, which is currently not operational because the [[Nova_600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600 NanoLab]] and [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]] together meet the KNI's Ga-FIB demand; Ga-FIB could be reactivated on the Nova 200 in the future. See a full list of training and educational resources for this instrument below.
===== SEM Applications =====
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* Secondary Electron (SE) imaging with an Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)
* Backscattered Electron (BSE) imaging with a TLD
* Tungsten deposition via Gas Injection System (GIS)
* Automated imaging with RunScript program & AutoScript language
===== EDS Applications =====
* Spectrum acquisition for qualitative and quantitative compositional analysis
* Linescan acquisition for 1D spatial compositional analysis
* Map acquisition for 2D spatial compositional analysis

== Resources ==
===== Equipment Data =====
* [https://caltech.box.com/s/oy9kdmiwszygacoov2ko1a9njb8jghod Microscopy Pass-down equipment information]
===== SOPs & Manuals & SDS =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* [https://caltech.box.com/s/4f1hqp83pwc1v1k5qke6xi68i28fjvz8 Nova200 and EDS SOP, Manuals, SDS]

===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]
* Bruker EDS ESPRIT 2 Software ([https://caltech.app.box.com/file/766742876889 Overview] | [https://caltech.box.com/s/gbzj8crfyhwkvs3aelsjpdfe9zpd8goc Basic Spectrum Collection and ID] | [https://caltech.app.box.com/file/766741864978?s=l77v3pct05r6q856sq53az5t0bugc6n4 Spectrum Acquisiton] | [https://caltech.box.com/s/cjshqsjmpto2sac78xw46anc6j1fl2y6 AutoID Verification] | [https://caltech.box.com/s/lbywvcpdw4t1i892b2bo0qg7jztf23jb Object Mode (Multi-Point Analysis)] | [https://caltech.app.box.com/file/766738174372 Line Profile Analysis])

===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM & EDS/WDS Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]
===== Presentations =====
* Scanning Electron Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]
* Gallium Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/og4309108q4k2jwhkaxqtpiujg2al5iu Nova NanoLab Operation Manual]
* [https://caltech.box.com/s/fime6qbew8bj2zac9a0vc4gx4qaivssd Bruker Quantax EDS Operation Manual]
* [https://caltech.box.com/s/zb5m72tc5c61pegangjjwj3wc8rbj1vr Gas Injection Systems – Deposition of Tungsten (Technical Note)]
* [https://caltech.box.com/s/th6cpko7opc9pccn2ukmdc88oh8oa6zw Gas Injection Systems – Delineation Etch for SiO2 (Technical Note)]
* [https://caltech.box.com/s/u56ho1hve4pf9713aw09iolukfc8wsb1 Gas Injection Systems – Selective Carbon Etching (Technical Note)]
* [https://caltech.box.com/s/110tb0o8avjziwa1y4d017dbbcpkxfop Scripting – AutoScript Language Manual (year 2000 Technical Note: most complete)]
* [https://caltech.box.com/s/tlqgvtkkiahi261megm087i61gqlfzrc Scripting – RunScript Manual]

===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software] – simulate e-beam/specimen interactions (very useful for EDS & WDS)
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM)] – simulate i-beam/specimen interactions
===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.
===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/nmws6w7643ne8mraljjar6c4epw0anpp Nova 200 NanoLab Data Sheet] (not all parameters apply to our instrument, see below for details specific to the KNI's Nova 200)
===== SEM Specifications =====
* Minimum Feature Size Resolved in Immersion Mode: ~5 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: ~10 pA to 20 nA
* Apertures: 30 μm, 40 μm, 50 μm, 100 μm
* Eucentric Height: ~4.8 mm working distance (WD)
* Stage Range: ±25 mm X & Y travel, 50 mm Z travel, -12 to 58° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
* Ultimate Vacuum: 5e-6 mbar
 
 
== Related Instrumentation in the KNI ==
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM & EDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]

===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]


===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

Nova 200 NanoLab: SEM & EDS

2022-06-29T21:10:50Z

Awolff:

{{InstrumentInfoboxOneImage|
|InstrumentName = Nova 200
|HeaderColor = #F5A81C
|ImageOne = Nova-200-NanoLab.jpg
|ImageTwo = Nova-200-NanoLab.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B203 Steele
|LabPhone = 626-395-1542
|PrimaryStaff = [[Annalena Wolff]]
|StaffEmail = awolff@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = FEI (now Thermo Fisher)
|Model = Nova 200 NanoLab
|Techniques = SEM, EDS Immersion Lens Imaging
|RequestTraining = awolff@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Nova 200 is the KNI's highest-resolution field-emission gun (FEG) analytical scanning electron microscope (SEM), equipped with an immersion lens for imaging sub-10 nm features and energy dispersive spectroscopy (EDS) for compositional analysis. It is also outfitted with a gallium focused ion beam (Ga-FIB) column, which is currently not operational because the [[Nova_600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600 NanoLab]] and [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]] together meet the KNI's Ga-FIB demand; Ga-FIB could be reactivated on the Nova 200 in the future. See a full list of training and educational resources for this instrument below.
===== SEM Applications =====
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* Secondary Electron (SE) imaging with an Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)
* Backscattered Electron (BSE) imaging with a TLD
* Tungsten deposition via Gas Injection System (GIS)
* Automated imaging with RunScript program & AutoScript language
===== EDS Applications =====
* Spectrum acquisition for qualitative and quantitative compositional analysis
* Linescan acquisition for 1D spatial compositional analysis
* Map acquisition for 2D spatial compositional analysis

== Resources ==
===== Equipment Data =====
* [https://caltech.box.com/s/oy9kdmiwszygacoov2ko1a9njb8jghod Microscopy Pass-down equipment information]
===== SOPs & Manuals & SDS =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* [https://caltech.box.com/s/4f1hqp83pwc1v1k5qke6xi68i28fjvz8 Nova200 and EDS SOP, Manuals, SDS]

===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]
* Bruker EDS ESPRIT 2 Software ([https://caltech.app.box.com/file/766742876889 Overview] | [https://caltech.box.com/s/gbzj8crfyhwkvs3aelsjpdfe9zpd8goc Basic Spectrum Collection and ID] | [https://caltech.app.box.com/file/766741864978?s=l77v3pct05r6q856sq53az5t0bugc6n4 Spectrum Acquisiton] | [https://caltech.box.com/s/cjshqsjmpto2sac78xw46anc6j1fl2y6 AutoID Verification] | [https://caltech.box.com/s/lbywvcpdw4t1i892b2bo0qg7jztf23jb Object Mode (Multi-Point Analysis)] | [https://caltech.app.box.com/file/766738174372 Line Profile Analysis])

===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM & EDS/WDS Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]
===== Presentations =====
* Scanning Electron Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]
* Gallium Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/og4309108q4k2jwhkaxqtpiujg2al5iu Nova NanoLab Operation Manual]
* [https://caltech.box.com/s/fime6qbew8bj2zac9a0vc4gx4qaivssd Bruker Quantax EDS Operation Manual]
* [https://caltech.box.com/s/zb5m72tc5c61pegangjjwj3wc8rbj1vr Gas Injection Systems – Deposition of Tungsten (Technical Note)]
* [https://caltech.box.com/s/th6cpko7opc9pccn2ukmdc88oh8oa6zw Gas Injection Systems – Delineation Etch for SiO2 (Technical Note)]
* [https://caltech.box.com/s/u56ho1hve4pf9713aw09iolukfc8wsb1 Gas Injection Systems – Selective Carbon Etching (Technical Note)]
* [https://caltech.box.com/s/110tb0o8avjziwa1y4d017dbbcpkxfop Scripting – AutoScript Language Manual (year 2000 Technical Note: most complete)]
* [https://caltech.box.com/s/tlqgvtkkiahi261megm087i61gqlfzrc Scripting – RunScript Manual]

===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software] – simulate e-beam/specimen interactions (very useful for EDS & WDS)
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM)] – simulate i-beam/specimen interactions
===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.
===== Order Your Own Stubs =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some old stubs at each SEM, yet you should buy your own so that you can keep them clean and available to you. There are many stub geometries and configurations, some of which will be right for you to purchase and keep with your other cleanroom items.
** [https://www.tedpella.com/SEM_html/SEMclip.htm.aspx Buy stubs with copper clips] (recommended for most devices, especially those with non-conductive substrates)
** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips] (OK for devices with conductive substrates)
===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/nmws6w7643ne8mraljjar6c4epw0anpp Nova 200 NanoLab Data Sheet] (not all parameters apply to our instrument, see below for details specific to the KNI's Nova 200)
===== SEM Specifications =====
* Minimum Feature Size Resolved in Immersion Mode: ~5 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: ~10 pA to 20 nA
* Apertures: 30 μm, 40 μm, 50 μm, 100 μm
* Eucentric Height: ~4.8 mm working distance (WD)
* Stage Range: ±25 mm X & Y travel, 50 mm Z travel, -12 to 58° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
* Ultimate Vacuum: 5e-6 mbar
 
 
== Related Instrumentation in the KNI ==
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM & EDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]

===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]


===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

Nova 200 NanoLab: SEM & EDS

2022-06-29T18:08:00Z

Awolff: /* EDS Applications */

{{InstrumentInfoboxOneImage|
|InstrumentName = Nova 200
|HeaderColor = #F5A81C
|ImageOne = Nova-200-NanoLab.jpg
|ImageTwo = Nova-200-NanoLab.jpg
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]]
|RoomLocation = B203 Steele
|LabPhone = 626-395-1542
|PrimaryStaff = [[Annalena Wolff]]
|StaffEmail = awolff@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = FEI (now Thermo Fisher)
|Model = Nova 200 NanoLab
|Techniques = SEM, EDS Immersion Lens Imaging
|RequestTraining = awolff@caltech.edu
|EmailList = kni-sem-fib
|EmailListName = SEM-FIB
}}
== Description ==
The Nova 200 is the KNI's highest-resolution field-emission gun (FEG) analytical scanning electron microscope (SEM), equipped with an immersion lens for imaging sub-10 nm features and energy dispersive spectroscopy (EDS) for compositional analysis. It is also outfitted with a gallium focused ion beam (Ga-FIB) column, which is currently not operational because the [[Nova_600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600 NanoLab]] and [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab]] together meet the KNI's Ga-FIB demand; Ga-FIB could be reactivated on the Nova 200 in the future. See a full list of training and educational resources for this instrument below.
===== SEM Applications =====
* Ultra-High-Resolution Imaging (Immersion Mode aka UHR Mode)
* High-Resolution Imaging (Field-Free Mode aka Normal Mode)
* Secondary Electron (SE) imaging with an Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)
* Backscattered Electron (BSE) imaging with a TLD
* Tungsten deposition via Gas Injection System (GIS)
* Automated imaging with RunScript program & AutoScript language
===== EDS Applications =====
* Spectrum acquisition for qualitative and quantitative compositional analysis
* Linescan acquisition for 1D spatial compositional analysis
* Map acquisition for 2D spatial compositional analysis

== Resources ==
===== Equipment Data =====
* [https://caltech.box.com/s/xlvbr7cfwiqzcpc9hpq4jxed8mhl6c4j Microscopy Pass-down equipment information]
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* SEM SOPs ([https://caltech.box.com/s/4yv8f5att77k3zq1rm6p0mqhkd8quslh Short Version] | [https://caltech.box.com/s/xwjdudqdl793gkc5kl71zez5nnc5y2xb Long Version])
* Bruker Quantax EDS SOP ([https://caltech.box.com/s/y6hbvdj4r4n287j1db79t16q5hphp8vn Dashboard])
* [https://caltech.box.com/s/sz9pai0icsntnef6me23veiwtwdui0gm Troubleshooting Guide]

===== Video Tutorials =====
* [https://youtu.be/UfF_ljwvepQ Getting Started] | [https://youtu.be/luC-5TgNPsQ Basic SEM Alignment]
* Astigmatism Correction ([https://youtu.be/YeukVt1Fyi0 Details] | [https://youtu.be/WFfOi-rwlbA On Right-Angle Features] | [https://youtu.be/1syySgnTEqU Stigmator Alignment])
* [https://youtu.be/4V-bE6uqHY4 Eucentric Height: What it means, When to use it & How to get there]
* [https://youtu.be/R_RYbtumU20 Adjusting TLD Voltage to Capture SE vs. BSE Signal]
* Bruker EDS ESPRIT 2 Software ([https://caltech.app.box.com/file/766742876889 Overview] | [https://caltech.box.com/s/gbzj8crfyhwkvs3aelsjpdfe9zpd8goc Basic Spectrum Collection and ID] | [https://caltech.app.box.com/file/766741864978?s=l77v3pct05r6q856sq53az5t0bugc6n4 Spectrum Acquisiton] | [https://caltech.box.com/s/cjshqsjmpto2sac78xw46anc6j1fl2y6 AutoID Verification] | [https://caltech.box.com/s/lbywvcpdw4t1i892b2bo0qg7jztf23jb Object Mode (Multi-Point Analysis)] | [https://caltech.app.box.com/file/766738174372 Line Profile Analysis])

===== Graphical Handouts =====
* [https://caltech.box.com/s/pxl99bbc1jm1tbjshfaotm91xm0mqs1i SEM & EDS/WDS Concepts]
* [https://caltech.box.com/s/k2iy75hxiwkehv0ogqelz2sux9e1cs5k SEM Alignments]
* [https://caltech.box.com/s/ijd8gprg9gcavb6of5uegu7osinzsdet Guide to Optimizing SEM Imaging]
===== Presentations =====
* Scanning Electron Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f Pptx Slides] | [https://youtu.be/Zh21tp3aPEw YouTube Lecture]
* Gallium Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/og4309108q4k2jwhkaxqtpiujg2al5iu Nova NanoLab Operation Manual]
* [https://caltech.box.com/s/fime6qbew8bj2zac9a0vc4gx4qaivssd Bruker Quantax EDS Operation Manual]
* [https://caltech.box.com/s/zb5m72tc5c61pegangjjwj3wc8rbj1vr Gas Injection Systems – Deposition of Tungsten (Technical Note)]
* [https://caltech.box.com/s/th6cpko7opc9pccn2ukmdc88oh8oa6zw Gas Injection Systems – Delineation Etch for SiO2 (Technical Note)]
* [https://caltech.box.com/s/u56ho1hve4pf9713aw09iolukfc8wsb1 Gas Injection Systems – Selective Carbon Etching (Technical Note)]
* [https://caltech.box.com/s/b95pg59k003i9vn8y9elzem0tnxqg3fb Gas Injection Systems – Beam Chemistries Presentation]
* [https://caltech.box.com/s/110tb0o8avjziwa1y4d017dbbcpkxfop Scripting – AutoScript Language Manual (year 2000 Technical Note: most complete)]
* [https://caltech.box.com/s/n0abqy5z1e9a8hbyf38qybxu86sqz3vb Scripting – AutoScript Language Manual (year 2005 Technical Note: less complete, still useful)]
* [https://caltech.box.com/s/tlqgvtkkiahi261megm087i61gqlfzrc Scripting – RunScript Manual]
* [https://caltech.box.com/s/36j0n01ig7f757kvkiebvqjqj0el2yvp EDAX Genesis EDS & WDS Operation Manual (replaced - historic reference)]
* EDAX archived EDS SOPs ([https://caltech.box.com/s/52uckmx1silq90vq918gziohjtbqzyh5 Short Version] | [https://caltech.box.com/s/kukccwu1m8ekfjo6jds4jupvzwsjs3z1 Long Version])

===== Simulation Software =====
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software] – simulate e-beam/specimen interactions (very useful for EDS & WDS)
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM)] – simulate i-beam/specimen interactions
===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which SEM measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon.
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them.
===== Order Your Own Stubs =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some old stubs at each SEM, yet you should buy your own so that you can keep them clean and available to you. There are many stub geometries and configurations, some of which will be right for you to purchase and keep with your other cleanroom items.
** [https://www.tedpella.com/SEM_html/SEMclip.htm.aspx Buy stubs with copper clips] (recommended for most devices, especially those with non-conductive substrates)
** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips] (OK for devices with conductive substrates)
===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/nmws6w7643ne8mraljjar6c4epw0anpp Nova 200 NanoLab Data Sheet] (not all parameters apply to our instrument, see below for details specific to the KNI's Nova 200)
===== SEM Specifications =====
* Minimum Feature Size Resolved in Immersion Mode: ~5 nm
* Voltage Range: 0.2 to 30.0 kV
* Current Range: ~10 pA to 20 nA
* Apertures: 30 μm, 40 μm, 50 μm, 100 μm
* Eucentric Height: ~4.8 mm working distance (WD)
* Stage Range: ±25 mm X & Y travel, 50 mm Z travel, -12 to 58° tilt, 360° rotation
* ETD Grid Bias Range: -150 to 300 V
* TLD Bias Range: -100 to 150 V
* Ultimate Vacuum: 5e-6 mbar
 
 
== Related Instrumentation in the KNI ==
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM & EDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]

===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]


===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

ORION NanoFab: Helium, Neon & Gallium FIB

2021-11-11T19:15:44Z

Awolff: /* Sample Preparation */

{{InstrumentInfobox|
|InstrumentName = ORION NanoFab
|HeaderColor = #F5A81C
|ImageOne = Nanocoil-Inductor_Matthew-S-Hunt.jpg
|ImageTwo = ORION-NanoFab.JPG
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]], [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B203D Steele
|LabPhone = 626-395-1548
|PrimaryStaff = [[Lena Wolff, PhD]]
|StaffEmail = awolff@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = ZEISS (Carl Zeiss AG)
|Model = ORION NanoFab
|Techniques = High-Resolution He Imaging, He/Ne/Ga-FIB Etching, He & Ne Ion Lithography, Charge Compensation (with Electron Flood Gun), Cross-Sectioning
|RequestTraining = awolff@caltech.edu
|EmailList = kni-orion
|EmailListName = ORION
}}
== Description ==
The ORION NanoFab is a focused ion beam (FIB) system capable of generating three different ion beams – helium & neon from the gas field ion source (GFIS) that is aligned on the main optical axis, and gallium offset by 54°, as in a more traditional "dual beam" FIB/SEM (scanning electron microscope). The He beam, which can be formed into a sub-0.5 nm probe size, is capable of high-resolution imaging, lithography and etching, with each performing in the sub-5 nm regime. The Ne beam, with a 1.9 nm probe size, can etch sub-15 nm features with order-of-magnitude higher volume-removal rates than He, and perform sub-10 nm lithography on resist. The Ga beam, with a 5 nm minimum probe size, can remove relatively large volumes of material by direct etching. In all, the three beams, each operating over large energy ranges (see specifications below for details), provide multitudes of nanofabrication opportunities in a single system.

===== Imaging Applications =====
* Ultra-High-Resolution imaging (capable of resolving sub-5 nm features)
* High depth of field imaging (compared to SEM)
* Image non-conductive specimens using an electron flood gun for charge compensation
===== Etching Applications =====
* Directly etch patterns into material with all three beams – He, Ne & Ga
* Cutting & Imaging Cross-Sections (using Ga)
* Final thinning of TEM lamellae (using Ne)
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)
===== Lithography Applications =====
* High-resolution patterning on resist (35 keV He ions can perform better than 100 keV electrons)
* Automatic alignment to markers and automated processing (manually confirmed alignment also available)
* Resist patterning on non-conductive specimens
* Resist Pattering on curved substrates due to high depth of field
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)

== Resources ==
===== Equipment Data =====
* [https://caltech.box.com/s/xlvbr7cfwiqzcpc9hpq4jxed8mhl6c4j Microscopy Pass-down equipment information]
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* [https://caltech.box.com/s/ss38zzz4pl73ufuojwl8hp7gbo4x4cls SOP for Basic Operation of ORION NanoFab]
* [https://caltech.box.com/s/g5k3qt50jgrc0hyszjcmaxaeo9wtygx3 SOP for Operating Raith ELPHY MultiBeam Pattern Generator]

===== Process Recipes =====
These process recipes highlight a possible approach for different application. There are many different ways to operate and optimize parameters and this is generally sample dependent and need to be optimized by the operator for each sample.
* [https://caltech.box.com/s/ybdwd4zi39p62bx13rc7f8o54444vuyz Helium Ion Beam Imaging with the Electron Flood Gun – Parameter Guide]
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Guide]
* [https://caltech.box.com/s/y8k2a4xnan8x2jte2ss587gh2o2pfs4h Ne-FIB Hard Mask Lithography on ALD Films – Parameter Guide]

===== Video Tutorials =====
The resources are currently being updated. The updated tutorials will be uploaded shortly.

===== Graphical Handouts =====
* [https://caltech.box.com/s/g49bay7wrxwx0tldugeekylpvl168d1t GFIS Concepts]
* [https://caltech.box.com/s/xm9sxohjoeyn7y5m72az1b0ot9qu404r GFIS Alignments]
* [https://caltech.box.com/s/kxaxtslwol1o5a276f3lrqbhss8zvwje Ga-FIB Concepts]
===== Presentations =====
* Helium & Neon Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/ibe1nt5rd1u2kmvnfbjs2dj9lg28mch7 Pptx Slides] | [https://youtu.be/JXS3K8G2CVY YouTube Lecture]
* Gallium Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/4y5l7f7ca0pgs4hampyqp3b9e76e6u6q Zeiss ORION NanoFab Operation Manual (Caltech-only)]
* Raith ELPHY MultiBeam: [https://caltech.box.com/s/2bvojmswnmlei95lei66ddnunm85pp22 Software Operation Manual] | [https://caltech.box.com/s/tt7omr53h1u88laulm1h5mooq4tbtcgi Software Reference Manual] |[https://caltech.box.com/s/64nmggwdfef8omz4m1zd50ftog4rhshm Step-by-Step Patterning Guide]
* [https://caltech.box.com/s/9rddai829l0xz09agynh1taugj67bo8z Nanometer Patterning & Visualization Engine (NPVE) Operation Manual]

===== Simulation Software =====
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM) – simulate i-beam/specimen interactions]
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software – simulate e-beam/specimen interactions]

===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which FIB measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating hydrocarbon deposition on your features while imaging them (the ORION's in-chamber plasma cleaner can be used in extreme cases where the sample must be cleaned directly before the experiment is conducted, without exposing it to the atmosphere while transferring it from the outside cleaner to the ORION chamber; excessive numbers of chamber cleanings can have adverse effects on the ORION over time so consult with staff on how and when to do this).
* There is no need to coat non-conductive samples, the ORION NanoFab is equipped with a floodgun which can be used for charge compensation.
* You can of course still use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon (first try using the in-chamber electron flood gun to alleviate charge artifacts).

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/gilv2k40zjmpzhr439lh7tg4b9920kaa Zeiss ORION NanoFab Product Guide & Data Sheet]
* [https://caltech.box.com/s/isy1fitgql2ywlak7472grvva1ge8c1c Raith ELPHY MultiBeam Product Guide & Data Sheet]

===== Overall System Specifications =====
* Eucentric Height: ~9.1 mm working distance (WD)
* Allowable Sample Width: 80 mm (this is the width of the load lock opening)
* Stage Range: ±24 mm X & Y travel, 8 mm Z travel, -10 to 58° tilt, 360° rotation

* ETD Grid Bias Range: -250 to 250 V
* Stage Bias Range: -500 to 500 V
* Ultimate Vacuum: 2e-7 Torr

===== He-FIB Specifications =====
* Minimum Feature Size Resolved with He Imaging: ~3 nm
* Minumum Probe Size: 0.35 nm
* Voltage Range: 5 to 40 kV
* Current Range: 0.1 to 100 pA

===== Ne-FIB Specifications =====
* Minimum Feature Size Resolved with Ne Imaging: ~7 nm
* Minumum Probe Size: 1.9 nm
* Voltage Range: 5 to 35 kV
* Current Range: 0.1 to 50 pA

===== Ga-FIB Specifications =====
* Minimum Feature Size Resolved with Ga Imaging: ~10 nm
* Minumum Probe Size: 3 nm
* Voltage Range: 1 to 30 kV
* Current Range: 1 pA to 100 nA

===== Electron Flood Gun Specifications =====
* Probe Diameter: millimeters (can be roughly focused)
* Voltage Range: 0.025 to 1.0 kV
* Current: ~1 μA
* Dwell Time Range: 50 to 10000 μs

===== Raith ELPHY MultiBeam Specifications =====
* Shapes Available: Polygons (area dose), Single Pass Lines (line dose) & Dot Arrays (point dose) of any arbitrary shape
* Import CAD files as .dxf or .gds files
* Writing Speed: 20 MHz
* Digital-to-Analog Converter (DAC): 16-bit
 
 
== Related Instrumentation in the KNI ==
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | EBPG 5200: Electron Beam Pattern Generator (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: Electron Beam Pattern Generator (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM, STEM, EDS, EELS, EFTEM & Lithography (40-200 kV)]]
===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

ORION NanoFab: Helium, Neon & Gallium FIB

2021-11-11T19:12:28Z

Awolff: /* Order Your Own Stubs */

{{InstrumentInfobox|
|InstrumentName = ORION NanoFab
|HeaderColor = #F5A81C
|ImageOne = Nanocoil-Inductor_Matthew-S-Hunt.jpg
|ImageTwo = ORION-NanoFab.JPG
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]], [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B203D Steele
|LabPhone = 626-395-1548
|PrimaryStaff = [[Lena Wolff, PhD]]
|StaffEmail = awolff@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = ZEISS (Carl Zeiss AG)
|Model = ORION NanoFab
|Techniques = High-Resolution He Imaging, He/Ne/Ga-FIB Etching, He & Ne Ion Lithography, Charge Compensation (with Electron Flood Gun), Cross-Sectioning
|RequestTraining = awolff@caltech.edu
|EmailList = kni-orion
|EmailListName = ORION
}}
== Description ==
The ORION NanoFab is a focused ion beam (FIB) system capable of generating three different ion beams – helium & neon from the gas field ion source (GFIS) that is aligned on the main optical axis, and gallium offset by 54°, as in a more traditional "dual beam" FIB/SEM (scanning electron microscope). The He beam, which can be formed into a sub-0.5 nm probe size, is capable of high-resolution imaging, lithography and etching, with each performing in the sub-5 nm regime. The Ne beam, with a 1.9 nm probe size, can etch sub-15 nm features with order-of-magnitude higher volume-removal rates than He, and perform sub-10 nm lithography on resist. The Ga beam, with a 5 nm minimum probe size, can remove relatively large volumes of material by direct etching. In all, the three beams, each operating over large energy ranges (see specifications below for details), provide multitudes of nanofabrication opportunities in a single system.

===== Imaging Applications =====
* Ultra-High-Resolution imaging (capable of resolving sub-5 nm features)
* High depth of field imaging (compared to SEM)
* Image non-conductive specimens using an electron flood gun for charge compensation
===== Etching Applications =====
* Directly etch patterns into material with all three beams – He, Ne & Ga
* Cutting & Imaging Cross-Sections (using Ga)
* Final thinning of TEM lamellae (using Ne)
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)
===== Lithography Applications =====
* High-resolution patterning on resist (35 keV He ions can perform better than 100 keV electrons)
* Automatic alignment to markers and automated processing (manually confirmed alignment also available)
* Resist patterning on non-conductive specimens
* Resist Pattering on curved substrates due to high depth of field
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)

== Resources ==
===== Equipment Data =====
* [https://caltech.box.com/s/xlvbr7cfwiqzcpc9hpq4jxed8mhl6c4j Microscopy Pass-down equipment information]
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* [https://caltech.box.com/s/ss38zzz4pl73ufuojwl8hp7gbo4x4cls SOP for Basic Operation of ORION NanoFab]
* [https://caltech.box.com/s/g5k3qt50jgrc0hyszjcmaxaeo9wtygx3 SOP for Operating Raith ELPHY MultiBeam Pattern Generator]

===== Process Recipes =====
These process recipes highlight a possible approach for different application. There are many different ways to operate and optimize parameters and this is generally sample dependent and need to be optimized by the operator for each sample.
* [https://caltech.box.com/s/ybdwd4zi39p62bx13rc7f8o54444vuyz Helium Ion Beam Imaging with the Electron Flood Gun – Parameter Guide]
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Guide]
* [https://caltech.box.com/s/y8k2a4xnan8x2jte2ss587gh2o2pfs4h Ne-FIB Hard Mask Lithography on ALD Films – Parameter Guide]

===== Video Tutorials =====
The resources are currently being updated. The updated tutorials will be uploaded shortly.

===== Graphical Handouts =====
* [https://caltech.box.com/s/g49bay7wrxwx0tldugeekylpvl168d1t GFIS Concepts]
* [https://caltech.box.com/s/xm9sxohjoeyn7y5m72az1b0ot9qu404r GFIS Alignments]
* [https://caltech.box.com/s/kxaxtslwol1o5a276f3lrqbhss8zvwje Ga-FIB Concepts]
===== Presentations =====
* Helium & Neon Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/ibe1nt5rd1u2kmvnfbjs2dj9lg28mch7 Pptx Slides] | [https://youtu.be/JXS3K8G2CVY YouTube Lecture]
* Gallium Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/4y5l7f7ca0pgs4hampyqp3b9e76e6u6q Zeiss ORION NanoFab Operation Manual (Caltech-only)]
* Raith ELPHY MultiBeam: [https://caltech.box.com/s/2bvojmswnmlei95lei66ddnunm85pp22 Software Operation Manual] | [https://caltech.box.com/s/tt7omr53h1u88laulm1h5mooq4tbtcgi Software Reference Manual] |[https://caltech.box.com/s/64nmggwdfef8omz4m1zd50ftog4rhshm Step-by-Step Patterning Guide]
* [https://caltech.box.com/s/9rddai829l0xz09agynh1taugj67bo8z Nanometer Patterning & Visualization Engine (NPVE) Operation Manual]

===== Simulation Software =====
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM) – simulate i-beam/specimen interactions]
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software – simulate e-beam/specimen interactions]

===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which FIB measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon (first try using the in-chamber electron flood gun to alleviate charge artifacts).
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them (the ORION's in-chamber plasma cleaner can be used in extreme cases where the sample must be cleaned directly before the experiment is conducted, without exposing it to the atmosphere while transferring it from the outside cleaner to the ORION chamber; excessive numbers of chamber cleanings can have adverse effects on the ORION over time so consult with staff on how and when to do this).

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/gilv2k40zjmpzhr439lh7tg4b9920kaa Zeiss ORION NanoFab Product Guide & Data Sheet]
* [https://caltech.box.com/s/isy1fitgql2ywlak7472grvva1ge8c1c Raith ELPHY MultiBeam Product Guide & Data Sheet]

===== Overall System Specifications =====
* Eucentric Height: ~9.1 mm working distance (WD)
* Allowable Sample Width: 80 mm (this is the width of the load lock opening)
* Stage Range: ±24 mm X & Y travel, 8 mm Z travel, -10 to 58° tilt, 360° rotation

* ETD Grid Bias Range: -250 to 250 V
* Stage Bias Range: -500 to 500 V
* Ultimate Vacuum: 2e-7 Torr

===== He-FIB Specifications =====
* Minimum Feature Size Resolved with He Imaging: ~3 nm
* Minumum Probe Size: 0.35 nm
* Voltage Range: 5 to 40 kV
* Current Range: 0.1 to 100 pA

===== Ne-FIB Specifications =====
* Minimum Feature Size Resolved with Ne Imaging: ~7 nm
* Minumum Probe Size: 1.9 nm
* Voltage Range: 5 to 35 kV
* Current Range: 0.1 to 50 pA

===== Ga-FIB Specifications =====
* Minimum Feature Size Resolved with Ga Imaging: ~10 nm
* Minumum Probe Size: 3 nm
* Voltage Range: 1 to 30 kV
* Current Range: 1 pA to 100 nA

===== Electron Flood Gun Specifications =====
* Probe Diameter: millimeters (can be roughly focused)
* Voltage Range: 0.025 to 1.0 kV
* Current: ~1 μA
* Dwell Time Range: 50 to 10000 μs

===== Raith ELPHY MultiBeam Specifications =====
* Shapes Available: Polygons (area dose), Single Pass Lines (line dose) & Dot Arrays (point dose) of any arbitrary shape
* Import CAD files as .dxf or .gds files
* Writing Speed: 20 MHz
* Digital-to-Analog Converter (DAC): 16-bit
 
 
== Related Instrumentation in the KNI ==
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | EBPG 5200: Electron Beam Pattern Generator (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: Electron Beam Pattern Generator (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM, STEM, EDS, EELS, EFTEM & Lithography (40-200 kV)]]
===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

Equipment List

2021-11-11T19:11:52Z

Awolff: /* Sample Preparation for Microscopy */

'''NOTE: For EQUIPMENT TRAINING, contact the tool owner via Email for scheduling - DO NOT USE Labrunr - Training Sessions.'''

== Lithography ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 kV)]]
===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)]]
===== Optical Lithography =====
* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Optical Lithography Resources]]

== Deposition ==
===== Evaporation =====
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]]
* [[CHA: Electron Beam Evaporator | Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator]]
* [[Carbon Evaporator | Carbon: Leica EM ACE600 Carbon Evaporator]]
===== Sputtering =====
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]

===== Chemical Vapor Deposition (CVD) =====
* [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]]
===== Dielectric Packaging / Moisture Barrier =====
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]

== Etching ==
===== Dry Etching =====
* [[DRIE: Bosch & Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE]]
* [[ICP-RIE: III-V, Metal & Silicon Etcher | III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]
* [[Dual Chamber RIE: Silicon, III-V Material & Organics Etcher | Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]]
* [[XeF2 Etcher for Silicon | XeF2 Etcher for Silicon]]

===== Wet Etching =====
* [[Wet Chemistry | Available Wet Etching Techniques]]

== Microscopy ==
===== KNI Microscopy Policies =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

===== Focused Ion Beam (FIB) Systems =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | Helium, Neon & Gallium FIB: Zeiss ORION NanoFab]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 200 NanoLab: SEM, EDS & WDS | SEM & EDS: Thermo Fisher Nova 200 NanoLab]]
* [[Sirion: SEM & EDS | SEM & EDS: Thermo Fisher Sirion]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]

===== Transmission Electron Microscopes (TEMs) =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | TEM, STEM, EDS & HAADF: Thermo Fisher Tecnai TF-30 (50-300 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | TEM, STEM, EDS, EELS, EFTEM & Lithography: Thermo Fisher Tecnai TF-20 (40-200 kV)]]

===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]

===== Optical Characterization =====
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]

===== Stubs for specimen mounting =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

== Wet Chemistry ==
===== Wet Chemistry Main page=====
* [[Wet Chemistry | Wet Chemistry page:]] - Facilities, Procedures & Safety, Chemical Lists
===== Wet Chemistry Safety page=====
* [[Wet Chemistry Safety | Wet Chemistry Safety page]] - Requesting new chemical, PPE Overview, Hazardous Waste Handling and Labeling, Decanting Chemicals, Hot Plate Rules, Buddy System, Secondary Containment and Other Best Practices.
===== Wet Chemistry Resources page=====
* [[Wet Chemistry Resources | Wet Chemistry Resources page]] - Contains fabrication recipes and procedures.

== Support Tools ==
===== Laboratory Data =====
* [https://caltech.box.com/s/cl3ujgau2afl45joem7mg15e0oyxcgab General Laboratory Pass-down status information]
===== Thermal Processing =====
* [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]]
* [[Rapid Thermal Processor | Rapid Thermal Processing: Modular Process Technology RTP-600S]]
===== Substrate Processing =====
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]
* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]
* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]
===== Device Processing =====
* [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
===== Metrology =====
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]

===== Sample Preparation =====
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]

Equipment List

2021-11-11T19:09:08Z

Awolff: /* Sample Preparation for Microscopy */

'''NOTE: For EQUIPMENT TRAINING, contact the tool owner via Email for scheduling - DO NOT USE Labrunr - Training Sessions.'''

== Lithography ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 kV)]]
===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)]]
===== Optical Lithography =====
* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Optical Lithography Resources]]

== Deposition ==
===== Evaporation =====
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]]
* [[CHA: Electron Beam Evaporator | Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator]]
* [[Carbon Evaporator | Carbon: Leica EM ACE600 Carbon Evaporator]]
===== Sputtering =====
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]

===== Chemical Vapor Deposition (CVD) =====
* [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]]
===== Dielectric Packaging / Moisture Barrier =====
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]

== Etching ==
===== Dry Etching =====
* [[DRIE: Bosch & Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE]]
* [[ICP-RIE: III-V, Metal & Silicon Etcher | III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]
* [[Dual Chamber RIE: Silicon, III-V Material & Organics Etcher | Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]]
* [[XeF2 Etcher for Silicon | XeF2 Etcher for Silicon]]

===== Wet Etching =====
* [[Wet Chemistry | Available Wet Etching Techniques]]

== Microscopy ==
===== KNI Microscopy Policies =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

===== Focused Ion Beam (FIB) Systems =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | Helium, Neon & Gallium FIB: Zeiss ORION NanoFab]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 200 NanoLab: SEM, EDS & WDS | SEM & EDS: Thermo Fisher Nova 200 NanoLab]]
* [[Sirion: SEM & EDS | SEM & EDS: Thermo Fisher Sirion]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]

===== Transmission Electron Microscopes (TEMs) =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | TEM, STEM, EDS & HAADF: Thermo Fisher Tecnai TF-30 (50-300 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | TEM, STEM, EDS, EELS, EFTEM & Lithography: Thermo Fisher Tecnai TF-20 (40-200 kV)]]

===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]

===== Optical Characterization =====
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
* [Order Your Own Stubs:] Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some old stubs at each Microscope. You can buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

== Wet Chemistry ==
===== Wet Chemistry Main page=====
* [[Wet Chemistry | Wet Chemistry page:]] - Facilities, Procedures & Safety, Chemical Lists
===== Wet Chemistry Safety page=====
* [[Wet Chemistry Safety | Wet Chemistry Safety page]] - Requesting new chemical, PPE Overview, Hazardous Waste Handling and Labeling, Decanting Chemicals, Hot Plate Rules, Buddy System, Secondary Containment and Other Best Practices.
===== Wet Chemistry Resources page=====
* [[Wet Chemistry Resources | Wet Chemistry Resources page]] - Contains fabrication recipes and procedures.

== Support Tools ==
===== Laboratory Data =====
* [https://caltech.box.com/s/cl3ujgau2afl45joem7mg15e0oyxcgab General Laboratory Pass-down status information]
===== Thermal Processing =====
* [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]]
* [[Rapid Thermal Processor | Rapid Thermal Processing: Modular Process Technology RTP-600S]]
===== Substrate Processing =====
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]
* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]
* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]
===== Device Processing =====
* [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
===== Metrology =====
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]

===== Sample Preparation =====
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]

Equipment List

2021-11-11T19:08:00Z

Awolff: /* Order Your Own Stubs */

'''NOTE: For EQUIPMENT TRAINING, contact the tool owner via Email for scheduling - DO NOT USE Labrunr - Training Sessions.'''

== Lithography ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 kV)]]
===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)]]
===== Optical Lithography =====
* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Optical Lithography Resources]]

== Deposition ==
===== Evaporation =====
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]]
* [[CHA: Electron Beam Evaporator | Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator]]
* [[Carbon Evaporator | Carbon: Leica EM ACE600 Carbon Evaporator]]
===== Sputtering =====
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]

===== Chemical Vapor Deposition (CVD) =====
* [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]]
===== Dielectric Packaging / Moisture Barrier =====
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]

== Etching ==
===== Dry Etching =====
* [[DRIE: Bosch & Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE]]
* [[ICP-RIE: III-V, Metal & Silicon Etcher | III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]
* [[Dual Chamber RIE: Silicon, III-V Material & Organics Etcher | Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]]
* [[XeF2 Etcher for Silicon | XeF2 Etcher for Silicon]]

===== Wet Etching =====
* [[Wet Chemistry | Available Wet Etching Techniques]]

== Microscopy ==
===== KNI Microscopy Policies =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

===== Focused Ion Beam (FIB) Systems =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | Helium, Neon & Gallium FIB: Zeiss ORION NanoFab]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 200 NanoLab: SEM, EDS & WDS | SEM & EDS: Thermo Fisher Nova 200 NanoLab]]
* [[Sirion: SEM & EDS | SEM & EDS: Thermo Fisher Sirion]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]

===== Transmission Electron Microscopes (TEMs) =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | TEM, STEM, EDS & HAADF: Thermo Fisher Tecnai TF-30 (50-300 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | TEM, STEM, EDS, EELS, EFTEM & Lithography: Thermo Fisher Tecnai TF-20 (40-200 kV)]]

===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]

===== Optical Characterization =====
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]

== Wet Chemistry ==
===== Wet Chemistry Main page=====
* [[Wet Chemistry | Wet Chemistry page:]] - Facilities, Procedures & Safety, Chemical Lists
===== Wet Chemistry Safety page=====
* [[Wet Chemistry Safety | Wet Chemistry Safety page]] - Requesting new chemical, PPE Overview, Hazardous Waste Handling and Labeling, Decanting Chemicals, Hot Plate Rules, Buddy System, Secondary Containment and Other Best Practices.
===== Wet Chemistry Resources page=====
* [[Wet Chemistry Resources | Wet Chemistry Resources page]] - Contains fabrication recipes and procedures.

== Support Tools ==
===== Laboratory Data =====
* [https://caltech.box.com/s/cl3ujgau2afl45joem7mg15e0oyxcgab General Laboratory Pass-down status information]
===== Thermal Processing =====
* [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]]
* [[Rapid Thermal Processor | Rapid Thermal Processing: Modular Process Technology RTP-600S]]
===== Substrate Processing =====
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]
* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]
* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]
===== Device Processing =====
* [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
===== Metrology =====
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]

===== Sample Preparation =====
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]

Equipment List

2021-11-11T19:07:19Z

Awolff: /* Sample Preparation for Microscopy */

'''NOTE: For EQUIPMENT TRAINING, contact the tool owner via Email for scheduling - DO NOT USE Labrunr - Training Sessions.'''

== Lithography ==
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 kV)]]
===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)]]
===== Optical Lithography =====
* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Optical Lithography Resources]]

== Deposition ==
===== Evaporation =====
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]]
* [[CHA: Electron Beam Evaporator | Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator]]
* [[Carbon Evaporator | Carbon: Leica EM ACE600 Carbon Evaporator]]
===== Sputtering =====
* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]
* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]

===== Chemical Vapor Deposition (CVD) =====
* [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]]
===== Dielectric Packaging / Moisture Barrier =====
* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]

== Etching ==
===== Dry Etching =====
* [[DRIE: Bosch & Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE]]
* [[ICP-RIE: III-V, Metal & Silicon Etcher | III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]
* [[Dual Chamber RIE: Silicon, III-V Material & Organics Etcher | Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]]
* [[XeF2 Etcher for Silicon | XeF2 Etcher for Silicon]]

===== Wet Etching =====
* [[Wet Chemistry | Available Wet Etching Techniques]]

== Microscopy ==
===== KNI Microscopy Policies =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

===== Focused Ion Beam (FIB) Systems =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | Helium, Neon & Gallium FIB: Zeiss ORION NanoFab]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 200 NanoLab: SEM, EDS & WDS | SEM & EDS: Thermo Fisher Nova 200 NanoLab]]
* [[Sirion: SEM & EDS | SEM & EDS: Thermo Fisher Sirion]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]

===== Transmission Electron Microscopes (TEMs) =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | TEM, STEM, EDS & HAADF: Thermo Fisher Tecnai TF-30 (50-300 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | TEM, STEM, EDS, EELS, EFTEM & Lithography: Thermo Fisher Tecnai TF-20 (40-200 kV)]]

===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]

===== Optical Characterization =====
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]

===== Order Your Own Stubs =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some old stubs at each Microscope. You can buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

== Wet Chemistry ==
===== Wet Chemistry Main page=====
* [[Wet Chemistry | Wet Chemistry page:]] - Facilities, Procedures & Safety, Chemical Lists
===== Wet Chemistry Safety page=====
* [[Wet Chemistry Safety | Wet Chemistry Safety page]] - Requesting new chemical, PPE Overview, Hazardous Waste Handling and Labeling, Decanting Chemicals, Hot Plate Rules, Buddy System, Secondary Containment and Other Best Practices.
===== Wet Chemistry Resources page=====
* [[Wet Chemistry Resources | Wet Chemistry Resources page]] - Contains fabrication recipes and procedures.

== Support Tools ==
===== Laboratory Data =====
* [https://caltech.box.com/s/cl3ujgau2afl45joem7mg15e0oyxcgab General Laboratory Pass-down status information]
===== Thermal Processing =====
* [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]]
* [[Rapid Thermal Processor | Rapid Thermal Processing: Modular Process Technology RTP-600S]]
===== Substrate Processing =====
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]
* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]
* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]
===== Device Processing =====
* [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
===== Metrology =====
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]

===== Sample Preparation =====
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]

ORION NanoFab: Helium, Neon & Gallium FIB

2021-11-10T19:56:18Z

Awolff: /* Manufacturer Manuals */

{{InstrumentInfobox|
|InstrumentName = ORION NanoFab
|HeaderColor = #F5A81C
|ImageOne = Nanocoil-Inductor_Matthew-S-Hunt.jpg
|ImageTwo = ORION-NanoFab.JPG
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]], [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B203D Steele
|LabPhone = 626-395-1548
|PrimaryStaff = [[Lena Wolff, PhD]]
|StaffEmail = awolff@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = ZEISS (Carl Zeiss AG)
|Model = ORION NanoFab
|Techniques = High-Resolution He Imaging, He/Ne/Ga-FIB Etching, He & Ne Ion Lithography, Charge Compensation (with Electron Flood Gun), Cross-Sectioning
|RequestTraining = awolff@caltech.edu
|EmailList = kni-orion
|EmailListName = ORION
}}
== Description ==
The ORION NanoFab is a focused ion beam (FIB) system capable of generating three different ion beams – helium & neon from the gas field ion source (GFIS) that is aligned on the main optical axis, and gallium offset by 54°, as in a more traditional "dual beam" FIB/SEM (scanning electron microscope). The He beam, which can be formed into a sub-0.5 nm probe size, is capable of high-resolution imaging, lithography and etching, with each performing in the sub-5 nm regime. The Ne beam, with a 1.9 nm probe size, can etch sub-15 nm features with order-of-magnitude higher volume-removal rates than He, and perform sub-10 nm lithography on resist. The Ga beam, with a 5 nm minimum probe size, can remove relatively large volumes of material by direct etching. In all, the three beams, each operating over large energy ranges (see specifications below for details), provide multitudes of nanofabrication opportunities in a single system.

===== Imaging Applications =====
* Ultra-High-Resolution imaging (capable of resolving sub-5 nm features)
* High depth of field imaging (compared to SEM)
* Image non-conductive specimens using an electron flood gun for charge compensation
===== Etching Applications =====
* Directly etch patterns into material with all three beams – He, Ne & Ga
* Cutting & Imaging Cross-Sections (using Ga)
* Final thinning of TEM lamellae (using Ne)
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)
===== Lithography Applications =====
* High-resolution patterning on resist (35 keV He ions can perform better than 100 keV electrons)
* Automatic alignment to markers and automated processing (manually confirmed alignment also available)
* Resist patterning on non-conductive specimens
* Resist Pattering on curved substrates due to high depth of field
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)

== Resources ==
===== Equipment Data =====
* [https://caltech.box.com/s/xlvbr7cfwiqzcpc9hpq4jxed8mhl6c4j Microscopy Pass-down equipment information]
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* [https://caltech.box.com/s/ss38zzz4pl73ufuojwl8hp7gbo4x4cls SOP for Basic Operation of ORION NanoFab]
* [https://caltech.box.com/s/g5k3qt50jgrc0hyszjcmaxaeo9wtygx3 SOP for Operating Raith ELPHY MultiBeam Pattern Generator]

===== Process Recipes =====
These process recipes highlight a possible approach for different application. There are many different ways to operate and optimize parameters and this is generally sample dependent and need to be optimized by the operator for each sample.
* [https://caltech.box.com/s/ybdwd4zi39p62bx13rc7f8o54444vuyz Helium Ion Beam Imaging with the Electron Flood Gun – Parameter Guide]
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Guide]
* [https://caltech.box.com/s/y8k2a4xnan8x2jte2ss587gh2o2pfs4h Ne-FIB Hard Mask Lithography on ALD Films – Parameter Guide]

===== Video Tutorials =====
The resources are currently being updated. The updated tutorials will be uploaded shortly.

===== Graphical Handouts =====
* [https://caltech.box.com/s/g49bay7wrxwx0tldugeekylpvl168d1t GFIS Concepts]
* [https://caltech.box.com/s/xm9sxohjoeyn7y5m72az1b0ot9qu404r GFIS Alignments]
* [https://caltech.box.com/s/kxaxtslwol1o5a276f3lrqbhss8zvwje Ga-FIB Concepts]
===== Presentations =====
* Helium & Neon Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/ibe1nt5rd1u2kmvnfbjs2dj9lg28mch7 Pptx Slides] | [https://youtu.be/JXS3K8G2CVY YouTube Lecture]
* Gallium Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/4y5l7f7ca0pgs4hampyqp3b9e76e6u6q Zeiss ORION NanoFab Operation Manual (Caltech-only)]
* Raith ELPHY MultiBeam: [https://caltech.box.com/s/2bvojmswnmlei95lei66ddnunm85pp22 Software Operation Manual] | [https://caltech.box.com/s/tt7omr53h1u88laulm1h5mooq4tbtcgi Software Reference Manual] |[https://caltech.box.com/s/64nmggwdfef8omz4m1zd50ftog4rhshm Step-by-Step Patterning Guide]
* [https://caltech.box.com/s/9rddai829l0xz09agynh1taugj67bo8z Nanometer Patterning & Visualization Engine (NPVE) Operation Manual]

===== Simulation Software =====
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM) – simulate i-beam/specimen interactions]
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software – simulate e-beam/specimen interactions]

===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which FIB measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon (first try using the in-chamber electron flood gun to alleviate charge artifacts).
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them (the ORION's in-chamber plasma cleaner can be used in extreme cases where the sample must be cleaned directly before the experiment is conducted, without exposing it to the atmosphere while transferring it from the outside cleaner to the ORION chamber; excessive numbers of chamber cleanings can have adverse effects on the ORION over time so consult with staff on how and when to do this).

===== Order Your Own Stubs =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some old stubs at each Microscope. You can buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/gilv2k40zjmpzhr439lh7tg4b9920kaa Zeiss ORION NanoFab Product Guide & Data Sheet]
* [https://caltech.box.com/s/isy1fitgql2ywlak7472grvva1ge8c1c Raith ELPHY MultiBeam Product Guide & Data Sheet]

===== Overall System Specifications =====
* Eucentric Height: ~9.1 mm working distance (WD)
* Allowable Sample Width: 80 mm (this is the width of the load lock opening)
* Stage Range: ±24 mm X & Y travel, 8 mm Z travel, -10 to 58° tilt, 360° rotation

* ETD Grid Bias Range: -250 to 250 V
* Stage Bias Range: -500 to 500 V
* Ultimate Vacuum: 2e-7 Torr

===== He-FIB Specifications =====
* Minimum Feature Size Resolved with He Imaging: ~3 nm
* Minumum Probe Size: 0.35 nm
* Voltage Range: 5 to 40 kV
* Current Range: 0.1 to 100 pA

===== Ne-FIB Specifications =====
* Minimum Feature Size Resolved with Ne Imaging: ~7 nm
* Minumum Probe Size: 1.9 nm
* Voltage Range: 5 to 35 kV
* Current Range: 0.1 to 50 pA

===== Ga-FIB Specifications =====
* Minimum Feature Size Resolved with Ga Imaging: ~10 nm
* Minumum Probe Size: 3 nm
* Voltage Range: 1 to 30 kV
* Current Range: 1 pA to 100 nA

===== Electron Flood Gun Specifications =====
* Probe Diameter: millimeters (can be roughly focused)
* Voltage Range: 0.025 to 1.0 kV
* Current: ~1 μA
* Dwell Time Range: 50 to 10000 μs

===== Raith ELPHY MultiBeam Specifications =====
* Shapes Available: Polygons (area dose), Single Pass Lines (line dose) & Dot Arrays (point dose) of any arbitrary shape
* Import CAD files as .dxf or .gds files
* Writing Speed: 20 MHz
* Digital-to-Analog Converter (DAC): 16-bit
 
 
== Related Instrumentation in the KNI ==
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | EBPG 5200: Electron Beam Pattern Generator (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: Electron Beam Pattern Generator (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM, STEM, EDS, EELS, EFTEM & Lithography (40-200 kV)]]
===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

ORION NanoFab: Helium, Neon & Gallium FIB

2021-11-10T19:54:24Z

Awolff: /* Process Recipes */

{{InstrumentInfobox|
|InstrumentName = ORION NanoFab
|HeaderColor = #F5A81C
|ImageOne = Nanocoil-Inductor_Matthew-S-Hunt.jpg
|ImageTwo = ORION-NanoFab.JPG
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]], [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B203D Steele
|LabPhone = 626-395-1548
|PrimaryStaff = [[Lena Wolff, PhD]]
|StaffEmail = awolff@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = ZEISS (Carl Zeiss AG)
|Model = ORION NanoFab
|Techniques = High-Resolution He Imaging, He/Ne/Ga-FIB Etching, He & Ne Ion Lithography, Charge Compensation (with Electron Flood Gun), Cross-Sectioning
|RequestTraining = awolff@caltech.edu
|EmailList = kni-orion
|EmailListName = ORION
}}
== Description ==
The ORION NanoFab is a focused ion beam (FIB) system capable of generating three different ion beams – helium & neon from the gas field ion source (GFIS) that is aligned on the main optical axis, and gallium offset by 54°, as in a more traditional "dual beam" FIB/SEM (scanning electron microscope). The He beam, which can be formed into a sub-0.5 nm probe size, is capable of high-resolution imaging, lithography and etching, with each performing in the sub-5 nm regime. The Ne beam, with a 1.9 nm probe size, can etch sub-15 nm features with order-of-magnitude higher volume-removal rates than He, and perform sub-10 nm lithography on resist. The Ga beam, with a 5 nm minimum probe size, can remove relatively large volumes of material by direct etching. In all, the three beams, each operating over large energy ranges (see specifications below for details), provide multitudes of nanofabrication opportunities in a single system.

===== Imaging Applications =====
* Ultra-High-Resolution imaging (capable of resolving sub-5 nm features)
* High depth of field imaging (compared to SEM)
* Image non-conductive specimens using an electron flood gun for charge compensation
===== Etching Applications =====
* Directly etch patterns into material with all three beams – He, Ne & Ga
* Cutting & Imaging Cross-Sections (using Ga)
* Final thinning of TEM lamellae (using Ne)
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)
===== Lithography Applications =====
* High-resolution patterning on resist (35 keV He ions can perform better than 100 keV electrons)
* Automatic alignment to markers and automated processing (manually confirmed alignment also available)
* Resist patterning on non-conductive specimens
* Resist Pattering on curved substrates due to high depth of field
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)

== Resources ==
===== Equipment Data =====
* [https://caltech.box.com/s/xlvbr7cfwiqzcpc9hpq4jxed8mhl6c4j Microscopy Pass-down equipment information]
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* [https://caltech.box.com/s/ss38zzz4pl73ufuojwl8hp7gbo4x4cls SOP for Basic Operation of ORION NanoFab]
* [https://caltech.box.com/s/g5k3qt50jgrc0hyszjcmaxaeo9wtygx3 SOP for Operating Raith ELPHY MultiBeam Pattern Generator]

===== Process Recipes =====
These process recipes highlight a possible approach for different application. There are many different ways to operate and optimize parameters and this is generally sample dependent and need to be optimized by the operator for each sample.
* [https://caltech.box.com/s/ybdwd4zi39p62bx13rc7f8o54444vuyz Helium Ion Beam Imaging with the Electron Flood Gun – Parameter Guide]
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Guide]
* [https://caltech.box.com/s/y8k2a4xnan8x2jte2ss587gh2o2pfs4h Ne-FIB Hard Mask Lithography on ALD Films – Parameter Guide]

===== Video Tutorials =====
The resources are currently being updated. The updated tutorials will be uploaded shortly.

===== Graphical Handouts =====
* [https://caltech.box.com/s/g49bay7wrxwx0tldugeekylpvl168d1t GFIS Concepts]
* [https://caltech.box.com/s/xm9sxohjoeyn7y5m72az1b0ot9qu404r GFIS Alignments]
* [https://caltech.box.com/s/kxaxtslwol1o5a276f3lrqbhss8zvwje Ga-FIB Concepts]
===== Presentations =====
* Helium & Neon Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/ibe1nt5rd1u2kmvnfbjs2dj9lg28mch7 Pptx Slides] | [https://youtu.be/JXS3K8G2CVY YouTube Lecture]
* Gallium Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/2f5semkplrho29lgugdjigroh0jip97h Zeiss ORION NanoFab Operation Manual (Caltech-only)]
* Raith ELPHY MultiBeam: [https://caltech.box.com/s/2bvojmswnmlei95lei66ddnunm85pp22 Software Operation Manual] | [https://caltech.box.com/s/tt7omr53h1u88laulm1h5mooq4tbtcgi Software Reference Manual] |[https://caltech.box.com/s/64nmggwdfef8omz4m1zd50ftog4rhshm Step-by-Step Patterning Guide]
* [https://caltech.box.com/s/BROKEN Nanometer Patterning & Visualization Engine (NPVE) Operation Manual]

===== Simulation Software =====
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM) – simulate i-beam/specimen interactions]
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software – simulate e-beam/specimen interactions]

===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which FIB measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon (first try using the in-chamber electron flood gun to alleviate charge artifacts).
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them (the ORION's in-chamber plasma cleaner can be used in extreme cases where the sample must be cleaned directly before the experiment is conducted, without exposing it to the atmosphere while transferring it from the outside cleaner to the ORION chamber; excessive numbers of chamber cleanings can have adverse effects on the ORION over time so consult with staff on how and when to do this).

===== Order Your Own Stubs =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some old stubs at each Microscope. You can buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/gilv2k40zjmpzhr439lh7tg4b9920kaa Zeiss ORION NanoFab Product Guide & Data Sheet]
* [https://caltech.box.com/s/isy1fitgql2ywlak7472grvva1ge8c1c Raith ELPHY MultiBeam Product Guide & Data Sheet]

===== Overall System Specifications =====
* Eucentric Height: ~9.1 mm working distance (WD)
* Allowable Sample Width: 80 mm (this is the width of the load lock opening)
* Stage Range: ±24 mm X & Y travel, 8 mm Z travel, -10 to 58° tilt, 360° rotation

* ETD Grid Bias Range: -250 to 250 V
* Stage Bias Range: -500 to 500 V
* Ultimate Vacuum: 2e-7 Torr

===== He-FIB Specifications =====
* Minimum Feature Size Resolved with He Imaging: ~3 nm
* Minumum Probe Size: 0.35 nm
* Voltage Range: 5 to 40 kV
* Current Range: 0.1 to 100 pA

===== Ne-FIB Specifications =====
* Minimum Feature Size Resolved with Ne Imaging: ~7 nm
* Minumum Probe Size: 1.9 nm
* Voltage Range: 5 to 35 kV
* Current Range: 0.1 to 50 pA

===== Ga-FIB Specifications =====
* Minimum Feature Size Resolved with Ga Imaging: ~10 nm
* Minumum Probe Size: 3 nm
* Voltage Range: 1 to 30 kV
* Current Range: 1 pA to 100 nA

===== Electron Flood Gun Specifications =====
* Probe Diameter: millimeters (can be roughly focused)
* Voltage Range: 0.025 to 1.0 kV
* Current: ~1 μA
* Dwell Time Range: 50 to 10000 μs

===== Raith ELPHY MultiBeam Specifications =====
* Shapes Available: Polygons (area dose), Single Pass Lines (line dose) & Dot Arrays (point dose) of any arbitrary shape
* Import CAD files as .dxf or .gds files
* Writing Speed: 20 MHz
* Digital-to-Analog Converter (DAC): 16-bit
 
 
== Related Instrumentation in the KNI ==
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | EBPG 5200: Electron Beam Pattern Generator (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: Electron Beam Pattern Generator (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM, STEM, EDS, EELS, EFTEM & Lithography (40-200 kV)]]
===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

ORION NanoFab: Helium, Neon & Gallium FIB

2021-11-10T19:48:01Z

Awolff: /* Order Your Own Stubs */

{{InstrumentInfobox|
|InstrumentName = ORION NanoFab
|HeaderColor = #F5A81C
|ImageOne = Nanocoil-Inductor_Matthew-S-Hunt.jpg
|ImageTwo = ORION-NanoFab.JPG
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]], [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B203D Steele
|LabPhone = 626-395-1548
|PrimaryStaff = [[Lena Wolff, PhD]]
|StaffEmail = awolff@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = ZEISS (Carl Zeiss AG)
|Model = ORION NanoFab
|Techniques = High-Resolution He Imaging, He/Ne/Ga-FIB Etching, He & Ne Ion Lithography, Charge Compensation (with Electron Flood Gun), Cross-Sectioning
|RequestTraining = awolff@caltech.edu
|EmailList = kni-orion
|EmailListName = ORION
}}
== Description ==
The ORION NanoFab is a focused ion beam (FIB) system capable of generating three different ion beams – helium & neon from the gas field ion source (GFIS) that is aligned on the main optical axis, and gallium offset by 54°, as in a more traditional "dual beam" FIB/SEM (scanning electron microscope). The He beam, which can be formed into a sub-0.5 nm probe size, is capable of high-resolution imaging, lithography and etching, with each performing in the sub-5 nm regime. The Ne beam, with a 1.9 nm probe size, can etch sub-15 nm features with order-of-magnitude higher volume-removal rates than He, and perform sub-10 nm lithography on resist. The Ga beam, with a 5 nm minimum probe size, can remove relatively large volumes of material by direct etching. In all, the three beams, each operating over large energy ranges (see specifications below for details), provide multitudes of nanofabrication opportunities in a single system.

===== Imaging Applications =====
* Ultra-High-Resolution imaging (capable of resolving sub-5 nm features)
* High depth of field imaging (compared to SEM)
* Image non-conductive specimens using an electron flood gun for charge compensation
===== Etching Applications =====
* Directly etch patterns into material with all three beams – He, Ne & Ga
* Cutting & Imaging Cross-Sections (using Ga)
* Final thinning of TEM lamellae (using Ne)
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)
===== Lithography Applications =====
* High-resolution patterning on resist (35 keV He ions can perform better than 100 keV electrons)
* Automatic alignment to markers and automated processing (manually confirmed alignment also available)
* Resist patterning on non-conductive specimens
* Resist Pattering on curved substrates due to high depth of field
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)

== Resources ==
===== Equipment Data =====
* [https://caltech.box.com/s/xlvbr7cfwiqzcpc9hpq4jxed8mhl6c4j Microscopy Pass-down equipment information]
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* [https://caltech.box.com/s/ss38zzz4pl73ufuojwl8hp7gbo4x4cls SOP for Basic Operation of ORION NanoFab]
* [https://caltech.box.com/s/g5k3qt50jgrc0hyszjcmaxaeo9wtygx3 SOP for Operating Raith ELPHY MultiBeam Pattern Generator]

===== Process Recipes =====
* [https://caltech.box.com/s/ybdwd4zi39p62bx13rc7f8o54444vuyz Helium Ion Beam Imaging with the Electron Flood Gun – Parameter Guide]
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Guide]
* [https://caltech.box.com/s/y8k2a4xnan8x2jte2ss587gh2o2pfs4h Ne-FIB Hard Mask Lithography on ALD Films – Parameter Guide]

===== Video Tutorials =====
The resources are currently being updated. The updated tutorials will be uploaded shortly.

===== Graphical Handouts =====
* [https://caltech.box.com/s/g49bay7wrxwx0tldugeekylpvl168d1t GFIS Concepts]
* [https://caltech.box.com/s/xm9sxohjoeyn7y5m72az1b0ot9qu404r GFIS Alignments]
* [https://caltech.box.com/s/kxaxtslwol1o5a276f3lrqbhss8zvwje Ga-FIB Concepts]
===== Presentations =====
* Helium & Neon Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/ibe1nt5rd1u2kmvnfbjs2dj9lg28mch7 Pptx Slides] | [https://youtu.be/JXS3K8G2CVY YouTube Lecture]
* Gallium Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/2f5semkplrho29lgugdjigroh0jip97h Zeiss ORION NanoFab Operation Manual (Caltech-only)]
* Raith ELPHY MultiBeam: [https://caltech.box.com/s/2bvojmswnmlei95lei66ddnunm85pp22 Software Operation Manual] | [https://caltech.box.com/s/tt7omr53h1u88laulm1h5mooq4tbtcgi Software Reference Manual] |[https://caltech.box.com/s/64nmggwdfef8omz4m1zd50ftog4rhshm Step-by-Step Patterning Guide]
* [https://caltech.box.com/s/BROKEN Nanometer Patterning & Visualization Engine (NPVE) Operation Manual]

===== Simulation Software =====
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM) – simulate i-beam/specimen interactions]
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software – simulate e-beam/specimen interactions]

===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which FIB measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon (first try using the in-chamber electron flood gun to alleviate charge artifacts).
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them (the ORION's in-chamber plasma cleaner can be used in extreme cases where the sample must be cleaned directly before the experiment is conducted, without exposing it to the atmosphere while transferring it from the outside cleaner to the ORION chamber; excessive numbers of chamber cleanings can have adverse effects on the ORION over time so consult with staff on how and when to do this).

===== Order Your Own Stubs =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some old stubs at each Microscope. You can buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips]

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/gilv2k40zjmpzhr439lh7tg4b9920kaa Zeiss ORION NanoFab Product Guide & Data Sheet]
* [https://caltech.box.com/s/isy1fitgql2ywlak7472grvva1ge8c1c Raith ELPHY MultiBeam Product Guide & Data Sheet]

===== Overall System Specifications =====
* Eucentric Height: ~9.1 mm working distance (WD)
* Allowable Sample Width: 80 mm (this is the width of the load lock opening)
* Stage Range: ±24 mm X & Y travel, 8 mm Z travel, -10 to 58° tilt, 360° rotation

* ETD Grid Bias Range: -250 to 250 V
* Stage Bias Range: -500 to 500 V
* Ultimate Vacuum: 2e-7 Torr

===== He-FIB Specifications =====
* Minimum Feature Size Resolved with He Imaging: ~3 nm
* Minumum Probe Size: 0.35 nm
* Voltage Range: 5 to 40 kV
* Current Range: 0.1 to 100 pA

===== Ne-FIB Specifications =====
* Minimum Feature Size Resolved with Ne Imaging: ~7 nm
* Minumum Probe Size: 1.9 nm
* Voltage Range: 5 to 35 kV
* Current Range: 0.1 to 50 pA

===== Ga-FIB Specifications =====
* Minimum Feature Size Resolved with Ga Imaging: ~10 nm
* Minumum Probe Size: 3 nm
* Voltage Range: 1 to 30 kV
* Current Range: 1 pA to 100 nA

===== Electron Flood Gun Specifications =====
* Probe Diameter: millimeters (can be roughly focused)
* Voltage Range: 0.025 to 1.0 kV
* Current: ~1 μA
* Dwell Time Range: 50 to 10000 μs

===== Raith ELPHY MultiBeam Specifications =====
* Shapes Available: Polygons (area dose), Single Pass Lines (line dose) & Dot Arrays (point dose) of any arbitrary shape
* Import CAD files as .dxf or .gds files
* Writing Speed: 20 MHz
* Digital-to-Analog Converter (DAC): 16-bit
 
 
== Related Instrumentation in the KNI ==
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | EBPG 5200: Electron Beam Pattern Generator (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: Electron Beam Pattern Generator (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM, STEM, EDS, EELS, EFTEM & Lithography (40-200 kV)]]
===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

ORION NanoFab: Helium, Neon & Gallium FIB

2021-11-10T19:40:50Z

Awolff: /* SOPs & Troubleshooting */

{{InstrumentInfobox|
|InstrumentName = ORION NanoFab
|HeaderColor = #F5A81C
|ImageOne = Nanocoil-Inductor_Matthew-S-Hunt.jpg
|ImageTwo = ORION-NanoFab.JPG
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]], [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B203D Steele
|LabPhone = 626-395-1548
|PrimaryStaff = [[Lena Wolff, PhD]]
|StaffEmail = awolff@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = ZEISS (Carl Zeiss AG)
|Model = ORION NanoFab
|Techniques = High-Resolution He Imaging, He/Ne/Ga-FIB Etching, He & Ne Ion Lithography, Charge Compensation (with Electron Flood Gun), Cross-Sectioning
|RequestTraining = awolff@caltech.edu
|EmailList = kni-orion
|EmailListName = ORION
}}
== Description ==
The ORION NanoFab is a focused ion beam (FIB) system capable of generating three different ion beams – helium & neon from the gas field ion source (GFIS) that is aligned on the main optical axis, and gallium offset by 54°, as in a more traditional "dual beam" FIB/SEM (scanning electron microscope). The He beam, which can be formed into a sub-0.5 nm probe size, is capable of high-resolution imaging, lithography and etching, with each performing in the sub-5 nm regime. The Ne beam, with a 1.9 nm probe size, can etch sub-15 nm features with order-of-magnitude higher volume-removal rates than He, and perform sub-10 nm lithography on resist. The Ga beam, with a 5 nm minimum probe size, can remove relatively large volumes of material by direct etching. In all, the three beams, each operating over large energy ranges (see specifications below for details), provide multitudes of nanofabrication opportunities in a single system.

===== Imaging Applications =====
* Ultra-High-Resolution imaging (capable of resolving sub-5 nm features)
* High depth of field imaging (compared to SEM)
* Image non-conductive specimens using an electron flood gun for charge compensation
===== Etching Applications =====
* Directly etch patterns into material with all three beams – He, Ne & Ga
* Cutting & Imaging Cross-Sections (using Ga)
* Final thinning of TEM lamellae (using Ne)
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)
===== Lithography Applications =====
* High-resolution patterning on resist (35 keV He ions can perform better than 100 keV electrons)
* Automatic alignment to markers and automated processing (manually confirmed alignment also available)
* Resist patterning on non-conductive specimens
* Resist Pattering on curved substrates due to high depth of field
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)

== Resources ==
===== Equipment Data =====
* [https://caltech.box.com/s/xlvbr7cfwiqzcpc9hpq4jxed8mhl6c4j Microscopy Pass-down equipment information]
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* [https://caltech.box.com/s/ss38zzz4pl73ufuojwl8hp7gbo4x4cls SOP for Basic Operation of ORION NanoFab]
* [https://caltech.box.com/s/g5k3qt50jgrc0hyszjcmaxaeo9wtygx3 SOP for Operating Raith ELPHY MultiBeam Pattern Generator]

===== Process Recipes =====
* [https://caltech.box.com/s/ybdwd4zi39p62bx13rc7f8o54444vuyz Helium Ion Beam Imaging with the Electron Flood Gun – Parameter Guide]
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Guide]
* [https://caltech.box.com/s/y8k2a4xnan8x2jte2ss587gh2o2pfs4h Ne-FIB Hard Mask Lithography on ALD Films – Parameter Guide]

===== Video Tutorials =====
The resources are currently being updated. The updated tutorials will be uploaded shortly.

===== Graphical Handouts =====
* [https://caltech.box.com/s/g49bay7wrxwx0tldugeekylpvl168d1t GFIS Concepts]
* [https://caltech.box.com/s/xm9sxohjoeyn7y5m72az1b0ot9qu404r GFIS Alignments]
* [https://caltech.box.com/s/kxaxtslwol1o5a276f3lrqbhss8zvwje Ga-FIB Concepts]
===== Presentations =====
* Helium & Neon Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/ibe1nt5rd1u2kmvnfbjs2dj9lg28mch7 Pptx Slides] | [https://youtu.be/JXS3K8G2CVY YouTube Lecture]
* Gallium Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/2f5semkplrho29lgugdjigroh0jip97h Zeiss ORION NanoFab Operation Manual (Caltech-only)]
* Raith ELPHY MultiBeam: [https://caltech.box.com/s/2bvojmswnmlei95lei66ddnunm85pp22 Software Operation Manual] | [https://caltech.box.com/s/tt7omr53h1u88laulm1h5mooq4tbtcgi Software Reference Manual] |[https://caltech.box.com/s/64nmggwdfef8omz4m1zd50ftog4rhshm Step-by-Step Patterning Guide]
* [https://caltech.box.com/s/BROKEN Nanometer Patterning & Visualization Engine (NPVE) Operation Manual]

===== Simulation Software =====
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM) – simulate i-beam/specimen interactions]
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software – simulate e-beam/specimen interactions]

===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which FIB measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon (first try using the in-chamber electron flood gun to alleviate charge artifacts).
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them (the ORION's in-chamber plasma cleaner can be used in extreme cases where the sample must be cleaned directly before the experiment is conducted, without exposing it to the atmosphere while transferring it from the outside cleaner to the ORION chamber; excessive numbers of chamber cleanings can have adverse effects on the ORION over time so consult with staff on how and when to do this).

===== Order Your Own Stubs =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some old stubs at each SEM & FIB, yet you should buy your own so that you can keep them clean and available to you. There are many stub geometries and configurations, some of which will be right for you to purchase and keep with your other cleanroom items.
** [https://www.tedpella.com/SEM_html/SEMclip.htm.aspx Buy stubs with copper clips] (recommended for most devices, esp with non-conductive substrates);
** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips] (ok for devices with conductive substrates)

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/gilv2k40zjmpzhr439lh7tg4b9920kaa Zeiss ORION NanoFab Product Guide & Data Sheet]
* [https://caltech.box.com/s/isy1fitgql2ywlak7472grvva1ge8c1c Raith ELPHY MultiBeam Product Guide & Data Sheet]

===== Overall System Specifications =====
* Eucentric Height: ~9.1 mm working distance (WD)
* Allowable Sample Width: 80 mm (this is the width of the load lock opening)
* Stage Range: ±24 mm X & Y travel, 8 mm Z travel, -10 to 58° tilt, 360° rotation

* ETD Grid Bias Range: -250 to 250 V
* Stage Bias Range: -500 to 500 V
* Ultimate Vacuum: 2e-7 Torr

===== He-FIB Specifications =====
* Minimum Feature Size Resolved with He Imaging: ~3 nm
* Minumum Probe Size: 0.35 nm
* Voltage Range: 5 to 40 kV
* Current Range: 0.1 to 100 pA

===== Ne-FIB Specifications =====
* Minimum Feature Size Resolved with Ne Imaging: ~7 nm
* Minumum Probe Size: 1.9 nm
* Voltage Range: 5 to 35 kV
* Current Range: 0.1 to 50 pA

===== Ga-FIB Specifications =====
* Minimum Feature Size Resolved with Ga Imaging: ~10 nm
* Minumum Probe Size: 3 nm
* Voltage Range: 1 to 30 kV
* Current Range: 1 pA to 100 nA

===== Electron Flood Gun Specifications =====
* Probe Diameter: millimeters (can be roughly focused)
* Voltage Range: 0.025 to 1.0 kV
* Current: ~1 μA
* Dwell Time Range: 50 to 10000 μs

===== Raith ELPHY MultiBeam Specifications =====
* Shapes Available: Polygons (area dose), Single Pass Lines (line dose) & Dot Arrays (point dose) of any arbitrary shape
* Import CAD files as .dxf or .gds files
* Writing Speed: 20 MHz
* Digital-to-Analog Converter (DAC): 16-bit
 
 
== Related Instrumentation in the KNI ==
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | EBPG 5200: Electron Beam Pattern Generator (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: Electron Beam Pattern Generator (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM, STEM, EDS, EELS, EFTEM & Lithography (40-200 kV)]]
===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

ORION NanoFab: Helium, Neon & Gallium FIB

2021-11-10T19:39:27Z

Awolff: /* Video Tutorials */

{{InstrumentInfobox|
|InstrumentName = ORION NanoFab
|HeaderColor = #F5A81C
|ImageOne = Nanocoil-Inductor_Matthew-S-Hunt.jpg
|ImageTwo = ORION-NanoFab.JPG
|InstrumentType = [[Equipment_List#Microscopy|Microscopy]], [[Equipment_List#Lithography|Lithography]]
|RoomLocation = B203D Steele
|LabPhone = 626-395-1548
|PrimaryStaff = [[Lena Wolff, PhD]]
|StaffEmail = awolff@caltech.edu
|StaffPhone = 626-395-5994
|Manufacturer = ZEISS (Carl Zeiss AG)
|Model = ORION NanoFab
|Techniques = High-Resolution He Imaging, He/Ne/Ga-FIB Etching, He & Ne Ion Lithography, Charge Compensation (with Electron Flood Gun), Cross-Sectioning
|RequestTraining = awolff@caltech.edu
|EmailList = kni-orion
|EmailListName = ORION
}}
== Description ==
The ORION NanoFab is a focused ion beam (FIB) system capable of generating three different ion beams – helium & neon from the gas field ion source (GFIS) that is aligned on the main optical axis, and gallium offset by 54°, as in a more traditional "dual beam" FIB/SEM (scanning electron microscope). The He beam, which can be formed into a sub-0.5 nm probe size, is capable of high-resolution imaging, lithography and etching, with each performing in the sub-5 nm regime. The Ne beam, with a 1.9 nm probe size, can etch sub-15 nm features with order-of-magnitude higher volume-removal rates than He, and perform sub-10 nm lithography on resist. The Ga beam, with a 5 nm minimum probe size, can remove relatively large volumes of material by direct etching. In all, the three beams, each operating over large energy ranges (see specifications below for details), provide multitudes of nanofabrication opportunities in a single system.

===== Imaging Applications =====
* Ultra-High-Resolution imaging (capable of resolving sub-5 nm features)
* High depth of field imaging (compared to SEM)
* Image non-conductive specimens using an electron flood gun for charge compensation
===== Etching Applications =====
* Directly etch patterns into material with all three beams – He, Ne & Ga
* Cutting & Imaging Cross-Sections (using Ga)
* Final thinning of TEM lamellae (using Ne)
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)
===== Lithography Applications =====
* High-resolution patterning on resist (35 keV He ions can perform better than 100 keV electrons)
* Automatic alignment to markers and automated processing (manually confirmed alignment also available)
* Resist patterning on non-conductive specimens
* Resist Pattering on curved substrates due to high depth of field
* Pattern with Raith ELPHY MultiBeam Pattern Generator or Nanometer Patterning & Visualization Engine (NPVE)

== Resources ==
===== Equipment Data =====
* [https://caltech.box.com/s/xlvbr7cfwiqzcpc9hpq4jxed8mhl6c4j Microscopy Pass-down equipment information]
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
* [https://caltech.box.com/s/ls0irl1ocme9pmqili2vxurgqo7050d9 SOP for Basic Operation of ORION NanoFab]
* [https://caltech.box.com/s/g5k3qt50jgrc0hyszjcmaxaeo9wtygx3 SOP for Operating Raith ELPHY MultiBeam Pattern Generator]
* [https://caltech.box.com/s/qobquoi3hs0izeyhdg5d8px9wmmdzuxw Source Rebuild & Trimer Formation Guide]
* [https://caltech.box.com/s/s0zbkyct23o0fxmzpzhrymaz1g82s68d Troubleshooting Guide]

===== Process Recipes =====
* [https://caltech.box.com/s/ybdwd4zi39p62bx13rc7f8o54444vuyz Helium Ion Beam Imaging with the Electron Flood Gun – Parameter Guide]
* [https://caltech.box.com/s/3s0k77mgx26ytfnafttpoalcknmk7npu Helium Ion Beam Lithography (HIBL) – Parameter Guide]
* [https://caltech.box.com/s/y8k2a4xnan8x2jte2ss587gh2o2pfs4h Ne-FIB Hard Mask Lithography on ALD Films – Parameter Guide]

===== Video Tutorials =====
The resources are currently being updated. The updated tutorials will be uploaded shortly.

===== Graphical Handouts =====
* [https://caltech.box.com/s/g49bay7wrxwx0tldugeekylpvl168d1t GFIS Concepts]
* [https://caltech.box.com/s/xm9sxohjoeyn7y5m72az1b0ot9qu404r GFIS Alignments]
* [https://caltech.box.com/s/kxaxtslwol1o5a276f3lrqbhss8zvwje Ga-FIB Concepts]
===== Presentations =====
* Helium & Neon Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/ibe1nt5rd1u2kmvnfbjs2dj9lg28mch7 Pptx Slides] | [https://youtu.be/JXS3K8G2CVY YouTube Lecture]
* Gallium Focused Ion Beam Microscopy: Principles, Techniques & Applications
** [https://caltech.box.com/s/f4k8jan85n5lf6f2tutjx4rkfzjq7y68 PPtx Slides] | [https://youtu.be/3eSzisbNcGo YouTube Lecture]

===== Manufacturer Manuals =====
* [https://caltech.box.com/s/2f5semkplrho29lgugdjigroh0jip97h Zeiss ORION NanoFab Operation Manual (Caltech-only)]
* Raith ELPHY MultiBeam: [https://caltech.box.com/s/2bvojmswnmlei95lei66ddnunm85pp22 Software Operation Manual] | [https://caltech.box.com/s/tt7omr53h1u88laulm1h5mooq4tbtcgi Software Reference Manual] |[https://caltech.box.com/s/64nmggwdfef8omz4m1zd50ftog4rhshm Step-by-Step Patterning Guide]
* [https://caltech.box.com/s/BROKEN Nanometer Patterning & Visualization Engine (NPVE) Operation Manual]

===== Simulation Software =====
* [http://www.srim.org/ The Stopping & Range of Ions in Matter (SRIM) – simulate i-beam/specimen interactions]
* [http://www.gel.usherbrooke.ca/casino/What.html CASINO Electron Beam Simulation Software – simulate e-beam/specimen interactions]

===== Calibrate Measurements with NIST Standard =====
* The KNI has a NIST-traceable standard against which FIB measurements can be compared. See Slides 54-55 of the [https://caltech.box.com/s/lulkj0pwm053akyya1shazg8wzgudq9f SEM Presentation] for details. Ask staff for help finding and using the standard in the lab.
===== Sample Preparation =====
* Use the [[Carbon Evaporator]] to make non-conductive samples conductive by applying 2-10 nm of evaporated carbon (first try using the in-chamber electron flood gun to alleviate charge artifacts).
* Use the [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner |
O2/Ar Plasma Cleaner]] to remove hydrocarbons from the sample surface to avoid creating dark contamination spots on your features while imaging them (the ORION's in-chamber plasma cleaner can be used in extreme cases where the sample must be cleaned directly before the experiment is conducted, without exposing it to the atmosphere while transferring it from the outside cleaner to the ORION chamber; excessive numbers of chamber cleanings can have adverse effects on the ORION over time so consult with staff on how and when to do this).

===== Order Your Own Stubs =====
* Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some old stubs at each SEM & FIB, yet you should buy your own so that you can keep them clean and available to you. There are many stub geometries and configurations, some of which will be right for you to purchase and keep with your other cleanroom items.
** [https://www.tedpella.com/SEM_html/SEMclip.htm.aspx Buy stubs with copper clips] (recommended for most devices, esp with non-conductive substrates);
** [https://www.tedpella.com/sem_html/SEMpinmount.htm Buy stubs without copper clips] (ok for devices with conductive substrates)

===== Guide to Choosing KNI SEMs & FIBs =====
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]

== Specifications ==
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/gilv2k40zjmpzhr439lh7tg4b9920kaa Zeiss ORION NanoFab Product Guide & Data Sheet]
* [https://caltech.box.com/s/isy1fitgql2ywlak7472grvva1ge8c1c Raith ELPHY MultiBeam Product Guide & Data Sheet]

===== Overall System Specifications =====
* Eucentric Height: ~9.1 mm working distance (WD)
* Allowable Sample Width: 80 mm (this is the width of the load lock opening)
* Stage Range: ±24 mm X & Y travel, 8 mm Z travel, -10 to 58° tilt, 360° rotation

* ETD Grid Bias Range: -250 to 250 V
* Stage Bias Range: -500 to 500 V
* Ultimate Vacuum: 2e-7 Torr

===== He-FIB Specifications =====
* Minimum Feature Size Resolved with He Imaging: ~3 nm
* Minumum Probe Size: 0.35 nm
* Voltage Range: 5 to 40 kV
* Current Range: 0.1 to 100 pA

===== Ne-FIB Specifications =====
* Minimum Feature Size Resolved with Ne Imaging: ~7 nm
* Minumum Probe Size: 1.9 nm
* Voltage Range: 5 to 35 kV
* Current Range: 0.1 to 50 pA

===== Ga-FIB Specifications =====
* Minimum Feature Size Resolved with Ga Imaging: ~10 nm
* Minumum Probe Size: 3 nm
* Voltage Range: 1 to 30 kV
* Current Range: 1 pA to 100 nA

===== Electron Flood Gun Specifications =====
* Probe Diameter: millimeters (can be roughly focused)
* Voltage Range: 0.025 to 1.0 kV
* Current: ~1 μA
* Dwell Time Range: 50 to 10000 μs

===== Raith ELPHY MultiBeam Specifications =====
* Shapes Available: Polygons (area dose), Single Pass Lines (line dose) & Dot Arrays (point dose) of any arbitrary shape
* Import CAD files as .dxf or .gds files
* Writing Speed: 20 MHz
* Digital-to-Analog Converter (DAC): 16-bit
 
 
== Related Instrumentation in the KNI ==
===== Focused Ion Beam (FIB) Systems =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]]
* [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab: SEM, EDS & WDS]]
* [[Sirion: SEM & EDS | Sirion: SEM & EDS]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
===== Sample Preparation for Microscopy =====
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
===== Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography | EBPG 5200: Electron Beam Pattern Generator (100 kV)]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: Electron Beam Pattern Generator (100 kV)]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM, ESEM, Lithography & Probe Station]]
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium, Neon & Gallium FIB]]
===== Transmission Electron Microscopes =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM, STEM, EDS, EELS, EFTEM & Lithography (40-200 kV)]]
===== Scanning Probe Microscopes =====
* [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon: Atomic Force Microscope (AFM)]]
* [[Dektak 3ST: Profilometer | Dektak 3ST: Profilometer]]

Email Lists

2021-11-04T18:28:17Z

Awolff:

{| class="wikitable" style="width: 85%;"
|''For any instrument that you use, it is required that you belong to that instrument's email list so that you can receive updates from staff and other users about its status and any new developments related to it. See the email lists below and sign up for the appropriate ones via the subscription links.''
|}

{| class="wikitable" style="width: 85%;"
|-
!scope="col" style="text-align:left;"| Name
!scope="col" style="text-align:left;"| mailto: Address
!scope="col" style="text-align:left;"| Instrument(s)
!scope="col" style="text-align:left;"| Subscription Link
|-
{{EmailListTableItem
|EmailListName = afm
|InstrumentName = [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon AFM]]
}}
{{EmailListTableItem
|EmailListName = ald
|InstrumentName = [[FlexAL II: Atomic Layer Deposition (ALD) | Flex-AL ALD]]
}}
{{EmailListTableItem
|EmailListName = cha
|InstrumentName = [[CHA: Electron Beam Evaporator | CHA Electron Beam Evaporator]]
}}
{{EmailListTableItem
|EmailListName = chemistry
|InstrumentName = [[Wet Chemistry | Wet Chemistry Equipment and Processes]]
}}
{{EmailListTableItem
|EmailListName = cpd
|InstrumentName = [[Critical Point Dryer | Critical Point Dryer - Tousimis 915B]]
}}
{{EmailListTableItem
|EmailListName = dwl66
|InstrumentName = [[DWL-66: Direct-Write Laser System | Direct-Write Laser System - Heidelberg Instruments DWL-66]]
}}
{{EmailListTableItem
|EmailListName = ebpg
|InstrumentName = [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+ E-Beam Lithography]][[EBPG 5200: 100 kV Electron Beam Lithography | EBPG 5200 E-Beam Lithography]]
}}
{{EmailListTableItem
|EmailListName = labline
|InstrumentName = [[Labline: Electron Beam Evaporator | Labline Electron Beam Evaporator]]
}}
{{EmailListTableItem
|EmailListName = metrology
|InstrumentName = [[Spectroscopic Ellipsometer | Ellipsometer - Woolam M-2000]][[Light_Microscope_with_Spectroscopic_Reflectometer | Filmetrics - Model F40]][[Electrical_Probing_Station | Electrical Probe Station - Cascade Microtech M150]][[Dektak_3ST:_Profilometer | Profilometer - Veeco Dektak 3ST]]
}}
{{EmailListTableItem
|EmailListName = nanoscribe
|InstrumentName = [[Nanoscribe PPGT: Microscale 3D Printer | Microscale 3D Printer - Nanoscribe PPGT]]
}}
{{EmailListTableItem
|EmailListName = orion
|InstrumentName = [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga FIB - Zeiss Orion NanoFab]]
}}
{{EmailListTableItem
|EmailListName = oxfordicp
|InstrumentName = [[ICP-RIE: III-V, Metal & Silicon Etcher | III-V Etcher]][[DRIE: Bosch & Cryo ICP-RIE for Silicon | DRIE Etcher]][[ICP-RIE: Dielectric Etcher | Dielectric Etcher]]
}}
{{EmailListTableItem
|EmailListName = oxfordpecvd
|InstrumentName = [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | PECVD]]
}}
{{EmailListTableItem
|EmailListName = parylene
|InstrumentName = [[Parylene Coater]]
}}
{{EmailListTableItem
|EmailListName = photolith
|InstrumentName = [[Contact_Mask_Aligners:_MA6_%26_MA6/BA6 | Contact Mask Aligners - Suss MicroTec]]Resist Spinners in Solvent HoodHot Plates in Solvent HoodBase/Caustic Develop BenchConvection OvenVacuum OvenOptical Microscope w/ cameraOptical Litho ProcessingNanoimprint - NIL Technology
}}
{{EmailListTableItem
|EmailListName = plasmatherm
|InstrumentName = [[Dual Chamber RIE: Silicon, III-V Material & Organics Etcher | Dual Chamber RIE]]
}}
{{EmailListTableItem
|EmailListName = rta
|InstrumentName = [[Rapid Thermal Processor]]
}}
{{EmailListTableItem
|EmailListName = sb6l
|InstrumentName = [[Wafer Bonder | Wafer Bonder - Suss MicroTec SBL6]]
}}
{{EmailListTableItem
|EmailListName = scriber
|InstrumentName = [[Scriber-Breaker | Scriber-Breaker - Dynatex GST-150]]
}}
{{EmailListTableItem
|EmailListName = sem-fib
|InstrumentName = [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600 NanoLab SEM/Ga-FIB/Omniprobe]][[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab SEM/EDS/WDS]][[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F SEM/ESEM/Probe Station]][[Sirion: SEM & EDS | Sirion SEM/EDS]][[Carbon Evaporator]] [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | O2/Ar Plasma Cleaner]]
}}
{{EmailListTableItem
|EmailListName = sputter
|InstrumentName = [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System]][[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System]]
}}
{{EmailListTableItem
|EmailListName = stepper
|InstrumentName = [[Wafer Stepper | Wafer Stepper - GCA 6300]]
}}
{{EmailListTableItem
|EmailListName = tf20
|InstrumentName = [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20 TEM/STEM]]
}}
{{EmailListTableItem
|EmailListName = tf30
|InstrumentName = [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF |Tecnai TF-30 TEM/STEM]]
}}
{{EmailListTableItem
|EmailListName = tystar
|InstrumentName = [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces 1 & 2]]
}}
{{EmailListTableItem
|EmailListName = wirebonder
|InstrumentName = [[Wedge-Wedge_Wire_Bonder | Wire Bonder - WestBond Model: 7476D-79]]
}}
{{EmailListTableItem
|EmailListName = xef2
|InstrumentName = [[XeF2 Etcher for Silicon | XeF2 Etcher for Si]]
}}
|}

Email Lists

2021-11-04T18:27:12Z

Awolff:

{| class="wikitable" style="width: 85%;"
|''For any instrument that you use, it is required that you belong to that instrument's email list so that you can receive updates from staff and other users about its status and any new developments related to it. See the email lists below and sign up for the appropriate ones via the subscription links.''
|}

{| class="wikitable" style="width: 85%;"
|-
!scope="col" style="text-align:left;"| Name
!scope="col" style="text-align:left;"| mailto: Address
!scope="col" style="text-align:left;"| Instrument(s)
!scope="col" style="text-align:left;"| Subscription Link
|-
{{EmailListTableItem
|EmailListName = afm
|InstrumentName = [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon AFM]]
}}
{{EmailListTableItem
|EmailListName = ald
|InstrumentName = [[FlexAL II: Atomic Layer Deposition (ALD) | Flex-AL ALD]]
}}
{{EmailListTableItem
|EmailListName = cha
|InstrumentName = [[CHA: Electron Beam Evaporator | CHA Electron Beam Evaporator]]
}}
{{EmailListTableItem
|EmailListName = chemistry
|InstrumentName = [[Wet Chemistry | Wet Chemistry Equipment and Processes]]
}}
{{EmailListTableItem
|EmailListName = cpd
|InstrumentName = [[Critical Point Dryer | Critical Point Dryer - Tousimis 915B]]
}}
{{EmailListTableItem
|EmailListName = dwl66
|InstrumentName = [[DWL-66: Direct-Write Laser System | Direct-Write Laser System - Heidelberg Instruments DWL-66]]
}}
{{EmailListTableItem
|EmailListName = ebpg
|InstrumentName = [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+ E-Beam Lithography]][[EBPG 5200: 100 kV Electron Beam Lithography | EBPG 5200 E-Beam Lithography]]
}}
{{EmailListTableItem
|EmailListName = labline
|InstrumentName = [[Labline: Electron Beam Evaporator | Labline Electron Beam Evaporator]]
}}
{{EmailListTableItem
|EmailListName = metrology
|InstrumentName = [[Spectroscopic Ellipsometer | Ellipsometer - Woolam M-2000]][[Light_Microscope_with_Spectroscopic_Reflectometer | Filmetrics - Model F40]][[Electrical_Probing_Station | Electrical Probe Station - Cascade Microtech M150]][[Dektak_3ST:_Profilometer | Profilometer - Veeco Dektak 3ST]]
}}
{{EmailListTableItem
|EmailListName = nanoscribe
|InstrumentName = [[Nanoscribe PPGT: Microscale 3D Printer | Microscale 3D Printer - Nanoscribe PPGT]]
}}
{{EmailListTableItem
|EmailListName = orion
|InstrumentName = [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga FIB - Zeiss Orion NanoFab]]
}}
{{EmailListTableItem
|EmailListName = oxfordicp
|InstrumentName = [[ICP-RIE: III-V, Metal & Silicon Etcher | III-V Etcher]][[DRIE: Bosch & Cryo ICP-RIE for Silicon | DRIE Etcher]][[ICP-RIE: Dielectric Etcher | Dielectric Etcher]]
}}
{{EmailListTableItem
|EmailListName = oxfordpecvd
|InstrumentName = [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | PECVD]]
}}
{{EmailListTableItem
|EmailListName = parylene
|InstrumentName = [[Parylene Coater]]
}}
{{EmailListTableItem
|EmailListName = photolith
|InstrumentName = [[Contact_Mask_Aligners:_MA6_%26_MA6/BA6 | Contact Mask Aligners - Suss MicroTec]]Resist Spinners in Solvent HoodHot Plates in Solvent HoodBase/Caustic Develop BenchConvection OvenVacuum OvenOptical Microscope w/ cameraOptical Litho ProcessingNanoimprint - NIL Technology
}}
{{EmailListTableItem
|EmailListName = plasmatherm
|InstrumentName = [[Dual Chamber RIE: Silicon, III-V Material & Organics Etcher | Dual Chamber RIE]]
}}
{{EmailListTableItem
|EmailListName = rta
|InstrumentName = [[Rapid Thermal Processor]]
}}
{{EmailListTableItem
|EmailListName = sb6l
|InstrumentName = [[Wafer Bonder | Wafer Bonder - Suss MicroTec SBL6]]
}}
{{EmailListTableItem
|EmailListName = scriber
|InstrumentName = [[Scriber-Breaker | Scriber-Breaker - Dynatex GST-150]]
}}
{{EmailListTableItem
|EmailListName = sem-fib
|InstrumentName = [][[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600 NanoLab SEM/Ga-FIB/Omniprobe]][[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab SEM/EDS/WDS]][[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F SEM/ESEM/Probe Station]][[Sirion: SEM & EDS | Sirion SEM/EDS]][[Carbon Evaporator]] [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | O2/Ar Plasma Cleaner]]
}}
{{EmailListTableItem
|EmailListName = sputter
|InstrumentName = [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System]][[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System]]
}}
{{EmailListTableItem
|EmailListName = stepper
|InstrumentName = [[Wafer Stepper | Wafer Stepper - GCA 6300]]
}}
{{EmailListTableItem
|EmailListName = tf20
|InstrumentName = [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20 TEM/STEM]]
}}
{{EmailListTableItem
|EmailListName = tf30
|InstrumentName = [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF |Tecnai TF-30 TEM/STEM]]
}}
{{EmailListTableItem
|EmailListName = tystar
|InstrumentName = [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces 1 & 2]]
}}
{{EmailListTableItem
|EmailListName = wirebonder
|InstrumentName = [[Wedge-Wedge_Wire_Bonder | Wire Bonder - WestBond Model: 7476D-79]]
}}
{{EmailListTableItem
|EmailListName = xef2
|InstrumentName = [[XeF2 Etcher for Silicon | XeF2 Etcher for Si]]
}}
|}

Email Lists

2021-11-04T18:26:32Z

Awolff:

{| class="wikitable" style="width: 85%;"
|''For any instrument that you use, it is required that you belong to that instrument's email list so that you can receive updates from staff and other users about its status and any new developments related to it. See the email lists below and sign up for the appropriate ones via the subscription links.''
|}

{| class="wikitable" style="width: 85%;"
|-
!scope="col" style="text-align:left;"| Name
!scope="col" style="text-align:left;"| mailto: Address
!scope="col" style="text-align:left;"| Instrument(s)
!scope="col" style="text-align:left;"| Subscription Link
|-
{{EmailListTableItem
|EmailListName = afm
|InstrumentName = [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon AFM]]
}}
{{EmailListTableItem
|EmailListName = ald
|InstrumentName = [[FlexAL II: Atomic Layer Deposition (ALD) | Flex-AL ALD]]
}}
{{EmailListTableItem
|EmailListName = cha
|InstrumentName = [[CHA: Electron Beam Evaporator | CHA Electron Beam Evaporator]]
}}
{{EmailListTableItem
|EmailListName = chemistry
|InstrumentName = [[Wet Chemistry | Wet Chemistry Equipment and Processes]]
}}
{{EmailListTableItem
|EmailListName = cpd
|InstrumentName = [[Critical Point Dryer | Critical Point Dryer - Tousimis 915B]]
}}
{{EmailListTableItem
|EmailListName = dwl66
|InstrumentName = [[DWL-66: Direct-Write Laser System | Direct-Write Laser System - Heidelberg Instruments DWL-66]]
}}
{{EmailListTableItem
|EmailListName = ebpg
|InstrumentName = [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+ E-Beam Lithography]][[EBPG 5200: 100 kV Electron Beam Lithography | EBPG 5200 E-Beam Lithography]]
}}
{{EmailListTableItem
|EmailListName = labline
|InstrumentName = [[Labline: Electron Beam Evaporator | Labline Electron Beam Evaporator]]
}}
{{EmailListTableItem
|EmailListName = metrology
|InstrumentName = [[Spectroscopic Ellipsometer | Ellipsometer - Woolam M-2000]][[Light_Microscope_with_Spectroscopic_Reflectometer | Filmetrics - Model F40]][[Electrical_Probing_Station | Electrical Probe Station - Cascade Microtech M150]][[Dektak_3ST:_Profilometer | Profilometer - Veeco Dektak 3ST]]
}}
{{EmailListTableItem
|EmailListName = nanoscribe
|InstrumentName = [[Nanoscribe PPGT: Microscale 3D Printer | Microscale 3D Printer - Nanoscribe PPGT]]
}}
{{EmailListTableItem
|EmailListName = orion
|InstrumentName = [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga FIB - Zeiss Orion NanoFab]]
}}
{{EmailListTableItem
|EmailListName = oxfordicp
|InstrumentName = [[ICP-RIE: III-V, Metal & Silicon Etcher | III-V Etcher]][[DRIE: Bosch & Cryo ICP-RIE for Silicon | DRIE Etcher]][[ICP-RIE: Dielectric Etcher | Dielectric Etcher]]
}}
{{EmailListTableItem
|EmailListName = oxfordpecvd
|InstrumentName = [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | PECVD]]
}}
{{EmailListTableItem
|EmailListName = parylene
|InstrumentName = [[Parylene Coater]]
}}
{{EmailListTableItem
|EmailListName = photolith
|InstrumentName = [[Contact_Mask_Aligners:_MA6_%26_MA6/BA6 | Contact Mask Aligners - Suss MicroTec]]Resist Spinners in Solvent HoodHot Plates in Solvent HoodBase/Caustic Develop BenchConvection OvenVacuum OvenOptical Microscope w/ cameraOptical Litho ProcessingNanoimprint - NIL Technology
}}
{{EmailListTableItem
|EmailListName = plasmatherm
|InstrumentName = [[Dual Chamber RIE: Silicon, III-V Material & Organics Etcher | Dual Chamber RIE]]
}}
{{EmailListTableItem
|EmailListName = rta
|InstrumentName = [[Rapid Thermal Processor]]
}}
{{EmailListTableItem
|EmailListName = sb6l
|InstrumentName = [[Wafer Bonder | Wafer Bonder - Suss MicroTec SBL6]]
}}
{{EmailListTableItem
|EmailListName = scriber
|InstrumentName = [[Scriber-Breaker | Scriber-Breaker - Dynatex GST-150]]
}}
{{EmailListTableItem
|EmailListName = sem-fib
|InstrumentName = [[]][[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600 NanoLab SEM/Ga-FIB/Omniprobe]][[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab SEM/EDS/WDS]][[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F SEM/ESEM/Probe Station]][[Sirion: SEM & EDS | Sirion SEM/EDS]][[Carbon Evaporator]] [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | O2/Ar Plasma Cleaner]]
}}
{{EmailListTableItem
|EmailListName = sputter
|InstrumentName = [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System]][[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System]]
}}
{{EmailListTableItem
|EmailListName = stepper
|InstrumentName = [[Wafer Stepper | Wafer Stepper - GCA 6300]]
}}
{{EmailListTableItem
|EmailListName = tf20
|InstrumentName = [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20 TEM/STEM]]
}}
{{EmailListTableItem
|EmailListName = tf30
|InstrumentName = [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF |Tecnai TF-30 TEM/STEM]]
}}
{{EmailListTableItem
|EmailListName = tystar
|InstrumentName = [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces 1 & 2]]
}}
{{EmailListTableItem
|EmailListName = wirebonder
|InstrumentName = [[Wedge-Wedge_Wire_Bonder | Wire Bonder - WestBond Model: 7476D-79]]
}}
{{EmailListTableItem
|EmailListName = xef2
|InstrumentName = [[XeF2 Etcher for Silicon | XeF2 Etcher for Si]]
}}
|}

Email Lists

2021-11-04T18:25:57Z

Awolff:

{| class="wikitable" style="width: 85%;"
|''For any instrument that you use, it is required that you belong to that instrument's email list so that you can receive updates from staff and other users about its status and any new developments related to it. See the email lists below and sign up for the appropriate ones via the subscription links.''
|}

{| class="wikitable" style="width: 85%;"
|-
!scope="col" style="text-align:left;"| Name
!scope="col" style="text-align:left;"| mailto: Address
!scope="col" style="text-align:left;"| Instrument(s)
!scope="col" style="text-align:left;"| Subscription Link
|-
{{EmailListTableItem
|EmailListName = afm
|InstrumentName = [[Dimension Icon: Atomic Force Microscope (AFM) | Dimension Icon AFM]]
}}
{{EmailListTableItem
|EmailListName = ald
|InstrumentName = [[FlexAL II: Atomic Layer Deposition (ALD) | Flex-AL ALD]]
}}
{{EmailListTableItem
|EmailListName = cha
|InstrumentName = [[CHA: Electron Beam Evaporator | CHA Electron Beam Evaporator]]
}}
{{EmailListTableItem
|EmailListName = chemistry
|InstrumentName = [[Wet Chemistry | Wet Chemistry Equipment and Processes]]
}}
{{EmailListTableItem
|EmailListName = cpd
|InstrumentName = [[Critical Point Dryer | Critical Point Dryer - Tousimis 915B]]
}}
{{EmailListTableItem
|EmailListName = dwl66
|InstrumentName = [[DWL-66: Direct-Write Laser System | Direct-Write Laser System - Heidelberg Instruments DWL-66]]
}}
{{EmailListTableItem
|EmailListName = ebpg
|InstrumentName = [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+ E-Beam Lithography]][[EBPG 5200: 100 kV Electron Beam Lithography | EBPG 5200 E-Beam Lithography]]
}}
{{EmailListTableItem
|EmailListName = labline
|InstrumentName = [[Labline: Electron Beam Evaporator | Labline Electron Beam Evaporator]]
}}
{{EmailListTableItem
|EmailListName = metrology
|InstrumentName = [[Spectroscopic Ellipsometer | Ellipsometer - Woolam M-2000]][[Light_Microscope_with_Spectroscopic_Reflectometer | Filmetrics - Model F40]][[Electrical_Probing_Station | Electrical Probe Station - Cascade Microtech M150]][[Dektak_3ST:_Profilometer | Profilometer - Veeco Dektak 3ST]]
}}
{{EmailListTableItem
|EmailListName = nanoscribe
|InstrumentName = [[Nanoscribe PPGT: Microscale 3D Printer | Microscale 3D Printer - Nanoscribe PPGT]]
}}
{{EmailListTableItem
|EmailListName = orion
|InstrumentName = [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga FIB - Zeiss Orion NanoFab]]
}}
{{EmailListTableItem
|EmailListName = oxfordicp
|InstrumentName = [[ICP-RIE: III-V, Metal & Silicon Etcher | III-V Etcher]][[DRIE: Bosch & Cryo ICP-RIE for Silicon | DRIE Etcher]][[ICP-RIE: Dielectric Etcher | Dielectric Etcher]]
}}
{{EmailListTableItem
|EmailListName = oxfordpecvd
|InstrumentName = [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | PECVD]]
}}
{{EmailListTableItem
|EmailListName = parylene
|InstrumentName = [[Parylene Coater]]
}}
{{EmailListTableItem
|EmailListName = photolith
|InstrumentName = [[Contact_Mask_Aligners:_MA6_%26_MA6/BA6 | Contact Mask Aligners - Suss MicroTec]]Resist Spinners in Solvent HoodHot Plates in Solvent HoodBase/Caustic Develop BenchConvection OvenVacuum OvenOptical Microscope w/ cameraOptical Litho ProcessingNanoimprint - NIL Technology
}}
{{EmailListTableItem
|EmailListName = plasmatherm
|InstrumentName = [[Dual Chamber RIE: Silicon, III-V Material & Organics Etcher | Dual Chamber RIE]]
}}
{{EmailListTableItem
|EmailListName = rta
|InstrumentName = [[Rapid Thermal Processor]]
}}
{{EmailListTableItem
|EmailListName = sb6l
|InstrumentName = [[Wafer Bonder | Wafer Bonder - Suss MicroTec SBL6]]
}}
{{EmailListTableItem
|EmailListName = scriber
|InstrumentName = [[Scriber-Breaker | Scriber-Breaker - Dynatex GST-150]]
}}
{{EmailListTableItem
|EmailListName = sem-fib
|InstrumentName = [Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600 NanoLab SEM/Ga-FIB/Omniprobe]][[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 NanoLab SEM/EDS/WDS]][[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F SEM/ESEM/Probe Station]][[Sirion: SEM & EDS | Sirion SEM/EDS]][[Carbon Evaporator]] [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | O2/Ar Plasma Cleaner]]
}}
{{EmailListTableItem
|EmailListName = sputter
|InstrumentName = [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System]][[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System]]
}}
{{EmailListTableItem
|EmailListName = stepper
|InstrumentName = [[Wafer Stepper | Wafer Stepper - GCA 6300]]
}}
{{EmailListTableItem
|EmailListName = tf20
|InstrumentName = [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20 TEM/STEM]]
}}
{{EmailListTableItem
|EmailListName = tf30
|InstrumentName = [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF |Tecnai TF-30 TEM/STEM]]
}}
{{EmailListTableItem
|EmailListName = tystar
|InstrumentName = [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces 1 & 2]]
}}
{{EmailListTableItem
|EmailListName = wirebonder
|InstrumentName = [[Wedge-Wedge_Wire_Bonder | Wire Bonder - WestBond Model: 7476D-79]]
}}
{{EmailListTableItem
|EmailListName = xef2
|InstrumentName = [[XeF2 Etcher for Silicon | XeF2 Etcher for Si]]
}}
|}